Product Overview
This series of tantalum capacitors utilizes imported high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology. They offer a compact size, low leakage current and dielectric loss, excellent frequency and temperature characteristics, long lifespan, high reliability, and good stability. With a wide operating temperature range and stable performance after prolonged use or storage, these capacitors are suitable for advanced military, computer, automotive, communication, and home appliance applications. The products comply with the International Electrotechnical Commission IEC384-15-3 technical specifications and the GB7215-87 standard.
Product Attributes
- Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
- Manufacturing Technology: Laser printing
- Compliance Standards: IEC384-15-3, GB7215-87
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| General Characteristics | Operating Temperature | -55 +125 (Voltage derating required above 85) | |||
| General Characteristics | Capacitance Tolerance | 10%, 20%, 5% (special order) | |||
| General Characteristics | Capacitance Range | 0.1uF 330uF | |||
| General Characteristics | DC Leakage Current (20) | I0 0.01CRUR or 1uA (whichever is greater) | |||
| General Characteristics | Dissipation Factor (20) | See Table 1 | |||
| General Characteristics | Temperature Performance | See Table 1 | |||
| General Characteristics | Life Test | 1000 hours | |||
| Table 1: Performance Characteristics | Capacitance (uF) | Capacitance Change (%) at -55, +85, +125 | |||
| Capacitance (uF) | Max D.F. (%) at -55, +20, +85, +125 | ||||
| Capacitance (uF) | Max DCL (uA) at +85, +125 | ||||
| Capacitance (uF) | Values for 1.0, 1.56.8, 1068, 100680 | Refer to table for specific values | |||
| Capacitance (uF) | Values for 0.1 to 330 | Refer to table for specific values | |||
| Case Size | Case Code | Dmax (mm) | Hmax (mm) | H1max (mm) | Max Weight (g) |
| A | 3.5 | 6.0 | 9.3 | 0.45 | |
| B | 3.8 | 6.5 | 9.8 | 0.5 | |
| C | 4.4 | 7.5 | 10.5 | 0.6 | |
| D | 4.8 | 8.5 | 11.5 | 0.7 | |
| E | 5.2 | 9.5 | 12.5 | 0.8 | |
| Capacitance & Rated Voltage | Capacitance (uF) | Code | Rated Voltage (V) for 4, 6.3, 10, 16, 25(20), 35, 50 | Dimensions C, D, E, F, G, H, M | |
| Example: 0.1uF | 104 | A | 4, 6.3, 10, 16, 25(20), 35, 50 | C, D, E, F, G, H, M | |
| Example: 1.0uF | 105 | A, A, A, B | 4, 6.3, 10, 16, 25(20), 35, 50 | C, D, E, F, G, H, M | |
| Example: 330uF | 337 | F, F, F | 4, 6.3, 10, 16, 25(20), 35, 50 | C, D, E, F, G, H, M | |
| C42 Direct Insertion Tantalum Capacitor | Part Number | 178MU0028 | |||
| Dimensions (mm) | Symbol | P | 12.7 1.0 | ||
| Symbol | D | 4.0 0.2 | |||
| Symbol | P0 | 12.7 0.3 | |||
| Symbol | T | 0.5 0.2 | |||
| Symbol | W | 18 1.0 | |||
| Symbol | H | 0 2.0 | |||
| Symbol | H | 16 0.5 | |||
| Symbol | W0 | 5min | |||
| Symbol | S | 2.5 0.5 | |||
| Marking and Packaging | Packaging Form | T: Reel, B: Bulk | |||
| Circuit Design - Operating Voltage | General Derating Recommendation | Below 65% of UR | |||
| Circuit Design - Reverse Voltage | Allowed at 25 | 10% Ur or 1V (whichever is smaller) | |||
| Circuit Design - Reverse Voltage | Allowed at 85 | 5% Ur or 0.5V (whichever is smaller) | |||
| Circuit Design - Ripple Voltage | DC Bias + AC Peak Value | Must not exceed rated voltage | |||
| Circuit Design - Ripple Voltage | AC Negative Peak + DC Bias | Must not exceed allowed reverse voltage | |||
| Circuit Design - Environmental Temperature | Derating Voltage | Required above +85 | |||
| Circuit Design - Frequency Dependence | Significant Change Zone | Around 10KHz | |||
| Reliability | Failure Rate Dependency | Influenced by operating conditions (temp, voltage, resistance, circuit) | |||
| Capacitor Mounting Precautions | Mechanical/Thermal Shock | Can cause electrical characteristic deterioration or short circuits | |||
| Processing and Measurement | Handling | Avoid excessive external force; do not reuse dropped or previously installed capacitors; avoid direct contact with leads to prevent contamination. | |||
| Circuit Board Cleaning | Temperature | Below 50; total ultrasonic/steam immersion time within 5 minutes. | |||
| Soldering by Soldering Iron | Tip Temperature | Below 350; duration within 4 seconds. | |||
| Chip Type Soldering | Flux Type | Avoid highly active, strong acidic fluxes. | |||
| Wave Soldering (Soldering Dip) | Preheating | Below 160, within 2 minutes. | |||
| Usage Environment | Prohibited Environments | Direct contact with water, brine, oil; direct sunlight; high temperature/humidity with condensation; reactive gases; acid/alkali; excessive vibration/shock. |
2410121635_KNSCHA-178MU0028_C18164669.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible