Shielded SMD Power Inductors - SDRH104R Series

Product Overview

The SDRH104R Series Shielded SMD Power Inductors are designed for high saturation current and low DCR, featuring a closed magnetic circuit design to minimize leakage. These inductors offer high-accuracy dimensions suitable for automatic mounting, and are available in various package sizes and a wide inductance range. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SDRH104R
• Type: Shielded SMD Power Inductors
• Magnetic Circuit: Closed
• Mounting: Automatic Mounting Compatible
• Certifications: RoHS, Halogen Free, REACH Compliance
• Operating Temperature: -40 to +125 (including coil self-temperature rise)

Technical Specifications

Key Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value between Isat and Irms.

Recommended Land Pattern:

Refer to the diagram for recommended land pattern dimensions.

Packaging:

• Tape & Reel Specifications: Available in Tape & Reel packaging. Dimensions are provided in mm.
• Reel Dimensions: Provided in mm.
• Tape Dimensions: Provided in mm.
• Cover Tape Peel Off Condition: Peel force 10 to 120g, peeling angle 165 to 180.
• Packing Quantity: Details for Reel, Inside Box, and Outside Carton quantities are specified.

Recommended Reflow Soldering Curve:

The recommended reflow conditions are provided. Users should adjust and confirm these conditions based on their specific environment and equipment.

Reminders for Using These Products:

• Storage: Within 12 months. Conditions: 5~40C, 35-65% RH. Exceeding storage time may degrade terminal solderability.
• Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals to prevent soldering issues due to hand oils. Handle carefully to prevent damage from dropping.
• Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
• Cleaning: Do not clean coils independently; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C.
• Soldering Corrections: Perform soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Account for self-heating when power is applied. Ensure sufficient thermal design margin.
• Non-Shielded Type Layout: For non-magnetic shielded types, carefully consider coil placement on the PCB to prevent malfunctions due to magnetic interference.