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Quality SMD Power Inductor LanTu Micro SNR5020-100MT with Magnetic Resin Shielding and High Shock Resistance factory
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Quality SMD Power Inductor LanTu Micro SNR5020-100MT with Magnetic Resin Shielding and High Shock Resistance factory
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Specifications
Current - Saturation (Isat):
1.7A
Mfr. Part #:
SNR5020-100MT
Package:
SMD,5x5mm
Key Attributes
Model Number: SNR5020-100MT
Product Description

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR5020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, large current handling capability with low DCR, and metallization on the ferrite core for excellent shock resistance. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive systems, and DC-DC converters.

Product Attributes

  • Brand: LANTU (LT-)
  • Product Series: SNR5020 Series
  • Construction: Magnetic Resin Shielded SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Assembly: Automatic Assembly

Technical Specifications

Part No. Inductance (H) Inductance Tolerance DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SNR5020-R47M 0.47 20% 0.017 0.021 4.50 4.60 5.05.02.0
SNR5020-1R0M 1.0 20% 0.020 0.025 4.10 3.80 5.05.02.0
SNR5020-1R5M 1.5 20% 0.026 0.032 3.80 3.20 5.05.02.0
SNR5020-2R2M 2.2 20% 0.032 0.040 3.20 2.90 5.05.02.0
SNR5020-3R3M 3.3 20% 0.043 0.054 2.55 2.50 5.05.02.0
SNR5020-3R9M 3.9 20% 0.043 0.054 2.30 2.50 5.05.02.0
SNR5020-4R7M 4.7 20% 0.057 0.074 2.40 2.20 5.05.02.0
SNR5020-6R8M 6.8 20% 0.083 0.107 2.05 1.80 5.05.02.0
SNR5020-8R2M 8.2 20% 0.098 0.125 1.85 1.65 5.05.02.0
SNR5020-100M 10 20% 0.110 0.140 1.70 1.55 5.05.02.0
SNR5020-120M 12 20% 0.140 0.180 1.50 1.40 5.05.02.0
SNR5020-150M 15 20% 0.165 0.210 1.35 1.25 5.05.02.0
SNR5020-220M 22 20% 0.226 0.290 1.15 1.10 5.05.02.0
SNR5020-330M 33 20% 0.390 0.500 0.95 0.90 5.05.02.0
SNR5020-470M 47 20% 0.523 0.670 0.77 0.77 5.05.02.0
SNR5020-680M 68 20% 0.740 1.050 0.72 0.64 5.05.02.0
SNR5020-820M 82 20% 1.000 1.280 0.66 0.50 5.05.02.0
SNR5020-101M 100 20% 1.100 1.480 0.57 0.53 5.05.02.0
SNR5020-121M 120 20% 1.350 1.700 0.49 0.40 5.05.02.0
Inductance Tolerance Options Packing Options
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% B: Bulk Package, T: Tape & Reel

Environmental Data

Operating Temperature
-40 to +125 (Including coils self-temperature rise)

Test Equipment

Measurement Equipment
Inductance (L) HP4284A, HP4285A LCR meter or equivalent
Saturation Current (Isat) & Temperature Rise Current (Irms) HP4284+42841A or equivalent
DC Resistance (DCR) Chroma 16502 or equivalent

Applications

  • LED backlight
  • Flat-screen TVs
  • Blue-ray disc set top boxes
  • Notebook computers
  • Desktop computers
  • Servers
  • Graphic cards
  • Portable gaming devices
  • Personal navigation systems
  • Personal multimedia devices
  • Automotive systems
  • Telecommunication base stations
  • DC-DC Converters

Shape and Dimensions

Part No. A (mm) B (mm) C (mm) Max D (mm) E (mm) F (mm) Typ G (mm) Typ H (mm) Typ
SNR5020 5.00.3 5.00.3 2.0 2.50.2 4.00.2 1.4 2.3 4.2

Packaging

  • Tape and Reel Specifications: Dimensions provided in mm.
  • Reel Dimensions: Provided in mm.
  • Tape Dimensions: Provided in mm.
  • Cover tape peel off condition: Peel force 10 to 120g, peeling angle 165 to 180.
  • Packing Quantity: Specific quantities for Reel, Inside Box, and Outside Carton are detailed in the source document.

Reminders for Using These Products

  • Storage period within 12 months; conditions: 5~40C, 35~65% RH.
  • Avoid use and storage in corrosive environments (salt, acid, alkali).
  • Do not touch electrodes directly with bare hands to maintain solderability.
  • Handle carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals excessively to avoid wire fracture.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Keep away from magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Allow sufficient thermal design margin for self-heating during operation.

2410121442_LanTu-Micro-SNR5020-100MT_C5127406.pdf

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