Product Overview

This product features a compact design, low leakage current, and minimal dissipation factor, offering stable frequency and temperature characteristics for extended lifespan and high reliability. Encapsulated with imported, high-quality moisture-proof and flame-retardant epoxy resin and utilizing laser printing technology, it operates within a wide temperature range and maintains stable performance after prolonged use or storage. It is suitable for advanced military, computer, automotive, communication, and home appliance applications. The product adheres to IEC 384-15-3 technical specifications and complies with GB 7215-87 standards.

Product Attributes

• Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
• Manufacturing Technology: Laser printing
• Compliance Standards: IEC 384-15-3, GB 7215-87

Technical Specifications

General Characteristics

Table 1: Performance Characteristics

Case Size (mm)

Dimensions in mm and Rated Voltage

C42 Through-hole Tantalum Capacitor

Marking and Packaging

Circuit Design Considerations

• Operating Voltage: Reduce voltage appropriately for higher reliability. In low impedance circuits, set operating voltage to 1/3 of rated voltage; in other circuits, 2/3 of rated voltage.
• Reverse Voltage: Tantalum capacitors are polarized; avoid reverse voltage or AC-only circuits. Short-term, low reverse voltage is permissible (10%Ur or 1V at 25; 5%Ur or 0.5V at 85). For long-term use in reverse circuits, use non-polarized capacitors. Avoid non-polarized testing with multimeters. Discard capacitors subjected to improper reverse voltage.
• Ripple Voltage: Operate within permissible ripple voltage limits. The sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the permissible reverse voltage. Limit ripple current to prevent self-heating and failure.
• Environmental Temperature: Use within specified temperature range. Derate voltage above +85. Confirm circuit characteristics at temperature limits. General derating to below 65%UR is recommended. For safety-critical equipment, design protective circuits and redundant systems.
• Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics at high frequencies.
• Reliability: Failure rate varies with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Select products after thorough review of usage conditions.

Capacitor Mounting Precautions

• Avoid excessive mechanical or thermal shock during mounting on PCBs to prevent electrical characteristic deterioration or short circuits.
• Do not apply excessive external force during use or measurement to avoid damaging the capacitor body or lead terminals.
• Do not reuse dropped or previously installed capacitors.
• Do not process capacitors or bend terminals after installation.
• Avoid direct contact with bare hands on lead wires during measurement and use to prevent contamination (sweat, oil stains) that can cause poor solderability.

Circuit Board Cleaning

• Remove flux quickly after soldering. Neutralize acids/alkalis. Cleaning temperature should be below 50. Total immersion time (ultrasonic, steam) should be within 5 minutes.

Soldering by Soldering Iron

• Soldering iron tip temperature: 350. Soldering time: 4 seconds. Ensure the soldering iron tip does not touch the capacitor body.

Chip Type Soldering

• Avoid highly active, strong acid fluxes to prevent corrosion.
• Wave Soldering (Solder Dip): Fix component with adhesive and dip directly into solder pot. Preheating: 160, within 2 minutes. Cool slowly after soldering. Note: High mounting density can reduce solderability; ensure proper venting.
• Other Methods (Hot Plate, Vapor Phase): Confirm and consult for specific conditions. Avoid solder pad significantly larger than terminal face to prevent dislocation.
• Reflow Method: (Conditions not fully specified, but implies controlled heating).

Usage Environment Restrictions

• Do not use in environments with direct contact with water, brine, or oil.
• Avoid direct sunlight.
• Avoid high temperature and humidity causing condensation.
• Avoid contact with reactive gases.
• Avoid acidic or alkaline environments.
• Avoid environments with high-frequency wave induction.
• Avoid environments with excessive vibration or shock.