Tantalum Chip Capacitors
Product Overview
These are solid tantalum chip capacitors specifically designed and manufactured for surface mount technology. They offer a lower equivalent series resistance (ESR) compared to resin-encased CA42 tantalum capacitors. Suitable for automatic surface mounting, these capacitors are widely used in sophisticated military, computer, and mobile phone applications. They comply with EIA535BAAC and QC300801, Q/YHC.45-01 technical standards.
Product Attributes
- Type: Solid Tantalum Chip Capacitors
- Standards Compliance: EIA535BAAC, QC300801, Q/YHC.45-01
Technical Specifications
| Feature | Specification |
|---|---|
| Operating Temperature Range | -55 to +125 (Voltage derating required above 85) |
| Capacitance Tolerance | 10%, 20% |
| Capacitance Range | 0.1F to 680F |
| Voltage Rating | 4V to 50V |
| DC Leakage Current (20) | I0 0.01CRUR or 1A (whichever is greater) |
| Dissipation Factor (20) | See Table 1 |
| Temperature Performance | See Table 1 |
| Climatic Category | 55/125/20 |
| Life Test | 2000 hours |
| Reliability | 2% per 1000h at 85 with 0.1 /V series impedance, 60% confidence level |
Case Codes and Dimensions
| Case Code | L (mm) | W (mm) | H (mm) | P (mm) | TW (mm) |
|---|---|---|---|---|---|
| 2012 | 2.00.2 | 1.20.2 | 1.20.2 | 0.50.2 | 1.20.1 |
| 3216 | 3.20.2 | 1.60.2 | 1.60.2 | 0.80.3 | 1.20.1 |
| 3528 | 3.50.2 | 2.80.2 | 1.90.2 | 0.80.3 | 2.20.1 |
| 6032 | 6.00.3 | 3.20.3 | 2.50.3 | 1.30.3 | 2.20.1 |
| 7343 | 7.30.3 | 4.30.3 | 2.80.3 | 1.30.3 | 2.40.1 |
| 7343H | 7.30.3 | 4.30.3 | 4.00.3 | 1.30.3 | 2.40.1 |
Capacitance vs. Case Code Selection
| Capacitance (F) | Voltage Rating (V) | Available Case Codes |
|---|---|---|
| 0.1 - 0.33 | 4 | A |
| 0.47 | 4 | A |
| 0.68 | 4 | A/B |
| 1.0 | 4 | A |
| 1.5 | 4 | A/B |
| 2.2 | 4 | A/B |
| 3.3 | 4 | B/C |
| 4.7 | 4 | C/D |
| 6.8 | 4 | D/E |
| 10 | 4 | D/E |
| 15 | 4 | D/E |
| 22 | 4 | E |
| 33 | 4 | E |
| 47 | 4 | E |
| 68 | 4 | E |
| 100 | 4 | E |
| 150 | 4 | E |
| 220 | 4 | E |
| 330 | 4 | E |
| 470 | 4 | E |
| 680 | 4 | E |
| 1.5 | 6.3 | A |
| 2.2 | 6.3 | A |
| 3.3 | 6.3 | A |
| 4.7 | 6.3 | A/B |
| 6.8 | 6.3 | A/B |
| 10 | 6.3 | A/B/C |
| 15 | 6.3 | A/B/C |
| 22 | 6.3 | B/C |
| 33 | 6.3 | B/C/D |
| 47 | 6.3 | C/D |
| 68 | 6.3 | C/D/E |
| 100 | 6.3 | D/E |
| 150 | 6.3 | D/E |
| 220 | 6.3 | E |
| 1.0 | 10 | A |
| 1.5 | 10 | A/B |
| 2.2 | 10 | A/B |
| 3.3 | 10 | A/B/C |
| 4.7 | 10 | A/B/C |
| 6.8 | 10 | B/C/D |
| 10 | 10 | B/C/D |
| 15 | 10 | C/D |
| 22 | 10 | C/D/E |
| 33 | 10 | C/D/E |
| 47 | 10 | D/E |
| 68 | 10 | D/E |
| 100 | 10 | D/E |
| 150 | 10 | E |
| 1.0 | 16 | A/B |
| 1.5 | 16 | A/B |
| 2.2 | 16 | A/B |
| 3.3 | 16 | A/B/C |
| 4.7 | 16 | A/B/C |
| 6.8 | 16 | B/C |
| 10 | 16 | B/C/D |
| 15 | 16 | C/D |
| 22 | 16 | C/D |
| 33 | 16 | D/E |
| 47 | 16 | D/E |
| 68 | 16 | D/E |
| 1.0 | 20 | A |
| 1.5 | 20 | A/B |
| 2.2 | 20 | A/B |
| 3.3 | 20 | A/B/C |
| 4.7 | 20 | B/C |
| 6.8 | 20 | B/C |
| 10 | 20 | B/C/D |
| 15 | 20 | C/D |
| 22 | 20 | C/D/E |
| 33 | 20 | D/E |
| 47 | 20 | D/E |
| 1.0 | 25 | A |
| 1.5 | 25 | A/B |
| 2.2 | 25 | A/B |
| 3.3 | 25 | A/B |
| 4.7 | 25 | B/C |
| 6.8 | 25 | B/C |
| 10 | 25 | B/C |
| 15 | 25 | C/D |
| 22 | 25 | C/D |
| 33 | 25 | D/E |
| 47 | 25 | D/E |
| 1.0 | 35 | A/B |
| 1.5 | 35 | A/B |
| 2.2 | 35 | A/B |
| 3.3 | 35 | A/B |
| 4.7 | 35 | A/B/C |
| 6.8 | 35 | B/C |
| 10 | 35 | B/C |
| 15 | 35 | B/C/D |
| 22 | 35 | C/D |
| 33 | 35 | C/D/E |
| 47 | 35 | D/E |
| 1.0 | 50 | A/B |
| 1.5 | 50 | C |
| 2.2 | 50 | B/C |
| 3.3 | 50 | C/D |
| 4.7 | 50 | C/D |
| 6.8 | 50 | C/D |
| 10 | 50 | D |
| 15 | 50 | D |
| 22 | 50 | D/E |
| 33 | 50 | D/E |
| 47 | 50 | E |
Parameter Characteristics and Usage Guidelines
To ensure stable performance and quality, proper usage methods are essential. Always confirm operating conditions and specified performance before use, adhering strictly to the specifications.
