Product Overview
The JIMSON MEA series capacitor is a high-capacitance, compact, non-inductive component designed for various electronic applications. It features high moisture resistance and self-healing properties, making it suitable for coupling, decoupling, by-passing, timing circuits, automatic control systems, communication equipment, and noise suppression.
Product Attributes
- Brand: JIMSON
- Origin: Xiamen, China
- Material: Polyester film dielectric, vacuum evaporated metal electrodes, Mylar tape coating, epoxy resin sealing, solder-plated copper-clad wire leads.
- Color: Yellow
- Certifications: RoHS Compliant (RoHS 2.0)
Technical Specifications
| Specification | Description | Value | Test Conditions |
| Capacitance | Rated Capacitance | 10uF | Measuring frequency: 1kHz, Measuring voltage: 1V |
| Capacitance Tolerance | J=5% | ||
| Rated Voltage | 100VDC | 1.6*UR Unit:VDC (5 S at 20) | |
| Voltage Proof | No permanent breakdown or flashover | ||
| Dissipation Factor (DF) | DF0.8% (C1.0uF) DF1.0% (C>1.0uF) | Measuring frequency: 1kHz, Measuring voltage: 1V | |
| Insulation Resistance | C0.33uF | IR15000M | Measured at rated voltage or less than 100VDC, 1 minute at 20 and RH65% |
| C0.33uF | IR*C3000S | ||
| Endurance | C/C | 8% | 1000 hours with 125% of rated voltage at 85 |
| DF (C>1uF) | 0.30% | ||
| DF (C1uF) | 0.50% | ||
| IR | 50% of the specified value | ||
| Climatic Catalogue | 40/105/21 | ||
| Solderability | Lead circumference coverage | 75% | Solder bath: 2355, bath time: 2.00.5 sec, speed: 256 mm/sec, depth: 1.5+0.5/-0mm from the body |
| Heat Shock | C/C5% DF1.2* | Solder bath: 2605, bath time: 5.00.5 sec, speed: 256 mm/sec, depth: 1.5+0.5/-0mm from the body | |
| Lead Strength | Tensile Strength | No visible damage | Pull: 2.2 LBS, time: 5 sec |
| Bending Strength | No visible damage | Load of lead: 1.1 LBS (body bent 90 degrees and returned) | |
| Vibration | No visible damage | Frequency cycle: 10Hz to 55Hz to 10Hz, Amplitude: 1.5mm in three directions, Time: 2 hours each direction (total 6 hours) | |
| Reference Standard | IEC384-2 grade 1; SJ/T 10873-1996 | ||
| Construction | Dielectric | Polyester film | |
| Construction | Electrodes | Vacuum evaporated metal | |
| Construction | Coating | Out wrapped with Mylar tape and ends sealed with epoxy resin | |
| Construction | Leads | Solder-plated copper-clad wire | |
| Construction | Terminal contact | Electrically welded | |
| Features | Capacitance | High capacitance value available and compact size | |
| Construction | Non-inductive construction | ||
| Moisture Resistance | High property moisture resistance | ||
| Healing | Self-healing | ||
| Application | Circuit Types | Coupling, decoupling, by-passing and timing circuit | |
| Systems | Automatic control system, communication equipment | ||
| Functions | Charging/discharging, lighting, noise suppression and frequency modulation | ||
| Marking | Capacitor Marking | Rated capacitance (e.g., 106), Rated voltage (e.g., 100VDC), Capacitance tolerance (e.g., J), Manufacturer's symbol (JIMSON/JS) | |
| Marking | Package Marking | Product type, rating, quantity, date of manufacture, location of manufacture, manufacturer's name | |
| Terminology | Rated Capacitance (Example) | 224=220,000pF=0.22uF; 225=2,200,000pF=2.2uF | Unit: PF |
| Terminology | Capacitance Unit Conversion | 1F=1,000mF=1,000,000uF=1,000,000,000nF=1,000,000,000,000Pf | |
| Terminology | Capacitance Tolerance Symbols | F=1%, G=2%, J=5%, K=10%, M=20%, N=30% | |
| Terminology | Dissipation Factor | Measure of power loss in a capacitor under AC voltage. Measured at 20 and 1kHz. | tg P/Q |
| Terminology | Insulation Resistance | Ratio of applied DC voltage to leakage current after 1 minute of charging. Expressed in M or MF. | T=20, RH65% |
| Terminology | Self-healing | Ability of metallized film capacitors to isolate a breakdown point by evaporating the metal layer around it, preventing permanent short circuits. | |
| Weatherability Testing | High Temperature (85) | Capacitance drift: +5% max of initial value; DF: <0.2% (at 1KHz) | After thermal stability |
| Low Temperature (-40) | Capacitance drift: -5% max of initial value; DF: <0.15% (at 1KHz) | After thermal stability | |
| Humidity (40, 90-95% RH for 964h + 16h recovery) | Capacitance drift: +3% max of initial value; DF: <0.15% (at 1KHz); IR: >50% of initial value | ||
| Dimensions | Unit | mm | |
| Dimensions | L | 5.0 | |
| Dimensions | W | 32.0 | |
| Dimensions | H | 23.0 | |
| Dimensions | T | 14.0 | |
| Dimensions | D | 0.8 0.05 | |
| Dimensions | Symbol | 106J100VDC | |
| Dimensions | CAP | 10uF | |
| Dimensions | Color | Yellow | |
| Soldering Suggestion | Maximum Soldering Temperature | 270 | 4S |
| Soldering Suggestion | Pre-heating | 105 | 1min |
| Storage Conditions | Environment | Temperature 30, Humidity 70% (in MBB) | Ensures 24 months storage if unopened |
| Storage Conditions | Conditions | Avoid atmospheric contaminants (HCl, H2S, SO2); avoid high temperature and humidity. | Solderability may degrade in air. |
2509180925_Jimson-MEA106J100D03_C7431881.pdf
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