Product Overview
The STC201610 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density applications requiring thin profiles, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for high switching frequency applications due to extremely low DCR and ultra-low AC losses. These products comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN
- Product Type: T-core molding Structure Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| STC201610-R22M | 0.22 | 20% | 11 | 18 | 8.2 | 7.5 | 6.9 | 6.3 |
| STC201610-R47M | 0.47 | 20% | 22 | 25 | 6.3 | 5.5 | 5.5 | 5.0 |
| STC201610-1R0M | 1.0 | 20% | 35 | 43 | 4.6 | 4.2 | 4.5 | 4.1 |
| STC201610-1R5M | 1.5 | 20% | 80 | 100 | 3.2 | 2.9 | 2.6 | 2.3 |
| STC201610-2R2M | 2.2 | 20% | 120 | 130 | 3.0 | 2.8 | 2.5 | 2.1 |
| STC201610-3R3M | 3.3 | 20% | 140 | 170 | 2.3 | 2.0 | 1.7 | 1.5 |
| STC201610-4R7M | 4.7 | 20% | 190 | 220 | 2.0 | 1.8 | 1.6 | 1.4 |
| STC201610-100M | 10 | 20% | 483 | 580 | 1.4 | 1.1 | 1.0 | 0.7 |
| Part No. | Dimensions (LWH) (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (Typ) (mm) | F (Typ) (mm) | H (Typ) (mm) |
|---|---|---|---|---|---|---|---|---|
| STC201610 | 2.01.61.0 | 2.00.2 | 1.60.2 | 1.0 Max | 0.70.2 | 2.1 | 0.5 | 1.7 |
Operating Conditions
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Applications
- DC/DC converters for CPU in Notebook PCs
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Servers, base stations
- Various DC-DC conversion power modules
Product Identification
STC 201610 1R0 M T
- Type: STC (T-core molding Structure Power Inductors)
- Inductance: 1.0 uH
- External Dimensions (LWH) (mm): 201610 (2.01.61.0)
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel)
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| STC201610 | 8 | 4 | 3.5 | 8.4 | 60 | 13 | 178 | 3000 | 30,000 | 120,000 |
Reliability Testing
The product undergoes various reliability tests including Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test, with specific requirements and test methods outlined in the provided documentation.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm these conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage. Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is required.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering, with a temperature difference not exceeding 150C between solder and chip temperature.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Layout (Non-magnetic shield type): Careful coil placement is needed to prevent malfunctions due to magnetic interference.
2410121647_LanTu-Micro-STC201610-1R0MT_C22468829.pdf
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