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Quality axial fixed inductors LanTu Micro AL0307-821K with epoxy resin coating and automated tape packaging factory
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Quality axial fixed inductors LanTu Micro AL0307-821K with epoxy resin coating and automated tape packaging factory
>
Specifications
Current Rating:
65mA
Inductance:
820uH
Tolerance:
±10%
DC Resistance(DCR):
27.5Ω
Type:
Color Band Inductor
Q @ Frequency:
50@0.796MHz
Mfr. Part #:
AL0307-821K
Package:
Through Hole,D3.2xL7.6mm
Key Attributes
Model Number: AL0307-821K
Product Description

Axial Fixed Inductors - AL0307 Series

Product Overview

The AL0307 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance RF applications. Featuring an epoxy resin coating for enhanced humidity resistance and longevity, these inductors offer a wide inductance range in a compact, lightweight design. They are engineered for high Q factors and self-resonant frequencies, making them ideal for automated insertion processes due to their tape packaging. These inductors are RoHS, Halogen Free, and REACH compliant, suitable for a variety of electronic products including televisions, personal computers, radios, telephones, and chargers.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: AL0307 Series
  • Type: Axial Fixed Inductors
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Bulk Package (B), Tape Packaging (TF)

Technical Specifications

General Specifications:

Attribute Value
Operating Temperature -25 to +85 (Including coil self-temperature rise)
External Dimensions (LH) 3.27.62 mm (for 0307 size)

Product Identification: AL 0307 [Inductance] [Tolerance] [Packing]

  • Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Electrical Characteristics (at 25):

Part No Inductance (H) Tolerance Q Min @ Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current Max (mA)
AL0307-1R0M 1.0 20% 40 @ 25.2 150 0.15 740
AL0307-1R2M 1.2 20% 40 @ 7.96 150 0.18 740
AL0307-1R5M 1.5 20% 40 @ 7.96 150 0.20 700
AL0307-1R8M 1.8 20% 50 @ 7.96 125 0.23 655
AL0307-2R2M 2.2 20% 50 @ 7.96 110 0.27 630
AL0307-2R7M 2.7 20% 50 @ 7.96 95 0.28 595
AL0307-3R3M 3.3 20% 50 @ 7.96 70 0.30 575
AL0307-3R9M 3.9 20% 50 @ 7.96 65 0.32 555
AL0307-4R7M 4.7 20% 50 @ 7.96 36 0.35 530
AL0307-5R6M 5.6 20% 50 @ 7.96 32 0.40 500
AL0307-6R8M 6.8 20% 50 @ 7.96 28 0.48 470
AL0307-8R2M 8.2 20% 50 @ 7.96 23 0.56 425
AL0307-100K 10 10% 50 @ 7.96 18 0.75 370
AL0307-120K 12 10% 50 @ 2.52 17 0.80 350
AL0307-150K 15 10% 50 @ 2.52 16 0.93 335
AL0307-180K 18 10% 50 @ 2.52 15 1.00 315
AL0307-220K 22 10% 50 @ 2.52 13 1.20 285
AL0307-270K 27 10% 50 @ 2.52 11 1.80 270
AL0307-330K 33 10% 50 @ 2.52 10 2.20 255
AL0307-390K 39 10% 50 @ 2.52 9.5 2.30 240
AL0307-470K 47 10% 50 @ 2.52 8.5 2.60 205
AL0307-560K 56 10% 50 @ 2.52 7.5 2.90 195
AL0307-680K 68 10% 50 @ 2.52 6.5 3.30 185
AL0307-820K 82 10% 50 @ 2.52 6.0 3.80 175
AL0307-101K 100 10% 50 @ 2.52 5.5 4.20 165
AL0307-121K 120 10% 50 @ 0.796 5.4 4.70 160
AL0307-151K 150 10% 50 @ 0.796 4.7 5.40 150
AL0307-181K 180 10% 50 @ 0.796 4.3 6.00 140
AL0307-221K 220 10% 60 @ 0.796 4.0 7.00 130
AL0307-271K 270 10% 60 @ 0.796 3.7 7.70 120
AL0307-331K 330 10% 60 @ 0.796 3.4 11.1 100
AL0307-391K 390 10% 60 @ 0.796 2.8 12.6 95
AL0307-471K 470 10% 60 @ 0.796 2.5 14.0 90
AL0307-561K 560 10% 60 @ 0.796 2.3 15.5 85
AL0307-681K 680 10% 60 @ 0.796 2.0 25.3 75
AL0307-821K 820 10% 60 @ 0.796 1.5 27.5 65
AL0307-102K 1000 10% 50 @ 0.796 1.2 31.4 60

