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Quality High density installation molding SMD power inductor LanTu Micro SMS0530 4R7MT with low eddy current loss factory
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Quality High density installation molding SMD power inductor LanTu Micro SMS0530 4R7MT with low eddy current loss factory
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Specifications
Current - Saturation (Isat):
5A
Mfr. Part #:
SMS0530-4R7MT
Package:
SMD,5.5x5.2mm
Key Attributes
Model Number: SMS0530-4R7MT
Product Description

Molding SMD Power Inductors - SMS0530 Series

Product Overview

The SMS0530 Series is a line of ultra-high current, thin-design SMD power inductors featuring magnetic shielding for strong anti-electromagnetic interference. Constructed with an integral molding for high reliability and vibration resistance, these inductors offer low DC resistance, ultra-low buzz noise due to composite construction, and low eddy-current loss from die-casting with low-loss alloy powder. They are suitable for high-density installations and operate efficiently up to 3MHz. Applications include PDA, notebook, desktop, and server systems, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Type: Molding SMD Power Inductor
  • Series: SMS0530
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: SHENZHEN

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency Test Voltage DCR (m) Typical DCR (m) Max Saturation Current Typical (A) Heat Rating Current Typical (A) Dimensions (LWH mm) Operating Temperature (C) Absolute Maximum Voltage (VDC)
SMS0530-R22M 0.22 20% 100KHz 1.0V 3.5 3.9 15.00 14.00 5.55.23.0 -55 to +125 30
SMS0530-R33M 0.33 20% 100KHz 1.0V 4.6 5.5 14.40 13.10 5.55.23.0 -55 to +125 30
SMS0530-R47M 0.47 20% 100KHz 1.0V 7.4 8.5 14.00 11.00 5.55.23.0 -55 to +125 30
SMS0530-R68M 0.68 20% 100KHz 1.0V 11.0 12.0 12.00 9.50 5.55.23.0 -55 to +125 30
SMS0530-1R0M 1.0 20% 100KHz 1.0V 12.0 15.0 10.00 9.00 5.55.23.0 -55 to +125 30
SMS0530-1R2M 1.2 20% 100KHz 1.0V 15.0 16.0 9.50 8.50 5.55.23.0 -55 to +125 30
SMS0530-1R5M 1.5 20% 100KHz 1.0V 20.0 25.0 9.00 7.50 5.55.23.0 -55 to +125 30
SMS0530-2R2M 2.2 20% 100KHz 1.0V 31.0 35.0 7.00 6.50 5.55.23.0 -55 to +125 30
SMS0530-3R3M 3.3 20% 100KHz 1.0V 35.0 46.0 6.00 5.00 5.55.23.0 -55 to +125 30
SMS0530-4R7M 4.7 20% 100KHz 1.0V 50.0 60.0 5.00 4.50 5.55.23.0 -55 to +125 30
SMS0530-6R8M 6.8 20% 100KHz 1.0V 102.0 110.0 4.00 3.50 5.55.23.0 -55 to +125 30
SMS0530-100M 10 20% 100KHz 1.0V 110.0 125.0 3.50 3.20 5.55.23.0 -55 to +125 30
SMS0530-150M 15 20% 100KHz 1.0V 175.0 215.0 2.50 2.20 5.55.23.0 -55 to +125 30
SMS0530-220M 22 20% 100KHz 1.0V 320.0 394.8 2.00 1.80 5.55.23.0 -55 to +125 30
Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Options: B (Bulk Package), T (Tape & Reel)

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SMS 0530 - 1R0 M T

  • : Series Type (SMS)
  • : Inductance Value (e.g., 1R0 = 1.0 H)
  • : Inductance Tolerance (e.g., M = 20%)
  • : External Dimensions (0530 = 5.55.23.0 mm)
  • : Packing Type (T = Tape & Reel)

Shape and Dimensions

ITEM A B C D E F G H
SMS0530 5.500.30 5.200.20 3.00Max 2.30 Typ 1.20 Typ 3.00 7.00 2.50

(Dimensions are in mm)

Packaging Information

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS0530 12.0 8.0 5.5 12.4 100 13 330 2000 8000 32,000

Reminders for Using These Products

  • Storage: Within 12 months, under conditions (5~40C, 35~65% RH). Terminal solderability may degrade if storage period is exceeded.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is on.
  • Non-Magnetic Shield Type: Careful layout is required on the PCB to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SMS0530-4R7MT_C5127564.pdf

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