Product Overview

This product is a series of solid tantalum chip capacitors designed and manufactured for surface mount technology. They offer lower equivalent series resistance (ESR) compared to resin-encased products and are suitable for automatic surface mounting. These capacitors are widely used in sophisticated military, computer, and mobile phone applications. They comply with EIA535BAAC, QC300801, and Q/YHC.45-01 technical standards.

Product Attributes

• Type: Multilayer Ceramic Capacitor (also referred to as Tantalum Capacitor)
• Case Codes: P, A, B, C, D, E, E1
• Compliance Standards: EIA535BAAC, QC300801, Q/YHC.45-01

Technical Specifications

Parameter Characteristics

To ensure stable performance and quality, capacitors must be used correctly. Always verify operating conditions and specified performance against the datasheet. Avoid exceeding rated voltage, especially in low-impedance circuits. For low-impedance circuits, set operating voltage to 1/3 of rated voltage. For other circuits, set operating voltage to 2/3 of rated voltage. Control instantaneous large currents with series resistance ( 3 /Vs recommended) to limit current to < 300mAs. If a protection resistor cannot be used, operate at 1/3 of rated voltage. Tantalum capacitors are polarized; do not apply reverse voltage or use in AC-only circuits. Limited reverse voltage is permissible for short durations ( 10% U
R or 1V at 25; 5% U
R or 0.5V at 85). Avoid testing with multimeters without considering polarity. Scrap capacitors subjected to improper reverse voltage. Use within permissible ripple voltage limits; the sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the allowed reverse voltage. Ripple current causes power loss and internal heating, increasing failure probability. Limit ripple current and power loss. Operate within the specified temperature range. Derate voltage for operation above +85. Consider temperature characteristics when operating temperature varies significantly. For safety-critical applications, design protection circuits, protective devices, and systems to ensure safety, and consider redundant circuits to prevent single-point failures. Electrical characteristics change significantly around 10KHz; confirm circuit characteristics for high-frequency applications.

Reliability

Failure rates vary with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Thoroughly review usage conditions before selecting a product.

Capacitor Mounting Precautions

Avoid excessive mechanical or thermal shock during mounting to prevent electrical characteristic deterioration or short circuits. Do not reuse dropped or previously installed capacitors. Do not process or bend terminals after installation. Avoid direct contact with capacitor leads with bare hands to prevent contamination that can affect solderability. When cleaning circuit boards, remove flux and residues of acids/alkalis quickly. Cleaning temperature should be below 50, with total immersion time (ultrasonic, steam) within 5 minutes. For soldering iron use, keep tip temperature below 350 and application time within 4 seconds, avoiding contact with the capacitor body. For chip type soldering (manual or reflow), avoid highly active or acidic fluxes. Follow specified conditions for reflow soldering (jet or reflection method). For wave soldering, fix components with adhesive and dip directly into solder. Ensure adequate venting if component density is high. Preheat below 160 for 2 minutes. Cool slowly after soldering. For other methods, confirm and consult. Ensure solder pads do not exceed terminal faces to prevent dislocation during melting. For reflow soldering, adhere to specified conditions.

Usage Environment

Do not use in environments with direct contact with water, brine, or oil. Avoid direct sunlight. Do not use in high temperature/humidity environments where condensation may occur. Avoid environments with reactive gases, acids, bases, high-frequency wave induction, excessive vibration, or shock.