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Specifications
Capacitance:
10uF
Voltage Rating:
25V
Equivalent Series Resistance(ESR):
-
Operating Temperature:
-55℃~+125℃
Tolerance:
±10%
Mfr. Part #:
178MU0024
Package:
Through Hole,P=2.54mm
Key Attributes
Model Number:
178MU0024
Product Description
Product Overview
This product features imported, high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology, offering a compact size, low leakage current and dielectric loss, good frequency and temperature characteristics, long lifespan, high reliability, and excellent stability. It operates within a wide temperature range and maintains stable performance after prolonged use or storage. Applications include advanced military, computer, automotive, communication, and home appliance sectors. The product complies with IEC 384-15-3 technical specifications and GB 7215-87 standards. It is designed for high stable performance, low current leakage and dissipation factor, and stable frequency and temperature, making it suitable for military equipment, computers, telephones, and other electronic products.
Product Attributes
- Encapsulation Material: Imported, high-quality moisture-proof and flame-retardant epoxy resin
- Printing Technology: Laser printing
- Compliance Standards: IEC 384-15-3, GB 7215-87
Technical Specifications
| General Characteristics | ||
|---|---|---|
| Operating Temperature | -55 +125 (Derated voltage above 85) | |
| Capacitance Tolerance | 10%, 20%, 5% (special order) | |
| Capacitance Range | 0.1F330F | |
| DC Leakage Current (20) | I0 0.01CRUR or 1A (whichever is greater) | |
| Dissipation Factor (20) | See Table 1 | |
| Temperature Performance | See Table 1 | |
| Life Test | 1000 hours | |
| Capacitance (F) | Capacitance Change (%) | Max D.F (%) | Max DCL (A) | ||||||
|---|---|---|---|---|---|---|---|---|---|
| -55 | +85 | +125 | -55 | +20 | +85 | +125 | +85 | +125 | |
| 1.0 | 10 | 15 | 25 | 6 | 4 | 6 | 6 | 10 I0 | 12.5 I0 |
| 1.56.8 | 8 | 6 | 8 | 8 | 10 | 8 | 10 | 100 | 100 |
| 1068 | 10 | 8 | 10 | 10 | 10 | 10 | 12 | 100 | 100 |
| 100680 | 12 | 10 | 12 | 12 | 12 | 12 | 12 | 100 | 100 |
| Case Size | Dmax (mm) | Hmax (mm) | H1max (mm) | Max Weight (g) | |
|---|---|---|---|---|---|
| A | 3.5 | 6.0 | 9.3 | 0.45 | |
| B | 3.8 | 6.5 | 9.8 | 0.5 | |
| C | 4.4 | 7.5 | 10.5 | 0.6 | |
| D | 4.8 | 8.5 | 11.5 | 0.7 | |
| E | 5.2 | 9.5 | 12.5 | 0.8 | |
| Capacitance (F) | Code | Rated Voltage (V) | ||||||
|---|---|---|---|---|---|---|---|---|
| 4 | 6.3 | 10 | 16 | 25(20) | 35 | 50 | ||
| 0.1 | 104 | A | A | A | A | A | A | A |
| 0.15 | 154 | A | A | A | A | A | A | A |
| 0.22 | 224 | A | A | A | A | A | A | A |
| 0.33 | 334 | A | A | A | A | A | A | A |
| 0.47 | 474 | A | A | A | A | A | A | A |
| 0.68 | 684 | A | A | A | A | A | A | A |
| 1.0 | 105 | A | A | A | B | B | B | B |
| 1.5 | 155 | A | A | A | C | C | C | C |
| 2.2 | 225 | A | A | A | B | C | C | C |
| 3.3 | 335 | A | A | A | B | B | D | D |
| 4.7 | 475 | A | A | A | B | B | C | D |
| 6.8 | 685 | A | A | B | B | C | D | E |
| 10 | 106 | A | B | B | B | C | D | E |
| 15 | 156 | A | B | C | C | D | E | F |
| 22 | 226 | B | C | C | D | D | E | F |
| 33 | 336 | B | C | D | D | E | F | F |
| 47 | 476 | C | D | D | D | E | F | F |
| 68 | 686 | D | D | D | E | F | F | F |
| 100 | 107 | D | E | E | E | F | F | F |
| 150 | 157 | E | E | E | F | F | F | F |
| 220 | 227 | E | E | E | F | F | F | F |
| 330 | 337 | F | F | F | F | F | F | F |
| Dimensions (mm) | Capacitance (F) | Code | C | D | E | F | G | H | M | |
|---|---|---|---|---|---|---|---|---|---|---|
| C42 Through-hole Tantalum Capacitor | Part No: 178MU0024 | 0.1 | 104 | A | A | A | A | A | A | A |
| 0.15 | 154 | A | A | A | A | A | A | A | ||
| 0.22 | 224 | A | A | A | A | A | A | A | ||
| 0.33 | 334 | A | A | A | A | A | A | A | ||
| 0.47 | 474 | A | A | A | A | A | A | A | ||
| 0.68 | 684 | A | A | A | A | A | A | A | ||
| 1.0 | 105 | A | A | A | B | B | B | B | ||
| 1.5 | 155 | A | A | A | C | C | C | C | ||
| 2.2 | 225 | A | A | A | B | C | C | C | ||
| 3.3 | 335 | A | A | A | B | B | D | D | ||
| 4.7 | 475 | A | A | A | B | B | C | D | ||
| 6.8 | 685 | A | A | B | B | C | D | E | ||
| 10 | 106 | A | B | B | B | C | D | E | ||
| 15 | 156 | A | B | C | C | D | E | F | ||
| 22 | 226 | B | C | C | D | D | E | F | ||
| Symbol | Dimensions (mm) | Symbol | Dimensions (mm) | ||
|---|---|---|---|---|---|
| P | 12.71.0 | D | 4.00.2 | ||
| P0 | 12.70.3 | T | 0.50.2 | ||
| W | 181.0 | H | 02.0 | ||
| H | 160.5 | W0 | 5min | ||
| S | 2.50.5 | 5.00.7 | H2 | 90.75 | |
| P1 | 5.100.5 | 3.850.7 | W2 | 01 | |
| P2 | 6.350.4 | H1 | 32.5max | ||
| P | 1.3max | ||||
Marking and Packaging
Marking: Not specified in detail.
