Product Overview

This product is a high-reliability tantalum capacitor, featuring a compact size, low leakage current, and low dissipation factor. It offers stable frequency and temperature characteristics, a long lifespan, and high reliability, making it suitable for demanding applications in military equipment, computers, automotive, telecommunications, and home appliances. Manufactured using imported high-quality moisture-proof and flame-retardant epoxy resin encapsulation and laser printing technology, it adheres to IEC 384-15-3 and GB 7215-87 standards.

Product Attributes

• Encapsulation Material: Imported high-quality moisture-proof and flame-retardant epoxy resin
• Manufacturing Technology: Laser printing
• Standards Compliance: IEC 384-15-3, GB 7215-87

Technical Specifications

Application Notes

Circuit Design:

• Operating voltage should be appropriately reduced based on required reliability. For low impedance circuits, set operating voltage at 1/3 of rated voltage; for other circuits, below 2/3 of rated voltage.
• In low impedance circuits, parallel use increases the risk of DC inrush failure. Be aware of stored charge discharge between parallel capacitors.
• Control instantaneous large currents. Series resistance ( 3/Vs) is recommended to limit current below 300mAs. If protection resistors cannot be used, operate at below 1/3 of rated voltage.
• Tantalum capacitors are polarized. Do not apply reverse voltage or use in AC-only circuits. Limited reverse voltage is permissible for short durations (10% U_R or 1V at 25; 5% U_R or 0.5V at 85). For long-term use in reverse circuits, use non-polar capacitors. Multimeter testing without regard to polarity is forbidden; scrap capacitors subjected to improper reverse voltage.
• Use within permissible ripple voltage limits. The sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the allowed reverse voltage. Ripple current causes power loss and self-heating, increasing failure probability. Limit ripple current or allowable power loss.
• Use within the specified operating temperature range. Voltage derating is required above +85.
• When ambient temperature changes significantly, confirm circuit characteristics at the upper and lower limits of the operating temperature.
• General design benchmarks are based on a 1000-hour failure rate at +85 with rated voltage. Derating is necessary due to voltage/current peaks, ripple current, and other electrical shocks. A general derating to below 65% U_R is recommended.
• For safety-critical equipment, prevent short circuits and open circuits during use. Design protective circuits and devices. Implement redundant circuits to prevent system failure from a single fault.
• Frequency characteristics change significantly around 10KHz. Confirm circuit characteristics when using high-frequency circuits.
• Failure rate varies with operating conditions (temperature, voltage, circuit resistance). Select appropriate products after thorough review of usage conditions.

Capacitor Mounting Precautions:

• Avoid excessive mechanical or thermal shock during mounting on PCBs to prevent electrical characteristic deterioration or short circuits.
• Do not apply excessive external force during use, which may damage the capacitor body or lead terminals.
• Do not reuse dropped or previously installed capacitors.
• After installation, do not process the capacitor or bend terminals.
• Avoid direct contact with bare hands on lead wires to prevent contamination (sweat, oil) that can cause poor solderability.

Circuit Board Cleaning:

• Remove flux and any residual acids or alkalis quickly. Cleaning temperature should be below 50. Total immersion time for ultrasonic or steam cleaning should be within 5 minutes.

Soldering by Soldering Iron:

• Soldering iron tip temperature should be below 350, with application time within 4 seconds. Ensure the soldering iron tip does not touch the capacitor body.

Chip Type Soldering:

• Avoid highly active, strong acidic fluxes to prevent corrosion and diffusion after cleaning.
• Temperature applied to components varies based on PCB, component size, and packaging.
• Chip tantalum capacitors can be soldered by jet or reflow method under specified conditions.
• Wave Soldering (Soldering Dip): Fix component with adhesive and dip directly into solder pot. Preheating should be below 160 for within 2 minutes. Cool slowly after welding. High mounting density may reduce solderability; ensure proper venting.
• For other methods (hot plate, vapor welding), confirm and consult. Excessive solder pad size relative to terminal face may cause dislocation during solder melting.
• Reflow Method: (Conditions provided in original document).

Usage Environment:

• Do not use in environments with direct contact with water, brine, or oil.
• Avoid direct sunlight.
• Avoid environments with high temperature and humidity leading to condensation.
• Avoid environments with reactive gases.
• Avoid acidic or alkaline environments.
• Avoid environments with high-frequency wave induction.
• Avoid environments with excessive vibration or shock.