Current Definitions:

  • Saturation Current (Isat): Current at which inductance drops by 10% from its initial value (Ta=25).
  • Temperature Rise Current (Irms): DC current causing a temperature rise of T 40 (Ta=25).
  • Rated DC Current: The lower value of Isat or Irms.

Packaging:

Series Type Packaging Quantity (pcs) Carton Size (mm) (LWH) Parts/Box Parts/Reel Parts/Carton
T5A Tape and Reel 3000 440275392 - - 72,000

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT/DIP) Meet requirements without loose terminals Pulling test, Solder paste thickness, Force and duration based on terminal size (GB/T 2423.60-2008)
Resistance to Flexure No visible mechanical damage Flexure: 2mm, Speed: 0.5mm/s, Keep time: 30s (JIS C 5321:1997)
Dropping No case deformation, no short/open circuits Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each direction (GB/T 2423.7-2018)
Solderability Min 95% solder coverage on terminals, >75% wetting Solder temp: 2402, Duration: 3s, Solder: Sn/3.0Ag/0.5Cu (GB/T 2423.28-2005)
Vibration Inductance change: 10%, Q factor change: 20% 10-55 Hz, 1.5mm amplitude, 2 hours per direction (GB/T 2423.10-2019)
Thermal Shock Inductance change: 10%, Q factor change: 20% 100 cycles of -55~40 to 85~125 (GB/T 2423.22-2012 Method Na)
Low Temperature Storage Inductance change: 10%, Q factor change: 20% -55~-402 for 962 hours (GB/T 2423.1-2008 Method Ab)
High Temperature Storage Inductance change: 10%, Q factor change: 20% 125~852 for 962 hours (GB/T 2423.2-2008 Method Bb)
Damp Heat (Steady States) Inductance change: 10%, Q factor change: 20% 602, 90-95% RH for 962 hours (GB/T 2423.3-2016)
Heat endurance of Reflow soldering L/L10%, Q/Q30%, DCR/DCR10% Peak temp: 260+0/-5, twice (GJB 360B-2009)
Resistance to solvent test No case deformation, appearance change, or marking obliteration Dip in IPA solvent for 5min, dry 5min, brush 10 times (IAL 68-2-45:1993)
Overload test No smoke, peculiar smell, fire; characteristics normal after test Apply twice rated current for 5 minutes (JIS C5311-6.13)
Voltage resistance test No breakdown; characteristics normal after test DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301)

Recommended Lead-free Wave Soldering Curve (DIP-Type):

Refer to manufacturer's recommendations and adjust based on user environment/equipment.

Soldering Iron (Rework):

  • Max temperature: 350C, max 3 times.
  • Avoid direct contact with the inductor body and wire.
  • Hand soldering is not recommended.

Reminders for Using These Products:

  • Storage: Within 12 months, at 5-40C and 35-65% RH. Solderability may deteriorate after storage.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali).
  • Handling: Avoid touching terminals directly with bare hands. Handle carefully to prevent damage from dropping. Do not excessively bend terminals.
  • Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Magnetism: Keep away from magnets or magnetic fields.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Perform within specified conditions; overheating can cause issues.
  • Self-heating: Account for self-heating in thermal design.
  • Layout: For non-magnetic shield types, careful PCB layout is needed to avoid malfunction due to magnetic interference.

2410121625_LanTu-Micro-AL0307-821K_C19704356.pdf

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