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Specifications
Capacitance:
22uF
Voltage Rating:
16V
Equivalent Series Resistance(ESR):
-
Operating Temperature:
-55℃~+125℃
Tolerance:
±10%
Mfr. Part #:
178MU0040
Package:
Through Hole,P=2.54mm
Key Attributes
Model Number:
178MU0040
Product Description
Product Overview
This series of capacitors utilizes imported high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology. They offer advantages such as small size, low leakage current and dielectric loss, stable frequency and temperature characteristics, long lifespan, high reliability, and excellent stability. With a wide operating temperature range and stable performance after prolonged use or storage, these capacitors are suitable for advanced military, computer, automotive, communication, and home appliance applications. The products comply with the technical specifications of the International Electrotechnical Commission IEC384-15-3 and the GB7215-87 standard.
Product Attributes
- Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
- Manufacturing Technology: Laser printing
- Compliance Standards: IEC384-15-3, GB7215-87
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| General Characteristics | Operating Temperature Range | -55 to +125 (Voltage derating required above 85) | |||
| Capacitance Tolerance | 10%, 20%, 5% (special order) | ||||
| Capacitance Range | 0.1F to 330F | ||||
| DC Leakage Current (20) | I0 0.01CRUR or 1A (whichever is greater) | ||||
| Dissipation Factor (20) | See Table 1 | ||||
| Life Test | 1000 hours | ||||
| Table 1: Performance Characteristics | Capacitance (F) | Capacitance Change (%) @ -55, +85, +125 | |||
| Max D.F. (%) @ 20, +85, +125 | |||||
| Max DCL (A) @ +85, +125 | |||||
| Capacitance Values | 1.0 to 680 | ||||
| Case Size | Case Code | Dmax (mm) | Hmax (mm) | H1max (mm) | Max Weight (g) |
| A | 3.5 | 6.0 | 9.3 | 0.45 | |
| B | 3.8 | 6.5 | 9.8 | 0.5 | |
| C | 4.4 | 7.5 | 10.5 | 0.6 | |
| D | 4.8 | 8.5 | 11.5 | 0.7 | |
| E | 5.2 | 9.5 | 12.5 | 0.8 | |
| Dimensions (mm) | Symbol | Dimension (mm) | Symbol | Dimension (mm) | |
| P: 12.71.0, P0: 12.70.3, T: 0.50.2, W: 181.0, H: 02.0, H: 160.5, W0: 5min, S: 2.50.5, 5.00.7, H2: 90.75, P1: 5.100.5, 3.850.7, W2: 01, P2: 6.350.4, H1: 32.5max, P: 1.3max | |||||
| Marking and Packaging | Marking | Standard marking | Packaging | T: Tape Reel, B: Bulk | |
| Circuit Design Considerations | Operating Voltage | Reduce voltage for higher reliability; below 1/3 rated voltage for low impedance circuits; below 2/3 rated voltage for other circuits. Consider series resistance to mitigate current surges. | |||
| Reverse Voltage | Tantalum capacitors are polarized. Avoid reverse voltage. Small amounts are permissible for short durations (10% UR or 1V at 25; 5% UR or 0.5V at 85). Do not use in AC-only circuits. | ||||
| Ripple Voltage | Ensure DC bias + AC peak does not exceed rated voltage. AC negative peak + DC bias must not exceed permissible reverse voltage. Limit ripple current to prevent overheating. | ||||
| Environmental Temperature | Operate within specified range. Derate voltage above +85. Consider temperature characteristics for circuit stability. Recommended derating to below 65% UR for general use. | ||||
| Frequency Dependence | Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics for high-frequency applications. | ||||
| Reliability | Failure rate depends on operating conditions (temperature, voltage, circuit resistance). Select appropriate products after thorough review of usage conditions. | ||||
| Capacitor Mounting Precautions | Mechanical/Thermal Shock | Avoid excessive mechanical or thermal shock during mounting to prevent electrical characteristic deterioration or short circuits. | |||
| Processing and Measurement | Avoid applying excessive external force. Do not reuse dropped or previously installed capacitors. Do not process or bend terminals after installation. Avoid direct contact with leads to prevent contamination. | ||||
| Circuit Board Cleaning | Remove flux, acid, and alkali residues promptly. Cleaning temperature below 50. Total immersion time (ultrasonic, steam) within 5 minutes. | ||||
| Soldering (Soldering Iron) | Tip temperature below 350, usage time within 4 seconds. Avoid touching the capacitor body with the soldering iron tip. | ||||
| Chip Type Soldering | General | Avoid highly active, strong acidic fluxes. Consider component sealing and temperature variations. Use jet or reflection methods under specified conditions. | |||
| Wave Soldering | Fix component with adhesive. Preheat below 160 for 2 minutes. Cool slowly after soldering. Consider component density and venting. | ||||
| Environmental Restrictions | Do not use in direct contact with water, brine, oil. Avoid direct sunlight, high temperature/humidity with condensation, reactive gases, acidic/alkaline environments, high-frequency wave induction, excessive vibration, or shock. |
2410121635_KNSCHA-178MU0040_C18164681.pdf
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