Product Overview
The INPAQ Global RF/Component Solutions MHC S Series is a High Current Chip Bead designed for effective high-frequency noise suppression while capable of handling significant current. These components offer a combination of high current capability with low DCR, making them suitable for high current DC power lines and circuits where a stable ground may be unavailable. The series is RoHS compliant and Pb-free.
Product Attributes
- Brand: INPAQ Global RF/Component Solutions
- Series: MHC S Series
- Material: Chip Ferrite Bead
- Certifications: Pb RoHS
- Soldering: Lead-Free (A Soldering Lead-Free, B Lead-Free for whole chip)
- Packaging: Embossed paper tape (P - 7" reel), Embossed plastic tape (E - 7" reel)
Technical Specifications
| Product Name | Size (EIAJ) | Dimensions (L x W x T) (mm) | Impedance () 25% | Test Freq. (MHz) | DCR () Max. | Rated Current (mA) |
|---|---|---|---|---|---|---|
| MHC 1005-4532 S Series | 1005 (EIA 0402) | 1.000.10 x 0.500.10 x 0.500.10 | 10 | 100 | 0.09 | 2000 |
| MHC 1005-4532 S Series | 1005 (EIA 0402) | 1.000.10 x 0.500.10 x 0.500.10 | 30 | 100 | 0.09 | 2000 |
| MHC 1005-4532 S Series | 1005 (EIA 0402) | 1.000.10 x 0.500.10 x 0.500.10 | 60 | 100 | 0.2 | 1000 |
| MHC 1005-4532 S Series | 1005 (EIA 0402) | 1.000.10 x 0.500.10 x 0.500.10 | 120 | 100 | 0.15 | 1500 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 30 | 100 | 0.04 | 3000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 60 | 100 | 0.04 | 3000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 80 | 100 | 0.04 | 3000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 120 | 100 | 0.07 | 2500 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 220 | 100 | 0.09 | 2000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 300 | 100 | 0.09 | 2000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 470 | 100 | 0.2 | 1000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 600 | 100 | 0.2 | 1000 |
| MHC 1608 S Series | 1608 (EIA 0603) | 1.600.15 x 0.800.15 x 0.800.15 | 1000 | 100 | 0.25 | 800 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 31 | 100 | 0.015 | 6000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 40 | 100 | 0.03 | 4000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 60 | 100 | 0.04 | 3000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 80 | 100 | 0.02 | 5000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 120 | 100 | 0.02 | 5000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 220 | 100 | 0.04 | 3000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 300 | 100 | 0.09 | 2000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 330 | 100 | 0.09 | 2000 |
| MHC 2012 S Series | 2012 (EIA 0805) | 2.000.20 x 1.250.20 x 0.900.20 | 600 | 100 | 0.09 | 2000 |
| MHC 3216 S Series | 3216 (EIA 1206) | 3.200.20 x 1.600.20 x 1.100.20 | 30 | 100 | 0.015 | 6000 |
| MHC 3216 S Series | 3216 (EIA 1206) | 3.200.20 x 1.600.20 x 1.100.20 | 50 | 100 | 0.015 | 6000 |
| MHC 3216 S Series | 3216 (EIA 1206) | 3.200.20 x 1.600.20 x 1.100.20 | 80 | 100 | 0.03 | 4000 |
| MHC 3216 S Series | 3216 (EIA 1206) | 3.200.20 x 1.600.20 x 1.100.20 | 120 | 100 | 0.015 | 6000 |
| MHC 3216 S Series | 3216 (EIA 1206) | 3.200.20 x 1.600.20 x 1.100.20 | 600 | 100 | 0.07 | 2500 |
| MHC 3216 S Series | 3216 (EIA 1206) | 3.200.20 x 1.600.20 x 1.100.20 | 1200 | 100 | 0.2 | 1000 |
