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Specifications
Current - Saturation (Isat):
2.55A
Mfr. Part #:
SNR5020-3R3MT
Package:
SMD,5x5mm
Key Attributes
Model Number:
SNR5020-3R3MT
Product Description
Product Overview
The SNR5020 Series are magnetic resin shielded SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. These automatic assembly compatible inductors feature a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and a space-saving, power-efficient profile. These inductors are widely used in applications such as LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU (LT-)
- Origin: SHENZHEN
- Construction: Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Assembly Type: Automatic Assembly
- Magnetic Circuit: Closed
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) | Packing |
|---|---|---|---|---|---|---|---|---|
| SNR5020-R47M | 0.47 | 20% | 0.017 | 0.021 | 4.50 | 4.60 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-1R0M | 1.0 | 20% | 0.020 | 0.025 | 4.10 | 3.80 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-1R5M | 1.5 | 20% | 0.026 | 0.032 | 3.80 | 3.20 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-2R2M | 2.2 | 20% | 0.032 | 0.040 | 3.20 | 2.90 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-3R3M | 3.3 | 20% | 0.043 | 0.054 | 2.55 | 2.50 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-3R9M | 3.9 | 20% | 0.043 | 0.054 | 2.30 | 2.50 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-4R7M | 4.7 | 20% | 0.057 | 0.074 | 2.40 | 2.20 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-6R8M | 6.8 | 20% | 0.083 | 0.107 | 2.05 | 1.80 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-8R2M | 8.2 | 20% | 0.098 | 0.125 | 1.85 | 1.65 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-100M | 10 | 20% | 0.110 | 0.140 | 1.70 | 1.55 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-120M | 12 | 20% | 0.140 | 0.180 | 1.50 | 1.40 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-150M | 15 | 20% | 0.165 | 0.210 | 1.35 | 1.25 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-220M | 22 | 20% | 0.226 | 0.290 | 1.15 | 1.10 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-330M | 33 | 20% | 0.390 | 0.500 | 0.95 | 0.90 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-470M | 47 | 20% | 0.523 | 0.670 | 0.77 | 0.77 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-680M | 68 | 20% | 0.740 | 1.050 | 0.72 | 0.64 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-820M | 82 | 20% | 1.000 | 1.280 | 0.66 | 0.50 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-101M | 100 | 20% | 1.100 | 1.480 | 0.57 | 0.53 | 5.05.02.0 | Tape & Reel (T) |
| SNR5020-121M | 120 | 20% | 1.350 | 1.700 | 0.49 | 0.40 | 5.05.02.0 | Tape & Reel (T) |
| Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Packing Options: B: Bulk Package, T: Tape & Reel | ||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | ||||||||
| Dimensions (LWH): 5.05.02.0 mm | ||||||||
| Test Equipment: L: HP4284A, HP4285A LCR meter or equivalent; Isat & Irms: HP4284+42841A or equivalent; DCR: Chroma 16502 or equivalent | ||||||||
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal | Reference documents: GB/T 2423.60-2008 (SMT & DIP) |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997 |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018 |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005 |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993 |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13 |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering, with a temperature difference not exceeding 150C between solder and chip temperature.
- Soldering Corrections: Perform within specified conditions; overheating may cause issues.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Non-magnetic Shield Type: Careful layout is needed to avoid malfunctions due to magnetic interference.
2410121442_LanTu-Micro-SNR5020-3R3MT_C5127403.pdf
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