Product Overview
The T-core molding Structure Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation and offer a thin profile with low DC resistance and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors provide high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, such as DC/DC converters for notebook CPUs, mobile phones, tablets, servers, and base stations.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN
- Certifications: RoHS, Halogen Free, REACH Compliance
- Structure Type: T-core molding Structure
- Shielding: Magnetic shielding
Technical Specifications
| Part Number | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max | Dimensions (LWH mm) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|---|---|
| STC303020-1R0M | 1.0 | 20% | 14 | 20 | 8.0 | 7.3 | 6.5 | 6.0 | 3.03.02.0 | -40 to +125 |
| STC303020-1R5M | 1.5 | 20% | 19 | 25 | 7.0 | 6.5 | 6.3 | 5.8 | 3.03.02.0 | -40 to +125 |
| STC201612-2R2M | 2.2 | 20% | 37 | 45 | 6.0 | 5.5 | 4.7 | 4.3 | 2.01.61.2 | -40 to +125 |
| STC201612-3R3M | 3.3 | 20% | 52 | 63 | 5.9 | 5.4 | 4.5 | 4.0 | 2.01.61.2 | -40 to +125 |
| STC201612-4R7M | 4.7 | 20% | 60 | 73 | 4.8 | 4.0 | 4.2 | 3.8 | 2.01.61.2 | -40 to +125 |
| STC201612-6R8M | 6.8 | 20% | 107 | 135 | 4.5 | 3.8 | 3.2 | 3.0 | 2.01.61.2 | -40 to +125 |
| STC201612-100M | 10 | 20% | 135 | 160 | 3.8 | 3.3 | 2.5 | 2.2 | 2.01.61.2 | -40 to +125 |
Note on Current Ratings:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
- Part temperature should be verified in the end application as circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect part temperature.
Dimensions (STC303020):
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | H (mm) |
|---|---|---|---|---|---|---|---|
| STC303020 | 3.00.1 | 3.00.1 | 2.0Max | 1.00.2 | 3.0Typ | 0.8Typ | 3.0Typ |
2410121647_LanTu-Micro-STC303020-6R8MT_C22468844.pdf
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