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Specifications
Current - Saturation (Isat):
1.35A
Mfr. Part #:
SNR4020-150MT
Package:
SMD,4x4mm
Key Attributes
Model Number:
SNR4020-150MT
Product Description
Product Overview
The SNR4020 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, offering large current capacity and low DC resistance. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SNR4020
- Construction: Magnetic-resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN, China
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Frequency (100KHz, 1.0V) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 |
| SNR4020-1R0M | 1.0 | 20% | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 |
| SNR4020-1R5M | 1.5 | 20% | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 |
| SNR4020-2R2M | 2.2 | 20% | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 |
| SNR4020-3R3M | 3.3 | 20% | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 |
| SNR4020-4R7M | 4.7 | 20% | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 |
| SNR4020-6R8M | 6.8 | 20% | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 |
| SNR4020-8R2M | 8.2 | 20% | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 |
| SNR4020-100M | 10 | 20% | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 |
| SNR4020-150M | 15 | 20% | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 |
| SNR4020-220M | 22 | 20% | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 |
| SNR4020-330M | 33 | 20% | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 |
| SNR4020-470M | 47 | 20% | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 |
| SNR4020-680M | 68 | 20% | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 |
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc Set top box
- Notebooks
- Desktop computers
- Servers
- Graphic cards
- Portable gaming devices
- Personal Navigation systems
- Personal multimedia devices
- Automotive systems
- Telecomm base station
- DC-DC Converter
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|
| SNR4020 | 12 | 8 | 5.5 | 12.4 | 3000 | 12,000 | 48,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal | Pulling test (SMT/DIP), Solder paste thickness, Pull Force application |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force, Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig, subjected to harmonic motion 10-55 Hz, 2 hours in 3 directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature change (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the company if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause issues.
- Allow for sufficient thermal design as self-heating occurs when power is ON.
2410121442_LanTu-Micro-SNR4020-150MT_C5127384.pdf
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