Packaging:
- T: Boxed tape
- B: Bulk
Tape Dimensions: Not specified in detail.
Circuit Design Considerations
- Operating Voltage: Capacitors are sensitive to the ratio of service voltage to rated voltage. Reduce voltage appropriately for required reliability. For low impedance circuits, set operating voltage to 1/3 of rated voltage; for other circuits, 2/3 of rated voltage. In low impedance circuits, parallel use increases risk of DC inrush current failure. Control instantaneous large current impact; recommend series resistance (3/Vs) to limit current to <300mAs. If protection resistors cannot be used, operate at 1/3 rated voltage.
- Reverse Voltage: Tantalum capacitors are polarized; do not apply reverse voltage or use in AC-only circuits. Limited reverse voltage allowed for short periods: 10% UR or 1V (whichever is smaller) at 25; 5% UR or 0.5V (whichever is smaller) at 85. For long-term use in reverse circuits, use non-polarized capacitors. Do not test without considering polarity using a multimeter. If improper reverse voltage is applied, scrap the capacitor.
- Ripple Voltage: Use within permissible ripple voltage. DC bias plus AC peak must not exceed rated voltage. AC negative peak plus DC bias must not exceed allowed reverse voltage. Ripple current causes power loss and self-heating, increasing failure probability. Limit ripple current or allowable power loss.
- Environmental Temperature: Use within specified operating temperature range. Derate voltage when operating above +85. Temperature characteristics are significant; confirm circuit performance at temperature limits. Failure rate is based on 1000 hours at rated voltage at +85. Derating is necessary; generally recommended to 65% UR. For safety-critical equipment, design protection circuits, devices, and systems, and include redundant circuits to prevent single-point failures.
- Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics when using in high-frequency circuits.
- Reliability: Failure rate varies with operating conditions (ambient temperature, applied voltage, circuit resistance, etc.). Consult operating conditions before selecting a product.
Capacitor Mounting Precautions
- Avoid excessive mechanical or thermal shock during mounting on PCBs to prevent electrical characteristic deterioration or short circuits.
- Do not apply excessive external force to the capacitor body or lead terminals to avoid plating peeling or damage.
- Do not reuse dropped or previously mounted capacitors.
- Do not process or bend terminals after installation.
- Avoid direct contact with bare hands on capacitor leads to prevent contamination from sweat or oil, which can lead to poor solderability.
Processing and Measurement
- Circuit Board Cleaning: Remove flux, acids, and alkalis quickly. Cleaning temperature should be below 50. Total immersion time for ultrasonic or steam cleaning should be within 5 minutes.
- Soldering with Soldering Iron: Soldering iron tip temperature should be below 350, with soldering time within 4 seconds. Do not touch the capacitor body with the soldering iron tip.
- Chip Type Soldering: Avoid highly active, strong acidic fluxes. For manual or reflow soldering, consider component packaging and sealing for temperature variations. Chip tantalum capacitors can use jet or reflow methods under specific conditions.
- Wave Soldering (Solder Immersion): Fix component with adhesive and immerse directly in solder pot. If component density is too high, solderability may decrease; ensure proper venting. Preheat below 160 for within 2 minutes. Cool slowly after soldering.
- Other Methods (Hot Plate, Vapor Phase): Confirm and consult for other methods. If the solder pad is significantly larger than the terminal face, solder melt may cause misalignment.
- Reflow Method: Not specified in detail.
Usage Environment
- Do not use in environments with direct contact with water, brine, or oil.
- Avoid direct sunlight.
- Avoid high temperature and high humidity with condensation.
- Avoid contact with reactive gases.
- Avoid acidic or alkaline environments.
- Avoid environments with high-frequency wave induction.
- Avoid environments with excessive vibration or shock.
2410121635_KNSCHA-178MU0024_C18164665.pdf
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