Molding SMD Power Inductors - SMS1050 Series
Product Overview: The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series are ultra-high current, thin-profile SMD power inductors designed for high-density installation. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability through an integral construction that provides excellent vibration resistance. Their composite structure minimizes buzz noise, while the use of low-loss alloy powder in die-casting results in low impedance, small parasitic capacitance, high efficiency, and reduced eddy-current loss. These inductors support frequencies up to 3MHz and are RoHS, Halogen Free, and REACH compliant.
Applications: Ideal for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1050
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) | Absolute Maximum Voltage (VDC) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|
| SMS1050-R82M | 0.82 | 20% | 2.5 | 39.00 | 22.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-1R0M | 1.0 | 20% | 2.8 | 30.00 | 20.30 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-1R2M | 1.2 | 20% | 2.8 | 28.00 | 18.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-1R5M | 1.5 | 20% | 3.9 | 25.00 | 16.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-2R2M | 2.2 | 20% | 6.5 | 20.00 | 13.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-3R3M | 3.3 | 20% | 9.2 | 18.00 | 10.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-4R7M | 4.7 | 20% | 12.4 | 14.00 | 9.50 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-5R6M | 5.6 | 20% | 18.9 | 13.00 | 8.50 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-6R8M | 6.8 | 20% | 20.6 | 12.00 | 8.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-8R2M | 8.2 | 20% | 27.4 | 10.00 | 7.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-100M | 10 | 20% | 30.2 | 8.50 | 5.50 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-150M | 15 | 20% | 48.0 | 7.00 | 4.50 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-220M | 22 | 20% | 60.0 | 5.50 | 4.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-330M | 33 | 20% | 89.0 | 5.50 | 3.50 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-470M | 47 | 20% | 110.0 | 4.50 | 3.00 | 11.510.05.0 | 30 | -55 to +125 |
| SMS1050-680M | 68 | 20% | 190.0 | 3.00 | 2.00 | 11.510.05.0 | 30 | -55 to +125 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packaging: Bulk Package (B), Tape & Reel (T)
Shape and Dimensions (mm):
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1050 | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Note: Part temperature should be verified in the end application due to influence from circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.
Recommended reflow soldering curve: The provided curve is a recommendation and may require adjustment based on user's environment and equipment.
Reminders for Using These Products:
- Storage period is within 12 months under conditions: 5~40C, 35~65% RH.
- Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Do not touch electrodes directly with bare hands to prevent solderability issues.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Sufficient thermal design margin is required due to self-heating when power is on.
- For non-magnetic shield types, careful coil layout is needed to prevent malfunctions due to magnetic interference.
2410121647_LanTu-Micro-SMS1050-3R3MT_C5127458.pdf
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