Molding SMD Power Inductors - SMS1350 Series
Product Overview
The SMS1350 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for demanding applications. These thin, magnetically shielded inductors feature low DC resistance and exceptional anti-electromagnetic interference capabilities, making them ideal for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, these inductors provide low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage rating of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1350
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|
| SMS1350-R36M | 0.36 | 20% | 0.85 | 60.00 | 41.00 | 13.812.66.0 |
| SMS1350-R47M | 0.47 | 20% | 1.1 | 52.00 | 39.00 | 13.812.66.0 |
| SMS1350-R68M | 0.68 | 20% | 1.2 | 40.00 | 32.00 | 13.812.66.0 |
| SMS1350-R82M | 0.82 | 20% | 1.5 | 42.00 | 30.00 | 13.812.66.0 |
| SMS1350-1R0M | 1.0 | 20% | 1.9 | 35.00 | 26.00 | 13.812.66.0 |
| SMS1350-1R5M | 1.5 | 20% | 2.7 | 30.00 | 23.00 | 13.812.66.0 |
| SMS1350-2R2M | 2.2 | 20% | 4.0 | 26.00 | 20.00 | 13.812.66.0 |
| SMS1350-3R3M | 3.3 | 20% | 7.0 | 22.00 | 15.00 | 13.812.66.0 |
| SMS1350-4R7M | 4.7 | 20% | 9.0 | 17.00 | 12.00 | 13.812.66.0 |
| SMS1350-6R8M | 6.8 | 20% | 15.0 | 14.00 | 11.00 | 13.812.66.0 |
| SMS1350-100M | 10 | 20% | 20.0 | 12.00 | 8.00 | 13.812.66.0 |
| SMS1350-150M | 15 | 20% | 28.0 | 10.00 | 6.00 | 13.812.66.0 |
| SMS1350-220M | 22 | 20% | 45.0 | 7.00 | 4.50 | 13.812.66.0 |
| SMS1350-330M | 33 | 20% | 66.0 | 6.00 | 4.00 | 13.812.66.0 |
| SMS1350-470M | 47 | 20% | 100.0 | 5.00 | 3.00 | 13.812.66.0 |
| SMS1350-680M | 68 | 20% | 115.0 | 4.50 | 2.50 | 13.812.66.0 |
Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS1350 | 13.800.50 | 12.600.20 | 6.00Max | 3.70 Typ | 2.50 Typ | 8.00 | 14.60 | 5.00 |
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Product Identification
SMS 1350 100 M T
- : Inductance (e.g., 10 H)
- : Type (SMS)
- : Packing (T = Tape & Reel)
Inductance Tolerance Codes
- J: 5%
- K: 10%
- L: 15%
- M: 20%
- P: 25%
- N: 30%
Packing Codes
- B: Bulk Package
- T: Tape & Reel
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate if storage period elapses.
- Environment: Avoid use or storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid touching terminals directly with bare hands due to grease. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Perform after-mounting soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is applied.
- Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
2410121635_LanTu-Micro-SMS1350-330MT_C5127441.pdf
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