Product Overview
This product features imported, high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology, resulting in a compact size with low leakage current and dielectric loss. It offers excellent frequency and temperature characteristics, long lifespan, high reliability, and good stability across a wide operating temperature range. Its performance remains stable during prolonged operation and after storage. This product is suitable for advanced military, computer, automotive, communication, and home appliance applications. It adheres to the International Electrotechnical Commission (IEC) 384-15-3 technical specifications and complies with the GB7215-87 standard.
Product Attributes
- Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
- Printing Technology: Laser printing
- Compliance Standards: IEC 384-15-3, GB7215-87
Technical Specifications
| Specification | Details |
|---|---|
| Operating Temperature Range | -55 to +125 (voltage derating required above 85) |
| Capacitance Tolerance | 10%, 20%, 5% (special order) |
| Capacitance Range | 0.1F to 330F |
| DC Leakage Current (20) | I 0.01CRUR or 1A (whichever is greater) |
| Dissipation Factor (20) | See Table 1 |
| Temperature Performance | See Table 1 |
| Life Test | 1000 hours |
| Case Sizes (Dmax x Hmax x H1max) | A: 3.5 x 6.0 x 9.3 mm, B: 3.8 x 6.5 x 9.8 mm, C: 4.4 x 7.5 x 10.5 mm, D: 4.8 x 8.5 x 11.5 mm, E: 5.2 x 9.5 x 12.5 mm |
| Maximum Weight (g) | A: 0.45, B: 0.5, C: 0.6, D: 0.7, E: 0.8 |
| Marking | See Marking Section |
| Packaging | T: Tape/Reel, B: Bulk |
| Operating Voltage Guidance (Low Impedance Circuit) | 1/3 of rated voltage |
| Operating Voltage Guidance (Other Circuits) | 2/3 of rated voltage |
| Recommended Protection Resistor | 3 /Vs (to limit current below 300mAs) |
| Reverse Voltage (25) | 10% Ur or 1V (whichever is smaller) |
| Reverse Voltage (85) | 5% Ur or 0.5V (whichever is smaller) |
| Soldering Iron Temperature Limit | 350, within 4 seconds |
| Preheating Temperature (Wave Soldering) | 160, within 2 minutes |
Table 1: Capacitance Variations, Dissipation Factor, and Leakage Current at Different Temperatures
| Capacitance (uF) | Capacitance Change (%) | Max D.F. (%) | Max DCL (uA) | ||||||
|---|---|---|---|---|---|---|---|---|---|
| -55 | +85 | +125 | -55 | +20 | +85 | +125 | +85 | +125 | |
| 1.0 | 10 | 15 | 25 | 6 | 4 | 6 | 6 | 10 I | 12.5 I |
| 1.56.8 | 8 | 6 | 8 | 8 | 10 | 10 | 10 | 100 | 100 |
| 1068 | 10 | 8 | 10 | 10 | 10 | 10 | 10 | 100 | 100 |
| 100680 | 12 | 10 | 12 | 12 | 10 | 10 | 10 | 100 | 100 |
Capacitor Mounting Precautions: Avoid excessive mechanical or thermal shock during installation to prevent electrical characteristic deterioration or short circuits. Do not reuse dropped or previously installed capacitors. Do not process or bend terminals after installation. Avoid direct contact with leads to prevent contamination affecting solderability.
Circuit Board Cleaning: Remove flux, acids, and alkalis quickly. Cleaning temperature should be below 50, with total immersion time (ultrasonic, steam) under 5 minutes.
Environment Precautions: Do not use in environments with direct contact with water, brine, oil, direct sunlight, high temperature/humidity with condensation, reactive gases, acids/alkalis, high-frequency wave induction, excessive vibration, or shock.
2410121635_KNSCHA-178MU0029_C18164670.pdf
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