Product Overview

This product features imported, high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology, offering a small volume, low leakage current, and low dielectric loss. It boasts good frequency and temperature characteristics, a long lifespan, high reliability, and excellent stability. With a wide operating temperature range, its performance remains stable after prolonged use or storage. It is suitable for cutting-edge military, computer, automotive, communication, and home appliance applications. This product adheres to the International Electrotechnical Commission IEC 384-15-3 technical specification and complies with the GB 7215-87 standard.

Product Attributes

• Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
• Technology: Laser printing
• Standards Compliance: IEC 384-15-3, GB 7215-87

Technical Specifications

General Characteristics

Table 1: Performance Characteristics

Case Size

Dimensions in MM and Rated Voltage

C42 Through-Hole Tantalum Capacitor

Symbol and Dimensions (mm)

Marking and Packaging

Circuit Design Considerations

• Operating Voltage: Capacitor failure is significantly affected by the ratio of service voltage to rated voltage. Reduce voltage appropriately for required reliability. For low impedance circuits, set operating voltage to 1/3 of rated voltage; for other circuits, 2/3 of rated voltage. In low impedance circuits, parallel use increases the risk of DC surge current failure.
• Reverse Voltage: Tantalum capacitors are polarized and must not be subjected to reverse voltage. Avoid AC-only circuits. Small amounts of reverse voltage are permissible for short durations: 10% U_R or 1V (whichever is smaller) at 25; 5% U_R or 0.5V (whichever is smaller) at 85. For long-term use in reverse circuits, use non-polarized capacitors. Multimeter testing without regard to polarity is forbidden. If accidental reverse voltage is applied, scrap the capacitor.
• Ripple Voltage: Use within the specified permissible ripple voltage. The sum of DC bias and AC peak voltage must not exceed the capacitor's rated voltage. The sum of AC negative peak and DC bias must not exceed the capacitor's allowed reverse voltage. Ripple current causes power loss and self-heating, increasing thermal breakdown risk. Limit ripple current or allowable power loss.
• Environmental Temperature: Operate within the specified temperature range. For temperatures exceeding +85, use derated voltage. Temperature characteristics are critical; confirm circuit performance at temperature limits. Derating to below 65% U_R is generally recommended for practical circuits to account for voltage/current peaks, ripple, and other electrical shocks. For safety-critical equipment, prevent short/open circuits by designing protective circuits, devices, and systems, and consider redundant circuits to prevent single-point failures.
• Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics when using high-frequency circuits.
• Reliability: Failure rate varies with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Select products after thorough review of usage conditions.

Capacitor Mounting Precautions

• Avoid excessive mechanical or thermal shock during mounting on PCBs to prevent deterioration of electrical characteristics or short circuits.
• Do not apply excessive external force during use to avoid damaging the capacitor body or lead terminals.
• Do not reuse dropped or previously mounted capacitors.
• After installation, do not process the capacitor or bend terminals.
• Avoid direct contact with capacitor leads (including chip tantalum capacitor leads) with bare hands during measurement and use to prevent contamination from sweat or oil, which can cause poor solderability.

Circuit Board Cleaning

• When cleaning, quickly remove acids, alkalis, and flux used during soldering. Residue is not permitted. Cleaning temperature should be below 50. Total immersion time for ultrasonic or steam cleaning should be within 5 minutes.

Soldering by Soldering Iron

• Soldering iron tip temperature should be below 350, and usage time within 4 seconds. Ensure the soldering iron tip does not touch the capacitor body.

Chip Type Soldering

• Avoid highly active, strong acidic fluxes during manual or reflow soldering to prevent penetration, corrosion, and diffusion after insufficient cleaning, which can affect reliability. Temperatures applied to components vary based on PCB, component type, size, and packaging. Chip tantalum capacitors can be used with jet or reflow methods under specified conditions.
• Wave Soldering (Soldering Dip): Fix the component to the circuit with adhesive and dip directly into the solder pot. Note: Weldability may decrease with high component density; ensure proper venting. Preheating should be below 160 for under 2 minutes. Cool slowly after welding.
• For other methods like hot plate or vapor soldering, confirm and consult. If the solder pad is significantly larger than the terminal face, solder melting may cause misalignment.
• Reflow Method (Atmospheric Heating Method): Use under specified conditions.

Usage Environment

• Do not use in environments with direct contact with water, brine, or oil.
• Do not use in direct sunlight.
• Do not use in high temperature and high humidity environments where condensation may occur on the capacitor surface.
• Do not use in environments with exposure to reactive gases.
• Do not use in acidic or alkaline environments.
• Do not use in environments with high-frequency wave induction.
• Do not use in environments with excessive vibration or shock.