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quality Low Resistance Flat Chip Resistors KOA SR732BTTD1R00F Current Detection Power Supply Motor Circuits factory
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quality Low Resistance Flat Chip Resistors KOA SR732BTTD1R00F Current Detection Power Supply Motor Circuits factory
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Specifications
Resistance:
Power(Watts):
330mW
Tolerance:
±1%
Mfr. Part #:
SR732BTTD1R00F
Package:
1206
Key Attributes
Model Number: SR732BTTD1R00F
Product Description

Product Overview

The SR73 series are low resistance flat chip resistors designed for current detection in power supply and motor circuits. They offer high reliability and performance with a resistance tolerance of 0.5% and a temperature coefficient of 10010-6/K. These resistors are suitable for both reflow and flow soldering and meet EU-RoHS requirements for lead-free termination. They are AEC-Q200 qualified (excluding 1H type).

Product Attributes

  • Brand: KOA
  • Product Line: SR73
  • Type: Low Resistance Flat Chip Resistors (THICK FILM)
  • Certifications: IEC 60115-8, JIS C 5201-8, EIAJ RC-2134C, AEC-Q200 (Excluding 1H)
  • Environmental Compliance: EU-RoHS
  • Coating Color: Black (1H), Indigo (1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2)
  • Terminal Surface Material: Lead-free plating is standard. T is available for 1H, W2H, W3A, W3A2. Gold plated electrodes available for 1J, 2A, 2B (0.1 to 10).

Technical Specifications

Type (Inch Size Code) Dimensions (mm) L x W x t Weight (g/1000pcs) Power Rating Rated Ambient Temp. Rated Terminal Part Temp. T.C.R. (10-6/K) Resistance Range () Taping & Qty /Reel (pcs)
1H (0201) 0.60.03 x 0.30.03 x 0.230.03 0.14 0.1W 70 0+4000 110 (D,F), 0.2710 (TCM), 0.20.47 (TPL/TP), 0.10.18 (TD/TE) TCM: 15,000
1E (0402) 1.0 x 0.5 x 0.350.05 0.68 0.166W 70 125 2000 0.5110.0 (D,F), 0.20.47 (TCM), 0.10.18 (TPL/TP/TD/TE) TPL: 20,000, TP: 10,000
1J (0603) 1.60.2 x 0.8 x 0.450.1 2.14 0.2W 70 125 2000 1.110. (D,F), 0.25W: 0.11 (D,F) TP: 10,000, 5,000
2A (0805) 2.00.2 x 1.250.1 x 0.50.1 4.54 0.33W 70 125 1000 0.1510 (D,F), 0.110. (G,J) TP: 10,000, 5,000, 4,000
2B (1206) 3.20.2 x 1.60.2 x 0.60.1 9.14 0.33W 70 125 1000 0.1510 (D,F), 0.110. (G,J) 5,000, 4,000
2E (1210) 2.60.2 x 2.60.2 x 0.60.1 15.50 0.5W 70 125 1000 0.110. (D,F), 0.04710.00 (G,J) 5,000, 4,000
W2H (2010) 5.00.2 x 2.50.2 x 0.650.15 24.30 0.75W 70 125 1000 0.110. (D,F), 0.110. (G,J) 4,000
W3A (2512) 6.30.2 x 3.10.2 x 0.70.1 37.10 1W 70 125 1000 0.110. (D,F), 0.110. (G,J) 4,000
W3A2 (2512) 6.30.2 x 3.10.2 x 0.70.1 37.10 2W 95 1000 0.110. (D,F), 0.110. (G,J) 4,000

Performance

Test Items Performance Requirements Limit Typical Test Methods
Resistance Within specified tolerance R(+0.005) 25
T.C.R. Within specified T.C.R +25/55 and +25/+125
Overload (Short time) 2 (1H), 0.5 (1EW3A2) 3:1H, 1:1EW3A2 Rated voltage2.5 for 5s (W3A2: Rated voltage2.0 for 5s)
Resistance to soldering heat 0.75 (1H), 0.3 (1EW3A2) 1 (1EW3A2) 2605, 10s1s
Rapid change of temperature 1 (1H), 0.3 (1EW3A2) 40 (30min.)/+125 (30min.) 100 cycles
Moisture resistance 3 (1H), 2 (1EW3A2) 1.5 402, 90%95%RH, 1000h (1.5h ON/0.5h OFF cycle) 70

Applications

  • Current detecting resistors for power supply, motor circuits, etc.
  • Car electronics, Computers, HDDs, Cellular-telephones, Power supplies, and Motor circuits, etc.

Features

  • Current detecting resistors for power supply, motor circuits, etc.
  • High reliability and performance with resistance tolerance 0.5%, T.C.R. 10010-6/K.
  • Suitable for both reflow and flow solderings.
  • Products with lead free termination meet EU-RoHS requirements. EU-RoHS regulation is not intended for Pb-glass contained in electrode, resistor element and glass.
  • AEC-Q200 qualified (Exemption 1H).

Precautions for Use

  • The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal expansion from a mounting board when heat stress like heat cycle, etc. are repeatedly given to them. Care should be taken to the occurrence of the cracks when the change in ambient temperature or ON / OFF of load is repeated, especially when large types of W2H/W3A/W3A2 which have large thermal expansion and also self heating. By general temperature cycle test using glass-epoxy(FR-4) boards under the maximum/minimum temperatures of operating temperature range, the crack does not occur easily in the types of 1H2E, but the crack tends to occur in the types of W2H/W3A/W3A2. The occurrence of the crack by heat stress may be influenced by the size of a pad, solder volume, heat radiation of mounting board etc., so please pay careful attention to designing when a big change in ambient temperature and conditions for use like ON/OFF of load can be assumed.
  • The resistance value after soldering may change depending on the size of pad pattern or solder amount. Make sure the effect of decline/increase of resistance value before designing.

2410121322_KOA-SR732BTTD1R00F_C186621.pdf
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