Product Overview

The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU
• Series: SDRH105R
• Type: Shielded SMD Power Inductors
• Origin: SHENZHEN, China
• Certifications: RoHS, Halogen Free, REACH Compliance
• Magnetic Circuit Design: Closed magnetic circuit

Technical Specifications

Environmental Data

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SDRH 105R [Inductance Code] [Tolerance Code] [Packing Code]

• Type: SDRH
• Series: 105R
• Inductance Code Example: 100 for 10 H, 101 for 100 H
• Tolerance Code: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing Code: T (Tape & Reel), B (Bulk Package)

Shape and Dimensions

(Dimensions are in mm)

Packaging

Tape and Reel Specifications:

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing

Terminal Strength (SMT): Pulling test based on GB/T 2423.60-2008. Force requirements vary with terminal sectional area.

Terminal Strength (DIP): Pulling test based on GB/T 2423.60-2008. Force requirements vary with terminal diameter.

Resistance to Flexure: JIS C 5321:1997. No visible mechanical damage after applying force.

Dropping Test: GB/T 2423.7-2018. Packaged products dropped from 1m height. No case deformation, short, or open circuits.

Solderability: GB/T 2423.28-2005. Wetting shall exceed 75% coverage; terminals must have 95% minimum solder coverage.

Vibration Test: GB/T 2423.10-2019. Subjected to simple harmonic motion. Inductance change within 10%, Q factor change within 20%.

Thermal Shock Test: GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

Low Temperature Storage Test: GB/T 2423.1-2008 Method Ab. Stored at -402 for 962 hours. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

High Temperature Storage Test: GB/T 2423.2-2008 Method Bb. Stored at 852 for 962 hours. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

Damp Heat (Steady States) Test: GB/T 2423.3-2016. Tested at 602 and 90%-95% RH for 962 hours. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%.

Heat Endurance of Reflow Soldering: GJB 360B-2009. Tested twice with peak temperature 260+0/-5. L/L 10% (Mn-Zn: 30%), Q/Q 30%, DCR/DCR 10%.

Resistance to Solvent Test: IEC 68-2-45:1993. No case deformation or appearance change after dipping in IPA solvent and brushing.

Overload Test: JIS C5311-6.13. Applied twice the rated current for 5 minutes. No smoke, peculiar smell, or fire.

Voltage Resistance Test: MIL-STD-202G Method 301. DC1000V, 1mA for 1 min. No breakdown.

Recommended Reflow Soldering Curve

Refer to the graph for recommended reflow conditions. Adjust based on specific user equipment and process conditions.

Reminders for Using These Products

• Storage: Within 12 months, at 5~40C and 35~65% RH.
• Environment: Avoid gas corrosive environments (salt, acid, alkali).
• Handling: Avoid direct contact with terminals to prevent soldering issues. Handle carefully to prevent damage.
• Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
• Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Keep away from magnets or magnetic objects.
• Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Perform after mounting within specified conditions to avoid performance degradation or reduced lifespan.
• Thermal Design: Account for self-heating when power is on.
• Non-Magnetic Shield Type: Careful coil placement on the PCB is required to prevent malfunction due to magnetic interference.