| MHC 3225 S Series | 3225 (EIA 1210) | 3.200.20 x 2.500.20 x 1.300.20 | 60 | 100 | 0.15 | 1500 |
| MHC 3225 S Series | 3225 (EIA 1210) | 3.200.20 x 2.500.20 x 1.300.20 | 1000 | 50 | 0.09 | 2000 |
| MHC 4516 S Series | 4516 (EIA 1806) | 4.500.25 x 1.600.20 x 1.600.20 | 60 | 100 | 0.015 | 6000 |
| MHC 4516 S Series | 4516 (EIA 1806) | 4.500.25 x 1.600.20 x 1.600.20 | 850 | 100 | 0.15 | 1500 |
| MHC 4532 S Series | 4532 (EIA 1812) | 4.500.25 x 3.200.25 x 1.500.25 | 80 | 100 | 0.01 | 9000 |
| MHC 4532 S Series | 4532 (EIA 1812) | 4.500.25 x 3.200.25 x 1.500.25 | 120 | 100 | 0.015 | 6000 |
| MHC 4532 S Series | 4532 (EIA 1812) | 4.500.25 x 3.200.25 x 1.500.25 | 600 | 50 | 0.04 | 3000 |
| MHC 4532 S Series | 4532 (EIA 1812) | 4.500.25 x 3.200.25 x 1.500.25 | 1300 | 60 | 0.04 | 3000 |
| General Technical Data | Value |
|---|---|
| Operating Temperature Range | -55 ~ +125 |
| Storage Condition | Less than 40 and 70% RH |
| Storage Time | 6 months (Size: 1005), 12 months (Size: 1608 and above) |
| Soldering Method | Reflow or Wave Soldering |
| Size (EIA SIZE) | 7" REEL Qty. (pcs) |
|---|---|
| 1005 (0402) | 10,000 |
| 1608 (0603) | 4,000 |
| 2012 (0805) | 4,000 |
| 3216 (1206) | 3,000 |
| 3225 (1210) | 2,000 |
| 4516 (1806) | 2,000 |
| 4532 (1812) | 1,000 |
| Test Item | Test Condition | Criteria |
|---|---|---|
| Temperature Cycle | a. Temperature: -40 ~ +85 b. Cycle: 100 cycles c. Dwell time: 30 minutes d. Measurement: at ambient temperature 24 hrs after test completion | a. No mechanical damage b. Impedance value should be within 20 % of the initial value |
| Operational Life | a. Temperature: 125 5 b. Test time: 1000 hrs c. Apply current: full rated current d. Measurement: at ambient temperature 24 hrs after test completion | a. No mechanical damage b. Impedance value should be within 20 % of the initial value |
| Rated Current Test | a. Apply current: full rated current / 5min | Temperature rise should be less than 40 |
| Biased Humidity | a. Temperature: 40 2 b. Humidity: 90 ~ 95 % RH c. Test time: 1000 hrs d. Apply current: full rated current e. Measurement: at ambient temperature 24 hrs after test completion | a. No mechanical damage b. Impedance value should be within 20 % of the initial value |
| Resistance to Solder Heat | a. Solder temperature: 260 5 b. Flux: Rosin c. DIP time: 10 1 sec | a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Impedance value should be within 20 % of the initial value |
| Adhesive Test | a. Reflow temperature: 245 b. Apply force(F): 5 N c. Test time: 10 sec | a. No mechanical damage b. Soldering the products on PCB after the pulling test force > 5 N |
| Steam Aging Test | a. Temperature: 93 b. Test time: 4 hrs(MHC1005) Others: 8 hrs c. Solder temperature: 235 5 d. Flux: Rosin e. DIP time: 5 1 sec | More than 95 % of terminal electrode should be covered with new solder |
| Size | A (mm) | B (mm) | C (mm) |
|---|---|---|---|
| 1005 | 0.4 0.6 | 1.6 2.6 | 0.4 0.7 |
| 1608 | 0.5 0.7 | 2.1 3.1 | 0.65 0.95 |
| 2012 | 1.0 1.2 | 3.0 4.0 | 0.8 1.1 |
| 3216 | 2.0 2.4 | 4.2 5.2 | 1.0 1.4 |
| 3225 | 2.1 2.3 | 4.2 5.2 | 2.2 2.5 |
| 4516 | 3.4 3.7 | 6.3 7.3 | 1.3 1.7 |
| 4532 | 3.4 3.7 | 6.3 7.3 | 2.9 3.2 |
2410121433_INPAQ-MHC1608S221NBP_C19631655.pdf
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