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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±20ppm
Load Capacitance:
15pF
Operating Temperature:
-40℃~+85℃
Frequency:
27.13827MHz
Mfr. Part #:
Y322527.13827MGBCX
Package:
SMD3225-4P
Key Attributes
Model Number:
Y322527.13827MGBCX
Product Description
Product Overview
This specification sheet details the SMD-3.2*2.5MM (3225) quartz crystal unit from Shenzhen Jingliyuan Technology Co., Ltd. Designed for reliable frequency control, this component operates at a nominal frequency of 27.13827MHz with a fundamental oscillation mode. It is suitable for applications requiring precise frequency tolerance and stability within a wide operating temperature range.
Product Attributes
- Brand: JLYE
- Origin: Shenzhen, China
- Product Type: SMD-3.2*2.5MM (3225)
- JLY P/N: Y322527.13827MGBCX
Technical Specifications
| Item | Symbol | Min. | Typ. | Max. | Units | Notes |
| Nominal Frequency | F0 | 27.13827 | MHz | |||
| Oscillation Mode | Fundamental | - | ||||
| Load Capacitance | CL | 15 | pF | |||
| Frequency Tolerance | -10 | 10 | ppm | At 253 | ||
| Equivalent Series Resistance | ESR | 40 | ||||
| Drive Level | DL | 100 | W | |||
| Frequency Stability | TC | -20 | 20 | ppm | Over Operating Temp. Range(Ref. to 25) | |
| Operating Temperature | -40 | 85 | ||||
| Storage Temperature | -55 | 125 | ||||
| Aging | -3 | 3 | ppm | Per Year | ||
| Insulation Resistance | 500 | M | At DC 100V | |||
| Shunt Capacitance | C0 | 3 | pF |
Reliability Specifications
| No | Test Item | Test Conditions | Reference |
| 1 | High Temperature High Humidity Storage | Temperature: 853 Relative Humidity:85%RH Time: 96 Hours | JIS C5023 |
| 2 | High Temperature Storage | Temperature: 1253 Time: 96 Hours | MIL-STD-883E Method 1005.8 |
| 3 | Low Temperature Storage | Temperature: -403 Time: 96Hours | MIL-STD-883E Method 1013 |
| 4 | Thermal Shock | Temperature1:-555 Temperature2:855 Temperature change between T1 and T2 5 min 10cycles maintain T1 and T2 for 30 minutes each | MIL-STD-202F Method 107 Condition A |
| 5 | RESISTANCE TO SOLDER HEAT | Solder Temperature: 2605 Time: 101 Seconds | MIL-STD-202F Method 210E |
| 6 | Solderability | The solder pot temperature is 2455 , dwell time 50.5sec | J-STD-002B |
| 7 | Drop Test | 3 Times Free Fall from 75cm height table to 3cm thickness hard wood board | JIS C6701 |
| 8 | MECHANICAL SHOCK | Half sine wave,1000 G 3 Times for all 3 directions XYZ | MIL-STD-202F Method 213B |
| 9 | Vibration | Frequency Range: 10Hz55Hz Amplitude: 0.75mm 2 Hours in each direction, total 6 Hours | MIL-STD-883E Method 2007.3 |
| 10 | Leakage Test | Take measurements with a helium Leakage detector Leakage Rate110 -3Pa cm 3/s | MIL-STD-883E |
Suggested Reflow Profile
| Profiles Feature | ||||||
| Average Ramp-up Rate(Ts max to Tp) | 3/second Max | |||||
| Preheat | Temperature Min (Ts min) | 125 | ||||
| Temperature Max (Ts max) | 200 | |||||
| Time (ts min to ts max ) | (60180) seconds | |||||
| Time maintained above | Temperature(T1) | 217 | ||||
| Time(tp) | (60150) seconds | |||||
| Peak/Classification Temperature(Tp) | 260 | |||||
| Time within 5 of actual Peak Temperature(tp) | (2040) seconds | |||||
| Ramp-down rate | 6/second max | |||||
| Time 25 to Peak Temperature | 8 minutes max | |||||
| Suggest reflow times | 3 Times max |
Package Dimensions
| A | B | C | D | E | F | L1 | W | T |
| 1.5 | 4.0 | 4.0 | 1.75 | 8.0 | 1.0 | 3.6 | 2.9 | 0.3 |
Reel Dimensions
| G | H | I | J | K | L | M |
| 2.5 | 13.5 | 21.6 | 60.0 | 180.0 | 9.5 | 1.6 |
| *3000pcs/Reel | ||||||
2512101755_JLYE-Y322527-13827MGBCX_C53144675.pdf
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