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Quality Compact and LanTu Micro SCD1054-330MT unshielded smd power inductors for various power supply applications factory
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Quality Compact and LanTu Micro SCD1054-330MT unshielded smd power inductors for various power supply applications factory
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Specifications
Current - Saturation (Isat):
2.1A
Mfr. Part #:
SCD1054-330MT
Package:
SMD,10x9mm
Key Attributes
Model Number: SCD1054-330MT
Product Description

Unshielded SMD Power Inductors - SCD1054 Series

Product Overview

The SCD1054 Series Unshielded SMD Power Inductors are designed for surface mounting and offer a low-cost solution with excellent performance. These inductors feature a small size capable of handling high rated currents and boast a low DC resistance. They are suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series is compliant with RoHS, Halogen Free, and REACH standards, ensuring environmental responsibility.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SCD1054
  • Type: Unshielded SMD Power Inductor
  • Design: Silver plated type, Low cost design
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Bulk Package, Tape & Reel

Technical Specifications

Part No. Inductance (H) Tolerance Test Frequency (kHz) SRF Min (MHz) DCR Typ () Saturation Current Max (A) Temperature Rise Current Max (A)
SCD1054-100M 10 M (20%) 100 120 0.06 4.00 2.60
SCD1054-120M 12 M (20%) 100 100 0.07 3.50 2.45
SCD1054-150M 15 M (20%) 100 95 0.08 3.00 2.27
SCD1054-180M 18 M (20%) 100 85 0.09 2.90 2.15
SCD1054-220M 22 M (20%) 100 75 0.10 2.55 1.95
SCD1054-270M 27 M (20%) 100 62 0.11 2.20 1.76
SCD1054-330M 33 M (20%) 100 53 0.12 2.10 1.50
SCD1054-390M 39 M (20%) 100 47 0.14 2.00 1.37
SCD1054-470M 47 M (20%) 100 41 0.17 1.95 1.28
SCD1054-560M 56 M (20%) 100 38 0.19 1.70 1.17
SCD1054-680M 68 M (20%) 100 33 0.22 1.50 1.11
SCD1054-820M 82 M (20%) 100 31 0.25 0.35 1.00
SCD1054-101M 100 M (20%) 100 27 0.35 1.20 0.97
SCD1054-121M 120 M (20%) 100 23 0.40 1.15 0.89
SCD1054-151M 150 M (20%) 100 21 0.47 1.05 0.78
SCD1054-181M 180 M (20%) 100 19 0.63 0.88 0.72
SCD1054-221M 220 M (20%) 100 17 0.73 0.85 0.66
SCD1054-271M 270 M (20%) 100 15 0.97 0.80 0.57
SCD1054-331M 330 M (20%) 100 14 1.15 0.75 0.52
SCD1054-391M 390 M (20%) 100 12 1.30 0.65 0.48
SCD1054-471M 470 M (20%) 100 11 1.48 0.56 0.42
SCD1054-561M 560 M (20%) 100 10 1.90 0.52 0.33
SCD1054-681M 680 M (20%) 100 9.3 2.25 0.48 0.28
SCD1054-821M 820 M (20%) 100 8.4 2.55 0.44 0.24
SCD1054-102M 1000 M (20%) 100 7 3.10 0.40 0.20

Dimensions (mm)

Part No. A B C D H I J
SCD1054 10.00.3 9.00.3 5.40.5 2.1 9.5 3.75 2.5

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment Used

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
  • Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Packaging Information

Packing Type Description
Bulk Package (Bulk)
Tape & Reel (Tape & Reel)

Recommended Land Pattern

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Recommended Reflow Soldering Curve

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Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35-65% RH.
  • Environment: Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to oils; handle with care to prevent damage.
  • Bending: Do not excessively bend terminals to prevent wire fracture.
  • Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions; overheating can cause issues.
  • Thermal Design: Account for self-heating when power is on.
  • Layout: For non-magnetic shield types, careful coil placement on the PCB is required to prevent malfunction due to magnetic interference.

2410121442_LanTu-Micro-SCD1054-330MT_C5127312.pdf

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