Product Overview
This document details the specifications for metallized polypropylene film capacitors, specifically the wireless charging series (CBB21/CBB22/MPP). These capacitors are designed for high-frequency, DC, AC, and pulse applications, offering features such as small size, excellent self-healing properties, low high-frequency loss, low temperature rise, high impact strength, and good durability under high frequencies. They are suitable for use in instruments and power supplies.
Product Attributes
- Brand: KYET
- Origin: Dongguan City Keya Electronics Technology Co., Ltd.
- Material: Metallized Polypropylene Film
- Certifications: GB2693, IEC384-1, GB10190, SJ/T10353
Technical Specifications
| Item | Specification | Lead Pitch (mm) | Lead Material | Nominal Capacitance | Tolerance | Dimensions (MAX-mm) | Marking | Rated Voltage (VDC) | Capacitance Range (F) | Loss Tangent (tg) | Withstand Voltage | Insulation Resistance | Solderability | Operating Temperature Range |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CBB/MPP 254J100V | MPP | 7.5 | 0.5CU | 0.25UF | 5% | 9.5*9.0*3.5 | KYET | 100 | 0.0010 ~ 8.2 | 0.30% (100KHz) | 1.6UR DS (5S) | 25000M (C0.33F), 7500MF (C0.33F) | 90% tinning area | -40~+105 |
| - | - | - | - | - | J(5%), K(10%) | - | - | 100, 250, 400, 450, 630, 1000 | - | - | - | - | - | - |
Testing Requirements
| NO | Item | Performance Requirement | Test Method |
|---|---|---|---|
| 6.1 | Initial Measurement | Capacitance | 1KHz |
| Loss Tangent: 1KHz | - | ||
| Lead Strength | Tensile test: 10N (0.5d0.8mm); Bending test; Torsion test | ||
| 6.2 | Temperature Rapid Change | Appearance: No visible damage | 5 cycles (-40 to +105), 30min each |
| Vibration | Appearance: No visible damage | 10~500Hz, 2h per direction (3 directions) | |
| Shock | Appearance: No visible damage | 4000 times, 390m/s, 6ms pulse | |
| 6.3 | Climatic Sequence | Appearance: No visible damage, clear marking | Dry Heat (+105, 16h), Cold (-40, 2h), Low Pressure (8.5Kpa, 1h) |
| Capacitance: C/C 5% of initial | Humidity Heat (Db, severity b) | ||
| Loss Tangent: tg increase 0.001 | - | ||
| Withstand Voltage: 1.6URDC, 5S (no breakdown) | - | ||
| 6.4 | Damp Heat (Steady State) | Appearance: No visible damage, clear marking. Capacitance: C/C 5%. Loss Tangent: tg increase 0.001. Withstand Voltage: 1.6URDC, 5S (no breakdown). Insulation Resistance: 50% of rated. | 402, 93%RH, 21 days |
| 6.5 | Endurance | Appearance: No visible damage, clear marking. Capacitance: C/C 10%. Loss Tangent: tg increase 0.008. Withstand Voltage: 1.6URDC, 5S (no breakdown). Insulation Resistance: 50% of rated. | +105, 1000h, 1.25UR applied voltage |
| 6.6.1 | Characteristics with Temperature Variation | At -40: 0 C/C 3%. At +105: -4% C/C 0. | Static method at various temperatures |
| 6.6.2 | Charge and Discharge | Capacitance: C/C 10%. Loss Tangent: tg increase 0.001. Insulation Resistance: 50% of rated. | 10000 cycles (0.5s charge, 0.5s discharge) |
| 6.7 | Flammability Test | Ignition time 30s after flame removal. Drippings do not ignite cotton paper. | IEC695-2-2 Needle Flame Test |
Raw Material List
| Item Name | Part | Raw Material |
|---|---|---|
| CBB(21/22 MPP) Metallized Polypropylene Film Capacitor | Dielectric | Polypropylene |
| - | Electrode | Metal vacuum evaporation layer |
| - | Encapsulation Layer | High-temperature wax flame-retardant epoxy resin |
| - | Solder | Tin-zinc alloy |
| - | Lead wire | Copper wire |
Packaging and Transportation Requirements
Labeling: Material number, supplier trademark, product model, nominal capacitance, tolerance, rated voltage, batch number/production date, quantity.
Packaging: Capacitors packed in plastic bags (multiples of 100), then in cartons. Taped packaging available as per customer requirements.
Transportation: Avoid direct rain/snow and mechanical damage.
Storage Conditions: Temperature below 35, relative humidity below 65%, free from corrosive substances.
Soldering Recommendations
Manual Soldering: Maximum 3 seconds, keep solder point away from the body. Not suitable for reflow soldering due to film shrinkage.
Wave Soldering: Vertical installation on PCB recommended. Avoid covering the soldering fixture. Preheat temperature 80-100, soldering temperature 2605, within 5 seconds. Ensure no pauses during soldering.
Environment: Keep away from high-heat components when ambient temperature is 85.
2509180925_KYET-MPP254J2A0701_C841196.pdf
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