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quality Low resistance flat chip resistors KOA SR731JTTDR820F for current detection in power supply circuits factory
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quality Low resistance flat chip resistors KOA SR731JTTDR820F for current detection in power supply circuits factory
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Specifications
Power(Watts):
250mW
Resistance:
820mΩ
Temperature Coefficient:
±200ppm/℃
Operating Temperature:
-55℃~+150℃
Type:
Thick Film Resistor
Tolerance:
±1%
Mfr. Part #:
SR731JTTDR820F
Package:
0603
Key Attributes
Model Number: SR731JTTDR820F
Product Description

Product Overview

The SR73 series are low resistance flat chip resistors designed for current detection in power supply and motor circuits. They offer high reliability and performance with a resistance tolerance of 0.5% and a temperature coefficient of 10010-6/K. These resistors are suitable for both reflow and flow soldering and meet EU-RoHS requirements for lead-free termination. They are AEC-Q200 qualified (excluding 1H type).

Product Attributes

  • Brand: KOA
  • Product Line: SR73
  • Type: Low Resistance Flat Chip Resistors
  • Certifications: EU-RoHS, AEC-Q200 (Exemption 1H)
  • Material: Ceramic substrate, resistive film, internal electrode, Ni plating, solder plating
  • Coating Color: Black (1H), Indigo (1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2)
  • Origin: Japan (implied by manufacturer)

Technical Specifications

TypeInch Size CodeDimensions (mm) L x W x tPower RatingRated Ambient Temp. (C)Rated Terminal Part Temp. (C)Resistance ToleranceResistance Value Range ()T.C.R. (10-6/K)Taping & Qty /Reel (pcs)Weight (g/1000pcs)
1H02010.60.03 x 0.30.03 x 0.230.030.1W70D:0.5%
F:1%
110
0.2710
0+4000
0+5000
TCM: 15,0000.14
1E04021.0 x 0.5 x 0.350.050.166W70125D:0.5%
F:1%
G:2%
J:5%
0.5110.0
0.20.47
0.10.18
2000
3000
5000
TPL: 20,000
TP: 10,000
0.68
1J06031.60.2 x 0.8 x 0.450.10.2W70125D:0.5%
F:1%
G:2%
J:5%
1.110.
0.11.
0.10.18
2000
3000
5000
TP: 10,000
5,000
2.14
1J06031.60.2 x 0.8 x 0.450.10.25W70125D:0.5%
F:1%
G:2%
J:5%
0.11.
0.10.18
2000
3000
5000
TP: 10,000
5,000
2.14
2A08052.00.2 x 1.250.1 x 0.50.10.33W70125D:0.5%
F:1%
G:2%
J:5%
0.1510
0.110.
0.0510.091
0.030.047
1000
2000
5000
8000
TP: 10,000
5,000
4,000
4.54
2A08052.00.2 x 1.250.1 x 0.50.10.5W70105D:0.5%
F:1%
G:2%
J:5%
0.1510
0.110.
0.0510.091
0.030.047
1000
2000
5000
8000
TP: 10,000
5,000
4,000
4.54
2B12063.20.2 x 1.60.2 x 0.60.10.33W70125D:0.5%
F:1%
G:2%
J:5%
0.1510
0.110.
0.0560.091
0.030.051
1000
2000
5000
8000
5,000
4,000
9.14
2B12063.20.2 x 1.60.2 x 0.60.10.5W70110D:0.5%
F:1%
G:2%
J:5%
0.1510
0.110.
0.0560.091
0.030.051
1000
2000
5000
8000
5,000
4,000
9.14
2E12102.60.2 x 2.00.2 x 0.60.10.5W70125D:0.5%
F:1%
G:2%
J:5%
0.110.
0.04710.00
0.0360.043
0.0240.033
1000
2000
5000
1000
5,000
4,000
15.50
2E12102.60.2 x 2.00.2 x 0.60.10.66W70110D:0.5%
F:1%
G:2%
J:5%
0.110.
0.04710.00
0.0360.043
0.0240.033
1000
2000
5000
1000
5,000
4,000
15.50
W2H20105.00.2 x 2.50.2 x 0.650.150.75W70125D:0.5%
F:1%
G:2%
J:5%
0.110.
0.0560.091
0.0330.051
1000
2000
5000
8000
4,00024.30
W3A25126.30.2 x 3.10.2 x 0.70.11W70125D:0.5%
F:1%
G:2%
J:5%
0.110.
0.0560.091
0.0390.051
1000
2000
5000
8000
4,00037.10
W3A225126.30.2 x 3.10.2 x 0.70.12W7095D:0.5%
F:1%
G:2%
J:5%
0.110.
0.0560.091
0.0390.051
1000
2000
5000
8000
4,00037.10

Features & Applications

  • Features: Current detecting resistors for power supply, motor circuits, etc. High reliability and performance (0.5% tolerance, 10010-6/K TCR). Suitable for reflow and flow soldering. Lead-free termination meets EU-RoHS. AEC-Q200 qualified (Exemption 1H).
  • Applications: Car electronics, Computers, HDDs, Cellular-telephones, Power supplies, Motor circuits, etc.

Derating Curve

For resistors operated at an ambient temperature of 70 or above, or at a terminal part temperature above the specified limit, power rating shall be derated in accordance with the provided derating curves.

Precautions for Use

  • Alumina substrate can lead to solder joint cracks under thermal stress (heat cycles). Larger types (W2H, W3A, W3A2) are more susceptible due to larger thermal expansion and self-heating. Careful design is needed for applications with significant ambient temperature fluctuations or frequent load ON/OFF cycles. Factors like pad size, solder volume, and board heat dissipation influence crack occurrence.
  • Soldering pad pattern size and solder amount can affect post-soldering resistance values. Verify the impact of resistance change on equipment design beforehand.

2410121322_KOA-SR731JTTDR820F_C186570.pdf
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