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Specifications
Type:
Metal Film Resistor
Resistance:
120Ω
Power(Watts):
2W
Temperature Coefficient:
±300ppm/℃
Tolerance:
±5%
Mfr. Part #:
MOS2CT52A121J
Package:
Through Hole,D4xL12mm
Key Attributes
Model Number:
MOS2CT52A121J
Product Description
Product Overview
The MOS and MOSX series are compact power-type resistors featuring metal oxide film (MOS) and metal film (MOSX) construction, respectively. These resistors are designed for high reliability and offer a flame-retardant coating equivalent to UL94 V-0. They are suitable for automatic insertion and various forming processes, including surface mount forming for automated assembly. Compliant with EU RoHS, these resistors are ideal for demanding applications.
Product Attributes
- Product Type: Fixed Resistors
- Series: MOS (Metal Oxide Film), MOSX (Metal Film)
- Power Types: Small Power Type, High Power Type
- Coating: Flame-retardant (UL94 V-0 equivalent)
- Certifications: EU RoHS compliant
- Appearance Color: Light Purple
- Marking: Color code (0.5W, 1W), Text (2W, 3W, 5W)
- Reference Standards: IEC 60115-4, JIS C 5201-4, EIAJ RC-2138
Technical Specifications
| Model | Rated Power | Dimensions (mm) L x C | Max. D | d (Nominal) | Weight (g/1000pcs) | Resistance Range () | Resistance Tolerance | Temperature Coefficient (10/K) | Max. Rated Voltage | Max. Overload Voltage | Withstand Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|
| MOS(X)1/2 | 0.5W | 6.20.5 x 7.1 | 2.50.5 | 0.6 | 250 | MOS: 1047k MOSX: 0.19.1 | F: 1%, G: 2%, J: 5% | 300 | E=PR (V) or 400V | E2.5 (V) | - |
| MOS(X)1 | 1W | 9.01.0 x 11.1 | 3.00.5 | - | 350 | MOS: 1068k MOSX: - | F: 1%, G: 2%, J: 5% | - | 500V | - | - |
| MOS(X)2 | 2W | 12.01.0 x 15.0 | 4.00.5 | 0.8 | 800 | MOS: 10100k MOSX: - | F: 1%, G: 2%, J: 5% | - | 350V | 700V | - |
| MOS(X)3 | 3W | 15.51.0 x 18.0 | 6.01.0 | - | 1,400 | MOS: - MOSX: - | F: 1%, G: 2%, J: 5% | - | 700V | - | - |
| MOS(X)5 | 5W | 24.51.0 x 28.0 | 9.01.0 | - | 5,240 | MOS: - MOSX: - | F: 1%, G: 2%, J: 5% | - | 500V | 1000V | 800V |
Operating Conditions
- Rated Environmental Temperature: +70
- Operating Temperature Range: -55 to +200
Performance
| Test Item | Standard Value | Test Method | Guarantee Value | Representative Value |
|---|---|---|---|---|
| Resistance Value | Within specified tolerance | - | - | - |
| Temperature Coefficient of Resistance | Within specified value | +25/+125 | - | - |
| Overload (Short-time) | (2% + 0.1) | 2.5 times rated voltage applied for 5 sec. | 1 | - |
| Resistance to Soldering Heat | 1 | 2605, 10s1s | 0.5 | - |
| Terminal Strength | No exposed wires or loose terminals | 360 twist, 5 times | - | - |
| Thermal Shock | 1 | -55 (30min.) / +155 (30min.) 5 cycles | 0.5 | - |
| Damp Load | (5% + 0.1) | 402, 90%95%RH, 1000h (1.5h ON, 0.5h OFF cycle) | 2.5 | 1.5 |
| Endurance at 70 | (5% + 0.1) | 702, 1000h (1.5h ON, 0.5h OFF cycle) | 2.5 | 1.5 |
| Resistance to Solvents | No external abnormalities, marking legible | 2 min. Isopropyl alcohol ultrasonic cleaning (Output: 0.3W/cm, Frequency: 28kHz, Temp: 355) | - | - |
| Flammability | Does not burn or self-ignite | Fire resistance: Burn for 15s, remove for 15s, 5 cycles. Overload flammability: Apply 2x, 4x, 8x, 16x, 32x rated power (AC) for 1 min each until open circuit. Do not apply voltage > 4x max. operating voltage. | - | - |
Secondary Processing (Forming)
| Model | Type | P1 (mm) | H11 (mm) | H21 (mm) | d (Nominal) (mm) | Substrate Hole Pitch (mm) | Substrate Hole Diameter (mm) |
|---|---|---|---|---|---|---|---|
| MOS/MOSX 1/2C | L (Forming) | 10.0 | 5.3 | 4.0 | 0.6 | - | 0.8 |
| MOS/MOSX 1C | L (Forming) | 12.5 | 7.0 | - | 0.8 | - | 1.0 |
| MOS/MOSX 2C | L (Forming) | 15.0 | 6.5 | - | - | - | - |
| MOS/MOSX 3C | L (Forming) | 17.5 | 7.0 | - | - | - | - |
| MOS/MOSX 5C | L (Forming) | 25.0 | 7.0 | - | - | - | - |
| MOS/MOSX 1/2C | M (Forming) | 10.0 | 3.5 | - | 0.6 | - | 0.8 |
| MOS/MOSX 1C | M (Forming) | 12.5 | 3.5 | - | 0.8 | - | 1.0 |
| MOS/MOSX 2C | M (Forming) | 15.0 | 3.5 | - | 0.8 | - | - |
| MOS/MOSX 3C | M (Forming) | 20.0 | 4.6 | - | 0.8 | - | - |
| MOS/MOSX 5C | M (Forming) | 30.0 | 13.0 | - | 0.8 | - | - |
| MOS/MOSX 1C | UCL (Forming) | 13.0 | 17.0max. | 3.5 | 0.8 | 5.0 | 1.0 |
| MOS/MOSX 2C | UCL (Forming) | 14.5 | 18.5max. | 3.5 | - | - | - |
| MOS/MOSX 3C | UCL (Forming) | 20.0max. | 22.0 | 4.0 | - | - | - |
| MOS/MOSX 1C | VTP (Radial Taping) | 9.010 | - | - | 0.65 | 12.71.0 | 1.0 |
| MOS/MOSX 2C | VTP (Radial Taping) | 12.01.0 | - | - | 0.8 | - | - |
| MOS/MOSX 3C | VTP (Radial Taping) | - | - | - | - | - | - |
| MOS/MOSX 1C | N (AMMO Taping) | 14.5 | - | - | 0.8 | 5.0 | - |
| MOS/MOSX 2C | N (AMMO Taping) | 17.0 | - | - | 0.8 | 6.0 | - |
| MOS/MOSX 3C | N (AMMO Taping) | 20.0 | - | - | 0.8 | 7.51.0 | - |
Packaging
- AMMO Packaging (A)
- Reel Packaging (R)
- Box Packaging (Default)
- Embossed Taping (TEB, TEG)
Application Notes
- When used above 70 ambient temperature, reduce rated power according to the derating curve.
- The coating is a flame-retardant special coating and is relatively fragile to external impact. Minimize cleaning. The coating is fragile immediately after cleaning; do not apply external force to the coating before the product is completely dry. After drying, the coating will regain its original strength. Do not apply external force to the resistor coating within 20 minutes after cleaning, especially avoid stacking substrates.
- For applications involving human safety, or potential for significant loss (e.g., automotive, medical, aerospace equipment), please contact KOA Global in advance.
2009101103_KOA-MOS2CT52A121J_C782208.pdf
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