Product Overview

The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors designed for high performance and reliability. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient components are ideal for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SNR8040
• Construction: Magnetic Resin Shielded SMD
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Environmental Data

Recommended Land Pattern

Packaging

Reliability Testing

Various reliability tests are performed, including Terminal Strength (SMT and DIP), Resistance to Flexure, Dropping Test, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original documentation.

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided, with a note that users should adjust and confirm these conditions based on their specific environment and equipment.

Reminders for Using These Products

• Storage period is within 12 months under conditions of 5~40C and 35-65% RH.
• Avoid use and storage in corrosive gas environments.
• Do not touch electrodes directly with bare hands to prevent soldering issues.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Keep products away from magnets or magnetic fields.
• Preheat components before soldering, ensuring a temperature difference of no more than 150C between solder and chip temperature.
• Soldering corrections after mounting should adhere to specified conditions to avoid overheating.
• Account for self-heating when designing for thermal management.