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Specifications
Current - Saturation (Isat):
5.6A
Mfr. Part #:
SDRH104R-100MT
Package:
SMD,10.5x10.3mm
Key Attributes
Model Number:
SDRH104R-100MT
Product Description
Product Overview
The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. These inductors feature a high saturation current, low DCR, and a closed magnetic circuit design to minimize leakage. Their highly accurate dimensions ensure suitability for automatic mounting. Available in various package sizes and a wide inductance range, these inductors comply with RoHS, Halogen Free, and REACH standards. They are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRH104R
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coil self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
SDRH 104R 100 N T
- Type: SDRH (Shielded SMD Power Inductors)
- Outer Dimensions (LWH): 10.310.34.0 mm
- Inductance: e.g., 10 uH
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: T (Tape & Reel), B (Bulk Package)
Electrical Characteristics:
| Part No | Inductance (H) | Tolerance | Test Freq | DCR () Max @0A | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRH104R-1R5N | 1.5 | 30% | 100KHz | 0.008 | 12.50 | 8.50 |
| SDRH104R-2R2N | 2.2 | 30% | 100KHz | 0.011 | 9.90 | 7.70 |
| SDRH104R-3R3N | 3.3 | 30% | 100KHz | 0.014 | 8.80 | 7.40 |
| SDRH104R-3R8N | 3.8 | 30% | 100KHz | 0.018 | 8.80 | 7.40 |
| SDRH104R-4R7N | 4.7 | 30% | 100KHz | 0.022 | 7.00 | 6.00 |
| SDRH104R-5R2N | 5.2 | 30% | 1 | 0.022 | 7.00 | 6.00 |
| SDRH104R-6R8N | 6.8 | 30% | 100KHz | 0.027 | 6.60 | 5.30 |
| SDRH104R-8R2N | 8.2 | 30% | 100KHz | 0.030 | 6.00 | 4.80 |
| SDRH104R-100N | 10 | 30% | 100KHz | 0.035 | 5.60 | 4.50 |
| SDRH104R-150N | 15 | 30% | 100KHz | 0.050 | 4.40 | 3.70 |
| SDRH104R-220M | 22 | 20% | 100KHz | 0.073 | 3.60 | 2.80 |
| SDRH104R-330M | 33 | 20% | 100KHz | 0.093 | 2.90 | 2.60 |
| SDRH104R-470M | 47 | 20% | 100KHz | 0.128 | 2.44 | 2.30 |
| SDRH104R-560M | 56 | 20% | 100KHz | 0.185 | 2.18 | 1.75 |
| SDRH104R-680M | 68 | 20% | 100KHz | 0.213 | 2.08 | 1.68 |
| SDRH104R-820M | 82 | 20% | 100KHz | 0.275 | 1.88 | 1.48 |
| SDRH104R-101M | 100 | 20% | 100KHz | 0.304 | 1.66 | 1.42 |
| SDRH104R-151M | 150 | 20% | 100KHz | 0.506 | 1.40 | 1.15 |
| SDRH104R-221M | 220 | 20% | 100KHz | 0.756 | 1.19 | 0.88 |
| SDRH104R-331M | 330 | 20% | 100KHz | 1.090 | 0.92 | 0.66 |
| SDRH104R-471M | 470 | 20% | 100KHz | 1.476 | 0.65 | 0.59 |
| SDRH104R-681M | 680 | 20% | 100KHz | 2.100 | 0.54 | 0.50 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Shape and Dimensions (mm):
| Part No | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH104R | 10.3 | 10.5 | 4.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
Recommended Land Pattern:
(Image/Diagram of land pattern would typically be here, but cannot be generated from text alone)
Packaging:
| Part No. | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel Dimensions A (mm) | B (mm) | C (mm) | D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH104R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 1000 | 2000 | 8000 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified requirements without any loose terminal. | Pulling test based on sectional area of terminal; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified requirements without any loose terminal. | Pull force applied gradually to the terminal and maintained for 10 seconds, based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force (2mm flexure), 0.5mm/sec speed, 30 sec keep time. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage; Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Harmonic motion 10-55 Hz, 1.5mm amplitude, 1 min cycle, 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | 100 cycles of temperature transitions between specified high and low temperatures. Max 20 sec transforming interval. |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10%. | Refer to recommended reflow curve, twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire; Characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown; Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils). |
Recommended Reflow Soldering Curve:
(A graph illustrating the recommended reflow soldering profile would be included here. The text provides guidance on adjusting conditions based on user equipment.)
Reminders for Using These Products:
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating (temperature increase) when power is ON. Ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully consider coil placement in PCB design to prevent malfunctions due to magnetic interference.
2410121442_LanTu-Micro-SDRH104R-100MT_C5127272.pdf
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