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quality High Current Chip Ferrite Bead INPAQ MHC1608S221NBP for Effective Noise Suppression in DC Power Lines factory
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quality High Current Chip Ferrite Bead INPAQ MHC1608S221NBP for Effective Noise Suppression in DC Power Lines factory
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Specifications
Current Rating:
2A
DC Resistance(DCR):
90mΩ
Tolerance:
±25%
Impedance @ Frequency:
220Ω@100MHz
Mfr. Part #:
MHC1608S221NBP
Package:
0603
Key Attributes
Model Number: MHC1608S221NBP
Product Description

Product Overview

The INPAQ Global RF/Component Solutions MHC S Series is a High Current Chip Bead designed for effective high-frequency noise suppression while capable of handling significant current. These components offer a combination of high current capability with low DCR, making them suitable for high current DC power lines and circuits where a stable ground may be unavailable. The series is RoHS compliant and Pb-free.

Product Attributes

  • Brand: INPAQ Global RF/Component Solutions
  • Series: MHC S Series
  • Material: Chip Ferrite Bead
  • Certifications: Pb RoHS
  • Soldering: Lead-Free (A Soldering Lead-Free, B Lead-Free for whole chip)
  • Packaging: Embossed paper tape (P - 7" reel), Embossed plastic tape (E - 7" reel)

Technical Specifications

Product Name Size (EIAJ) Dimensions (L x W x T) (mm) Impedance () 25% Test Freq. (MHz) DCR () Max. Rated Current (mA)
MHC 1005-4532 S Series 1005 (EIA 0402) 1.000.10 x 0.500.10 x 0.500.10 10 100 0.09 2000
MHC 1005-4532 S Series 1005 (EIA 0402) 1.000.10 x 0.500.10 x 0.500.10 30 100 0.09 2000
MHC 1005-4532 S Series 1005 (EIA 0402) 1.000.10 x 0.500.10 x 0.500.10 60 100 0.2 1000
MHC 1005-4532 S Series 1005 (EIA 0402) 1.000.10 x 0.500.10 x 0.500.10 120 100 0.15 1500
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 30 100 0.04 3000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 60 100 0.04 3000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 80 100 0.04 3000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 120 100 0.07 2500
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 220 100 0.09 2000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 300 100 0.09 2000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 470 100 0.2 1000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 600 100 0.2 1000
MHC 1608 S Series 1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 1000 100 0.25 800
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 31 100 0.015 6000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 40 100 0.03 4000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 60 100 0.04 3000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 80 100 0.02 5000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 120 100 0.02 5000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 220 100 0.04 3000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 300 100 0.09 2000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 330 100 0.09 2000
MHC 2012 S Series 2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 600 100 0.09 2000
MHC 3216 S Series 3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 30 100 0.015 6000
MHC 3216 S Series 3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 50 100 0.015 6000
MHC 3216 S Series 3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 80 100 0.03 4000
MHC 3216 S Series 3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 120 100 0.015 6000
MHC 3216 S Series 3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 600 100 0.07 2500
MHC 3216 S Series 3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 1200 100 0.2 1000
MHC 3225 S Series 3225 (EIA 1210) 3.200.20 x 2.500.20 x 1.300.20 60 100 0.15 1500
MHC 3225 S Series 3225 (EIA 1210) 3.200.20 x 2.500.20 x 1.300.20 1000 50 0.09 2000
MHC 4516 S Series 4516 (EIA 1806) 4.500.25 x 1.600.20 x 1.600.20 60 100 0.015 6000
MHC 4516 S Series 4516 (EIA 1806) 4.500.25 x 1.600.20 x 1.600.20 850 100 0.15 1500
MHC 4532 S Series 4532 (EIA 1812) 4.500.25 x 3.200.25 x 1.500.25 80 100 0.01 9000
MHC 4532 S Series 4532 (EIA 1812) 4.500.25 x 3.200.25 x 1.500.25 120 100 0.015 6000
MHC 4532 S Series 4532 (EIA 1812) 4.500.25 x 3.200.25 x 1.500.25 600 50 0.04 3000
MHC 4532 S Series 4532 (EIA 1812) 4.500.25 x 3.200.25 x 1.500.25 1300 60 0.04 3000
General Technical Data Value
Operating Temperature Range -55 ~ +125
Storage Condition Less than 40 and 70% RH
Storage Time 6 months (Size: 1005), 12 months (Size: 1608 and above)
Soldering Method Reflow or Wave Soldering
Size (EIA SIZE) 7" REEL Qty. (pcs)
1005 (0402) 10,000
1608 (0603) 4,000
2012 (0805) 4,000
3216 (1206) 3,000
3225 (1210) 2,000
4516 (1806) 2,000
4532 (1812) 1,000
Test Item Test Condition Criteria
Temperature Cycle a. Temperature: -40 ~ +85
b. Cycle: 100 cycles
c. Dwell time: 30 minutes
d. Measurement: at ambient temperature 24 hrs after test completion
a. No mechanical damage
b. Impedance value should be within 20 % of the initial value
Operational Life a. Temperature: 125 5
b. Test time: 1000 hrs
c. Apply current: full rated current
d. Measurement: at ambient temperature 24 hrs after test completion
a. No mechanical damage
b. Impedance value should be within 20 % of the initial value
Rated Current Test a. Apply current: full rated current / 5min Temperature rise should be less than 40
Biased Humidity a. Temperature: 40 2
b. Humidity: 90 ~ 95 % RH
c. Test time: 1000 hrs
d. Apply current: full rated current
e. Measurement: at ambient temperature 24 hrs after test completion
a. No mechanical damage
b. Impedance value should be within 20 % of the initial value
Resistance to Solder Heat a. Solder temperature: 260 5
b. Flux: Rosin
c. DIP time: 10 1 sec
a. More than 95 % of terminal electrode should be covered with new solder
b. No mechanical damage
c. Impedance value should be within 20 % of the initial value
Adhesive Test a. Reflow temperature: 245
b. Apply force(F): 5 N
c. Test time: 10 sec
a. No mechanical damage
b. Soldering the products on PCB after the pulling test force > 5 N
Steam Aging Test a. Temperature: 93
b. Test time: 4 hrs(MHC1005) Others: 8 hrs
c. Solder temperature: 235 5
d. Flux: Rosin
e. DIP time: 5 1 sec
More than 95 % of terminal electrode should be covered with new solder
Size A (mm) B (mm) C (mm)
1005 0.4 0.6 1.6 2.6 0.4 0.7
1608 0.5 0.7 2.1 3.1 0.65 0.95
2012 1.0 1.2 3.0 4.0 0.8 1.1
3216 2.0 2.4 4.2 5.2 1.0 1.4
3225 2.1 2.3 4.2 5.2 2.2 2.5
4516 3.4 3.7 6.3 7.3 1.3 1.7
4532 3.4 3.7 6.3 7.3 2.9 3.2

2410121433_INPAQ-MHC1608S221NBP_C19631655.pdf

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