Product Overview

This product features a compact design with high stable performance, utilizing imported high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology. It offers low leakage current and dissipation factor, excellent frequency and temperature characteristics, long lifespan, high reliability, and good stability. With a wide operating temperature range and stable performance after prolonged use or storage, it is suitable for advanced military, computer, automotive, communication, and home appliance applications. The product adheres to the International Electrotechnical Commission IEC 384-15-3 technical specification and complies with the GB 7215-87 standard.

Product Attributes

• Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
• Manufacturing Technology: Laser printing
• Standards Compliance: IEC 384-15-3, GB 7215-87

Technical Specifications

General Characteristics

Table 1: Performance Characteristics

Case Size (mm)

Dimensions and Ratings

Capacitor Mounting Dimensions (mm)

Marking and Packaging

Circuit Design Considerations

• Operating Voltage: Voltage ratio significantly impacts capacitor failure. Reduce voltage appropriately for required reliability. For low impedance circuits, set operating voltage to 1/3 rated voltage; for other circuits, 2/3 rated voltage. In parallel low impedance circuits, be aware of increased risk of DC inrush failure and charge discharge. Control instantaneous large current impact by using a series protection resistor (3/Vs) to limit current below 300mAs, or use voltage 1/3 rated voltage if protection resistor cannot be inserted.
• Reverse Voltage: Tantalum capacitors are polarized. Do not apply reverse voltage or use in AC-only circuits. Limited reverse voltage application is allowed for short durations: 10% U_R or 1V (whichever is smaller) at 25; 5% U_R or 0.5V (whichever is smaller) at 85. For long-term use in reverse circuits, use non-polarized capacitors. Do not test circuits or capacitors with multimeters without considering polarity. Discard capacitors subjected to improper reverse voltage during testing, even if parameters are within limits.
• Ripple Voltage: Use within permissible ripple voltage. The sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the allowed reverse voltage. Ripple current causes power loss, increasing failure probability due to self-heating. Limit ripple current or allowable power loss.
• Environmental Temperature: Use within the specified operating temperature range. Derate voltage when operating above +85. Temperature characteristics are critical; confirm circuit performance at temperature limits. General design benchmarks are based on 1000 hours of continuous rated voltage at +85. Derating is necessary due to voltage/current peaks, ripple current, and electrical shocks. Recommended derating is below 65% U_R. For safety-critical equipment, prevent short circuits and open circuits during use. Design protective circuits and devices, and consider redundant circuits to prevent single-point failures.
• Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics when using in high-frequency circuits.
• Reliability: Failure rate varies with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Select products after thorough review of usage conditions.

Capacitor Mounting Precautions

• When mounting on PCBs, avoid excessive mechanical or thermal shock.
• Do not apply excessive external force during use to prevent damage to the capacitor body or lead terminals.
• Do not reuse dropped or previously installed capacitors.
• Do not process capacitors or bend terminals after installation.
• Avoid direct contact with lead wires (including chip tantalum capacitor leads) with bare hands during measurement and use to prevent contamination from sweat or oil, which can cause poor solderability.

Circuit Board Cleaning

• Remove flux and residues of acids/alkalis quickly. Cleaning temperature should be below 50. Total immersion time (ultrasonic, steam) should be within 5 minutes.

Soldering by Soldering Iron

• Soldering iron tip temperature should be below 350. Use time should be within 4 seconds. Ensure the soldering iron tip does not touch the capacitor body.

Chip Type Soldering

• Avoid highly active, strong acidic fluxes to prevent penetration, corrosion, and diffusion after cleaning. Temperature applied to components varies based on PCB, component type, size, and packaging. Jet or reflow methods can be used for chip tantalum capacitors under specified conditions.
• Wave Soldering (Soldering Dip): Fix component with adhesive and immerse directly in solder pot. Preheating should be below 160 for within 2 minutes. Cool slowly after soldering.
• For other methods (heat source contact, vapor welding), confirm conditions. Excessive solder pad size compared to terminal face may cause misalignment during solder melting.
• Reflow Method: See details in provided documentation (not fully detailed in source text).

Usage Environment

• Do not use in environments with direct contact with water, brine, or oil.
• Avoid direct sunlight.
• Do not use in high temperature/humidity environments where condensation occurs.
• Avoid environments with reactive gases.
• Avoid acid or base environments.
• Avoid environments with high-frequency wave induction.
• Avoid environments with excessive vibration or shock.