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Quality Molding SMD Power Inductor LanTu Micro SMS0650-330MT with Low Loss Alloy Powder Die Casting Material factory
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Quality Molding SMD Power Inductor LanTu Micro SMS0650-330MT with Low Loss Alloy Powder Die Casting Material factory
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Specifications
Current - Saturation (Isat):
3.3A
Mfr. Part #:
SMS0650-330MT
Package:
SMD,7.1x6.6mm
Key Attributes
Model Number: SMS0650-330MT
Product Description

Molding SMD Power Inductors - SMS0650 Series

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0650 Series is an ultra-high current, thin-profile SMD power inductor designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability through an integral construction, providing excellent vibration resistance and ultra-low buzz noise due to their composite structure. They are manufactured using low-loss alloy powder die-casting, resulting in low impedance, small parasitic capacitance, high efficiency, and reduced eddy-current loss. Capable of operating at frequencies up to 3MHz, these inductors are suitable for a wide range of applications including PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS0650
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China

Technical Specifications

General Specifications

Parameter Value
Operating Temperature -55 to +125 (Including coil self-temperature rise)
Maximum Voltage 30VDC
Frequency Range Up to 3MHz
External Dimensions (LWH) 7.16.65.0 mm

Electrical Characteristics (at 25)

Part No. Inductance (H) @ 100KHz, 1.0V Tolerance DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS0650-R22M 0.22 20% 1.1 1.3 40.00 30.00
SMS0650-R47M 0.47 20% 3.2 3.8 24.00 20.00
SMS0650-R56M 0.56 20% 3.4 3.9 20.00 18.00
SMS0650-R68M 0.68 20% 3.9 4.2 17.00 17.50
SMS0650-R82M 0.82 20% 4.6 4.9 17.00 17.00
SMS0650-1R0M 1.00 20% 6.5 8.5 16.50 13.00
SMS0650-1R5M 1.50 20% 7.0 10.0 12.70 12.00
SMS0650-2R2M 2.20 20% 11.2 13.6 12.50 11.00
SMS0650-3R3M 3.30 20% 20.0 22.0 9.00 8.50
SMS0650-4R7M 4.70 20% 26.0 30.0 8.00 6.70
SMS0650-5R6M 5.60 20% 31.0 36.0 7.60 5.80
SMS0650-6R8M 6.80 20% 36.5 41.0 7.30 5.50
SMS0650-100M 10.00 20% 48.0 55.0 5.50 4.70
SMS0650-150M 15.00 20% 77.0 85.0 5.00 4.00
SMS0650-220M 22.00 20% 125.0 140.0 4.00 3.20
SMS0650-330M 33.00 20% 150.0 200.0 3.30 2.80
SMS0650-470M 47.00 20% 260.0 300.0 2.80 2.20
SMS0650-680M 68.00 20% 340.0 442.0 2.20 1.80
SMS0650-101M 100.00 20% 595.0 720.0 2.00 1.50

Inductance Tolerance Codes

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Shape and Dimensions (mm)

Part No. A B C (Max) D (Typ) E (Typ) F G H
SMS0650 7.100.30 6.600.20 5.00 3.00 1.60 3.70 8.40 3.50

Packaging Options

Packing Type Description
Bulk
Tape & Reel

Test Equipment Used

Parameter Tested Equipment
Inductance (L) WK3260B LCR meter or equivalent
Saturation Current (Isat) & Heat Rating Current (Irms) WK3260B+WK3265B or equivalent
DC Resistance (DCR) Chroma 16502 or equivalent

Definitions

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value between Isat and Irms.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage.
  • Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or strong magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
  • Non-Magnetic Shield Type: Careful coil placement is required in PCB design to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SMS0650-330MT_C5127476.pdf

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