Product Overview

The SMS252010 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, including DC/DC converters for notebook CPUs, mobile phones, tablets, servers, base stations, and various power modules. These components comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Type: Common Mode Choke / Molding SMD Power Inductor
• Series: SMS252010
• Certifications: RoHS, Halogen Free, REACH Compliance
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): WK3260B LCR meter or equivalent
• Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification Example: SMS 252010 R47 M T

• Inductance: 0.47 uH
• Type: SMS (Molding SMD Power Inductor)
• External Dimensions (LWH) (mm): 252010 (2.52.01.0)
• Inductance Tolerance: M (20%)
• Packing: T (Tape & Reel)

Packaging Specifications (Tape and Reel):

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing:

• Terminal Strength: Meets specified force and duration requirements without loose terminals.
• Resistance to Flexure: No visible mechanical damage after flexure test.
• Dropping Test: No case deformation or appearance change; no short/open circuits after dropping.
• Solderability: Minimum 75% wetting coverage, 95% minimum solder coverage on terminals.
• Vibration: No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
• Thermal Shock: No visible mechanical damage; Inductance change within 10%; Q factor change within 20% after 100 cycles.
• Low Temperature Storage: No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
• High Temperature Storage: No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
• Damp Heat (Steady States): No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
• Heat endurance of Reflow soldering: No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%.
• Resistance to solvent test: No case deformation, appearance change, or obliteration of marking.
• Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test.
• Voltage resistance test: No breakdown during test; characteristics normal after test.

Recommended Reflow Soldering Curve: Refer to the provided curve for soldering equipment settings, adjust based on user environment/equipment.

Reminders for Using These Products:

• Storage period is within 12 months under conditions (5~40C, 35~65% RH).
• Avoid use and storage in corrosive gas environments (salt, acid, alkali).
• Do not touch terminals directly with bare hands.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils; contact manufacturer if cleaning is required.
• Keep away from magnets or magnetic fields.
• Preheat components before soldering; temperature difference should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid overheating.
• Allow sufficient thermal design margin for self-heating when power is on.
• For non-magnetic shield types, careful layout is needed to prevent malfunction due to magnetic interference.