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Quality High Precision LanTu Micro SDRI125-681MT Shielded SMD Power Inductors for DC DC Converters and Power Supplies factory
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Quality High Precision LanTu Micro SDRI125-681MT Shielded SMD Power Inductors for DC DC Converters and Power Supplies factory
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Specifications
Current - Saturation (Isat):
700mA
Mfr. Part #:
SDRI125-681MT
Package:
SMD,12.5x12.5mm
Key Attributes
Model Number: SDRI125-681MT
Product Description

Shielded SMD Power Inductors - SDRI125 Series

Product Overview

The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for DC/DC converters and power supplies in VTRs, LCD televisions, notebook PCs, and portable communication equipment.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SDRI125
  • Type: Shielded SMD Power Inductors
  • Magnetic Circuit Design: Closed magnetic circuit
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Mounting Type: SMD (Surface Mount Device)
  • Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications:

Item Specification
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance) HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current) HP4284+42841A or equivalent
Test Equipment (Q Factor) HP4285A or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Product Identification:

Component Description
Type SDRI (Shielded SMD Power Inductors)
Size 125 (12.312.36.0 mm)
Inductance e.g., 470 (47 H)
Inductance Tolerance J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing B: Bulk Package, T: Tape & Reel

Electrical Characteristics (SDRI125 Series):

Part No. Inductance (H) @ 0A Tolerance Test Freq. (Min) Q Factor (Min) @ Test Freq. DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SDRI125-1R0N 1.0 30% 100KHz 20 @ 1MHz 0.010 15.80 8.00
SDRI125-2R2N 2.2 30% 100KHz 20 @ 1MHz 0.014 13.50 7.80
SDRI125-2R4N 2.4 30% 100KHz 20 @ 1MHz 0.014 12.00 7.50
SDRI125-3R3N 3.3 30% 100KHz 20 @ 1MHz 0.017 10.50 6.80
SDRI125-4R7N 4.7 30% 100KHz 30 @ 1MHz 0.020 9.50 5.60
SDRI125-5R8N 5.8 30% 100KHz 30 @ 1MHz 0.021 8.60 5.20
SDRI125-8R2N 8.2 30% 100KHz 30 @ 1MHz 0.023 7.00 4.40
SDRI125-100N 10 30% 100KHz 35 @ 1MHz 0.025 6.50 4.00
SDRI125-120M 12 20% 100KHz 35 @ 1MHz 0.027 6.00 3.50
SDRI125-150M 15 20% 100KHz 35 @ 1MHz 0.030 5.40 3.30
SDRI125-180M 18 20% 100KHz 35 @ 1MHz 0.034 4.90 3.00
SDRI125-220M 22 20% 100KHz 35 @ 1MHz 0.036 4.70 2.80
SDRI125-270M 27 20% 100KHz 35 @ 1MHz 0.051 4.00 2.30
SDRI125-330M 33 20% 100KHz 35 @ 1MHz 0.057 3.58 2.10
SDRI125-390M 39 20% 100KHz 35 @ 1MHz 0.068 3.30 2.00
SDRI125-470M 47 20% 100KHz 35 @ 1MHz 0.075 3.20 1.80
SDRI125-560M 56 20% 100KHz 35 @ 1MHz 0.110 2.80 1.70
SDRI125-680M 68 20% 100KHz 35 @ 1MHz 0.120 2.50 1.50
SDRI125-820M 82 20% 100KHz 35 @ 1MHz 0.140 2.30 1.40
SDRI125-101M 100 20% 100KHz 40 @ 0.796MHz 0.160 1.90 1.30
SDRI125-121M 120 20% 100KHz 40 @ 0.796MHz 0.170 1.80 1.10
SDRI125-151M 150 20% 100KHz 40 @ 0.796MHz 0.230 1.70 1.00
SDRI125-181M 180 20% 100KHz 40 @ 0.796MHz 0.290 1.60 0.90
SDRI125-221M 220 20% 100KHz 40 @ 0.796MHz 0.400 1.45 0.80
SDRI125-271M 270 20% 100KHz 40 @ 0.796MHz 0.460 1.20 0.75
SDRI125-331M 330 20% 100KHz 40 @ 0.796MHz 0.510 1.15 0.68
SDRI125-391M 390 20% 100KHz 40 @ 0.796MHz 0.690 1.10 0.65
SDRI125-471M 470 20% 100KHz 40 @ 0.796MHz 0.770 0.94 0.58
SDRI125-561M 560 20% 100KHz 40 @ 0.796MHz 0.860 0.90 0.54
SDRI125-681M 680 20% 100KHz 40 @ 0.796MHz 1.200 0.70 0.48
SDRI125-821M 820 20% 100KHz 40 @ 0.796MHz 1.340 0.55 0.40
SDRI125-102M 1000 20% 100KHz 40 @ 0.796MHz 1.530 0.44 0.35

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.
  • Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect part temperature. Part temperature should be verified in the end application.

Dimensions (mm):

Part No. A (Max) B (Max) C (Max) D E F G H
SDRI125 12.5 12.5 6.0 5.0 7.6 2.9 7.0 5.4

Recommended Land Pattern (mm):

[Image of Recommended Land Pattern would be placed here if available]

Packaging Specifications:

Item Dimension (mm) Quantity (PCS)
Tape Dimension W 24 REEL (500)
Tape Dimension P 16 Inside Box (1000)
Tape Dimension H 11.5 Outside Carton (4000)
Reel Dimension A 24.4
Reel Dimension B 100
Reel Dimension C 13
Reel Dimension D 330

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Recommended Reflow Soldering Curve:

[Image of Recommended Reflow Soldering Curve would be placed here if available]

Note: The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products:

  • Storage: Within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils by yourself. Contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Self-Heating: Allow sufficient margin for thermal design due to self-heating when power is ON.
  • Non-Magnetic Shield Type: Carefully lay out the coil for PCB design to prevent malfunctions due to magnetic interference.

2410121442_LanTu-Micro-SDRI125-681MT_C7602859.pdf

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