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Specifications
Current - Saturation (Isat):
3.2A
Mfr. Part #:
SDRS1275-330NT
Package:
SMD,12.5x12.5mm
Key Attributes
Model Number:
SDRS1275-330NT
Product Description
Product Overview
The SDRS1275 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DC resistance. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for thin-screen TVs, LCDs, AV equipment, gaming devices, and DC/DC converters, these inductors operate efficiently within a wide temperature range.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRS1275
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRS1275-1R2N | 1.2 | 30% | 1KHz | 0.006 | 13.00 | 8.20 |
| SDRS1275-2R7N | 2.7 | 30% | 1KHz | 0.009 | 10.00 | 7.00 |
| SDRS1275-3R9N | 3.9 | 30% | 1KHz | 0.010 | 9.00 | 6.70 |
| SDRS1275-5R6N | 5.6 | 30% | 1KHz | 0.011 | 7.80 | 6.30 |
| SDRS1275-6R8N | 6.8 | 30% | 1KHz | 0.013 | 7.20 | 5.90 |
| SDRS1275-100N | 10 | 30% | 1KHz | 0.015 | 5.50 | 5.40 |
| SDRS1275-150N | 15 | 30% | 1KHz | 0.018 | 4.70 | 5.00 |
| SDRS1275-220N | 22 | 30% | 1KHz | 0.026 | 4.00 | 4.00 |
| SDRS1275-330N | 33 | 30% | 1KHz | 0.039 | 3.20 | 3.40 |
| SDRS1275-470N | 47 | 30% | 1KHz | 0.052 | 2.70 | 3.00 |
| SDRS1275-680N | 68 | 30% | 1KHz | 0.077 | 2.00 | 2.40 |
| SDRS1275-101N | 100 | 30% | 1KHz | 0.125 | 1.90 | 1.90 |
| SDRS1275-151N | 150 | 30% | 1KHz | 0.175 | 1.50 | 1.60 |
| SDRS1275-221M | 220 | 20% | 1KHz | 0.258 | 1.30 | 1.30 |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Dimensions (mm):
| Part No. | A (L) | B (W) | C (H) | D | E | H | I | J |
|---|---|---|---|---|---|---|---|---|
| SDRS1275 | 12.50.3 | 12.50.3 | 7.50.35 | 8.6 | 3.2 | 3.2 | 2.5 | 8.6 |
Product Identification Example: SDRS 1275 100 N T
- Type: SDRS (Shielded SMD Power Inductors)
- External Dimensions (LWH) (mm): 1275 (12.512.57.5)
- Inductance: 100 (10 H)
- Inductance Tolerance: N (30%) (Other options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%)
- Packing: T (Tape & Reel) (Other option: B - Bulk Package)
Packaging:
- Tape and Reel Specifications: W=24mm, P=16mm, W1=11.5mm
- Reel Dimensions: A=24.4mm, B=60mm, C=13mm, D=330mm
- Packing Quantity: Reel (PCS): 500, Inside Box (PCS): 1000, Outside Carton (PCS): 4000
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Refer to GB/T 2423.60-2008 | Pulling test based on terminal cross-sectional area; Solder paste thickness: 0.12mm; Meet requirements without loose terminal. |
| Terminal Strength (DIP) | Refer to GB/T 2423.60-2008 | Pull Force based on terminal diameter (0.35mm to >1.25mm); Duration: 10sec; Meet requirements without loose terminal. |
| Resistance to Flexure | JIS C 5321:1997 | No visible mechanical damage; Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping | GB/T 2423.7-2018 | No case deformation or change in appearance; No short and no open; Drop from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | GB/T 2423.28-2005 | No visible mechanical damage; Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage; Solder temperature: 2402; Duration: 3 sec. |
| Vibration | GB/T 2423.10-2019 | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%; Amplitude: 1.5mm; Frequency: 10-55 Hz; Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | GB/T 2423.22-2012 Method Na | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; 100 cycles of temperature transitions between (-55~-40) and (85~125). |
| Low temperature Storage | GB/T 2423.1-2008 Method Ab | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | GB/T 2423.2-2008 Method Bb | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; Temperature: 85~1252; Duration: 962 hours. |
| Damp Heat (Steady States) | GB/T 2423.3-2016 | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%; Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | GJB 360B-2009 | No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10%; Peak temperature: 260+0/-5. |
| Resistance to solvent test | IEC 68-2-45:1993 | No case deformation or change in appearance or obliteration of marking; Dip into IPA solvent for 50.5Min, drying for 5Min, brushing 10 times. |
| Overload test | JIS C5311-6.13 | No smoke, peculiar smell, or fire; Characteristics normal after test; Apply twice rated current for 5 minutes. |
| Voltage resistance test | MIL-STD-202G Method 301 | No breakdown during test; Characteristics normal after test; DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (5~40C, 35~65% RH). Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle products carefully to prevent damage.
- Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON.
- Non-Magnetic Shield Type: Careful layout is required on the circuit board to prevent malfunctions due to magnetic interference.
2410121625_LanTu-Micro-SDRS1275-330NT_C19267796.pdf
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