1.1 Operating Voltage
Capacitor failure is significantly influenced by the ratio of service voltage to rated voltage. In practical circuit design, reduce voltage appropriately based on required reliability. For low impedance circuits, set service voltage at or below 1/3 of the rated voltage. For other circuits, keep service voltage at or below 2/3 of the rated voltage. In low impedance circuits, parallel use increases the risk of DC inrush current failure. Be mindful of stored charge in parallel capacitors discharging through others. Control instantaneous large current impacts on capacitors by recommending series resistance of 3 /Vs or higher to limit current below 300mAs. If a protection resistor cannot be inserted, use a voltage below 1/3 of the rated voltage.
1.2 Reverse Voltage
Tantalum capacitors are polarized; do not apply reverse voltage or use in AC-only circuits. If unavoidable, small reverse voltage is permissible for short durations: 10%Ur or 1V (whichever is smaller) at 25; 5%Ur or 0.5V (whichever is smaller) at 85. For long-term use in reverse circuits, select non-polarized capacitors. Do not use multimeters to test circuits or capacitors without considering polarity. If a capacitor is subjected to improper reverse voltage during measurement, it must be scrapped, even if electrical parameters appear normal.
1.3 Ripple Voltage
Use within the capacitor's permissible ripple voltage. The sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the capacitor's allowed reverse voltage. Ripple current causes power loss and internal temperature rise, increasing thermal breakdown failure probability. Limit ripple current or allowable power loss.
1.4 Environmental Temperature
Use within the specified operating temperature range. For temperatures exceeding +85, use derated voltage. Temperature characteristics are critical; confirm circuit performance at temperature limits. Generally, failure rate is based on 1000 hours of continuous rated voltage at +85. Derating is necessary due to voltage/current peaks, ripple, and electrical shocks. A general derating to below 65%UR is recommended. For safety-critical equipment, prevent short circuits and open circuits. Design protective circuits, devices, and systems. Implement redundant circuits to prevent total system failure from a single fault.
1.5 Frequency Dependence
Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics when using high-frequency circuits.
1.6 Reliability
Failure rate varies with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Select products after thorough evaluation of usage conditions.
Capacitor Mounting Precautions
Avoid excessive mechanical or thermal shock during mounting on PCBs to prevent deterioration of electrical characteristics or short circuits. Confirm actual mounting conditions before use. Do not reuse dropped or previously mounted capacitors. Do not process or bend terminals after installation. Avoid direct contact with bare hands on leads during measurement and use to prevent contamination from sweat or oil, which can cause poor solderability.
Circuit Board Cleaning
When cleaning, quickly remove acids, alkalis, and flux residue. Cleaning temperature should be below 50. Total immersion time (ultrasonic, steam) should be within 5 minutes.
Soldering by Soldering Iron
Soldering iron tip temperature should be below 350, with application time within 4 seconds. Ensure the tip does not touch the capacitor body.
Chip Type Soldering
Avoid highly active or acidic fluxes to prevent penetration, corrosion, and diffusion after cleaning, which can affect reliability. Temperature applied to components varies by PCB, component type, size, and sealing. For chip tantalum capacitors, jet or reflection methods can be used under specified conditions.
Wave Soldering (Soldering Dip)
Fix components with adhesive and dip directly into the solder pot. If component density is too high, solderability may decrease; ensure proper venting. Preheat should be below 160 for under 2 minutes. Cool slowly after soldering.
Other Soldering Methods
For methods like heat source contact (hot plate) or vapor soldering, confirm and consult. If the solder pad is significantly larger than the terminal face, solder melt may cause misalignment.
Reflow Method (Atmospheric Heating Method)
Refer to section 2.2 for usage.
Usage Environment
Do not use in environments where the capacitor is in direct contact with water, brine, or oil; exposed to direct sunlight; experiences high temperature and humidity causing condensation; exposed to reactive gases, acids, or bases; or subjected to high-frequency waves, excessive vibration, or shock.
2410121633_KNSCHA-178MU0023_C18164647.pdf
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