Shielded SMD Power Inductors - SDRI74 Series

Product Overview
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage, these inductors offer high saturation current and low DCR. Their high-precision dimensions ensure compatibility with automatic mounting processes. Available in various package sizes and a wide inductance range, they are RoHS, Halogen Free, and REACH compliant, making them suitable for demanding applications in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO
• Origin: SHENZHEN, CHINA
• Series: SDRI74
• Certifications: RoHS, Halogen Free, REACH Compliance
• Magnetic Circuit: Closed Magnetic Circuit
• Mounting Type: SMD (Surface Mount Device)
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Characteristics:

Product Identification Code:

External Dimensions (LWH): 7.57.54.5 mm

Electrical Characteristics:

Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
- Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Specifications:

Cover Tape Peel Off Condition:
a) Cover tape peel force shall be 10 to 120g.
b) Noodle strip peeling angle: 165 to 180.

Recommended Reflow Soldering Curve:
(Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific equipment and process conditions.)

Reminders for Using These Products:

• Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
• Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands due to oil secretions which may inhibit soldering.
• Handle products carefully to prevent damage from dropping or inappropriate removal.
• Do not bend terminals with excessive stress to avoid wire fracture.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid overheating, short circuits, performance deterioration, or lifespan shortening.
• Allow sufficient thermal design margin for self-heating when power is ON.
• For non-magnetic shield types, careful coil layout is required on the circuit board to prevent malfunctions due to magnetic interference.