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quality High Current Chip Ferrite Bead INPAQ MHC2012S121UBP for Stable Ground and Power Line Noise Filtering factory
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quality High Current Chip Ferrite Bead INPAQ MHC2012S121UBP for Stable Ground and Power Line Noise Filtering factory
>
Specifications
Current Rating:
5A
DC Resistance(DCR):
20mΩ
Tolerance:
±25%
Impedance @ Frequency:
120Ω@100MHz
Mfr. Part #:
MHC2012S121UBP
Package:
0805
Key Attributes
Model Number: MHC2012S121UBP
Product Description

Product Overview

The INPAQ Global RF/Component Solutions MHC S Series High Current Chip Bead offers a combination of high-frequency noise suppression with the capability of handling high currents. These chip ferrite beads are designed for applications requiring stable ground and high current DC power lines, featuring current ratings up to 6 Amps with low DCR. They are suitable for various industrial and electronic applications where effective noise filtering and high current handling are essential.

Product Attributes

  • Brand: INPAQ Global RF/Component Solutions
  • Series: MHC S Series
  • Material: Chip Ferrite Bead
  • Certifications: RoHS, Pb
  • Origin: Taiwan (implied by .tw domain)

Technical Specifications

Product Name Size (EIAJ) Dimensions (L x W x T) (mm) Part Number Code Structure Impedance () 25% Test Freq. (MHz) DCR () (Max.) Rated Current (mA) Packaging
High Current Chip Bead Series MHC S Series 1005 (EIA 0402) 1.000.10 x 0.500.10 x 0.500.10 MHC 1005 S 100 NBP 10 100 0.09 2000 Embossed paper tape, 7" reel (P)
MHC 1005 S 300 NBP 30 100 0.09 2000
MHC 1005 S 600 LBP 60 100 0.2 1000
MHC 1005 S 121 MBP 120 100 0.15 1500
1608 (EIA 0603) 1.600.15 x 0.800.15 x 0.800.15 MHC 1608 S 300 QBP 30 100 0.04 3000
MHC 1608 S 600 QBP 60 100 0.04 3000
MHC 1608 S 800 QBP 80 100 0.04 3000
MHC 1608 S 121 PBP 120 100 0.07 2500
MHC 1608 S 221 NBP 220 100 0.09 2000
MHC 1608 S 301 NBP 300 100 0.09 2000
MHC 1608 S 471 LBP 470 100 0.2 1000
MHC 1608 S 601 LBP 600 100 0.2 1000
MHC 1608 S 102 ZBP A80 1000 100 0.25 800
2012 (EIA 0805) 2.000.20 x 1.250.20 x 0.900.20 MHC 2012 S 310 WBP 31 100 0.015 6000
MHC 2012 S 400 RBP 40 100 0.03 4000
MHC 2012 S 600 QBP 60 100 0.04 3000
MHC 2012 S 800 UBP 80 100 0.02 5000
MHC 2012 S 121 UBP 120 100 0.02 5000
MHC 2012 S 221 QBP 220 100 0.04 3000
MHC 2012 S 301 NBP 300 100 0.09 2000
MHC 2012 S 331 NBP 330 100 0.09 2000
MHC 2012 S 601 NBP 600 100 0.09 2000
3216 (EIA 1206) 3.200.20 x 1.600.20 x 1.100.20 MHC 3216 S 300 WBE 30 100 0.015 6000
MHC 3216 S 500 WBE 50 100 0.015 6000
MHC 3216 S 800 RBE 80 100 0.03 4000
MHC 3216 S 121 WBE 120 100 0.015 6000
MHC 3216 S 601 PBE 600 100 0.07 2500
MHC 3216 S 122 LBE 1200 100 0.2 1000
3225 (EIA 1210) 3.200.20 x 2.500.20 x 1.300.20 MHC 3225 S 600 MBE 60 100 0.15 1500
MHC 3225 S 102 NBE 1000 50 0.09 2000
4516 (EIA 1806) 4.500.25 x 1.600.20 x 1.600.20 MHC 4516 S 600 WBE 60 100 0.015 6000
MHC 4516 S 851 MBE 850 100 0.15 1500
4532 (EIA 1812) 4.500.25 x 3.200.25 x 1.500.25 MHC 4532 S 800 ZBE9A0 80 100 0.01 9000
MHC 4532 S 121 WBE 120 100 0.015 6000
MHC 4532 S 601 QBE 600 50 0.04 3000
MHC 4532 S 132 QBE 1300 60 0.04 3000
General Technical Data: Operating temperature range: -55 ~ +125; Storage Condition: Less than 40 and 70% RH; Storage Time: 6 months (Size:1005), 12 months (Size:1608 above); Soldering method: Reflow or Wave Soldering.
Test Conditions: Test Level: 250 mV; Test Instruments: HP4291B, HP4338A/B, MI, LLIOHMMETER, Agilent 8720ES, HP6632B SYSTEM DC POWER SUPPLY.
Reliability and Test Conditions:
  • Temperature Cycle: -40 ~ +85, 100 cycles, 30 min dwell time. Criteria: No mechanical damage, Impedance within 20% of initial value.
  • Operational Life: 125 5, 1000 hrs, full rated current. Criteria: No mechanical damage, Impedance within 20% of initial value.
  • Rated Current Test: Full rated current / 5min. Criteria: Temperature rise less than 40.
  • Biased Humidity: 40 2, 90 ~ 95 % RH, 1000 hrs, full rated current. Criteria: No mechanical damage, Impedance within 20% of initial value.
  • Resistance to Solder Heat: 260 5, Rosin flux, 10 1 sec DIP time. Criteria: >95% terminal electrode covered with new solder, no mechanical damage, Impedance within 20% of initial value.
  • Adhesive Test: Reflow temp 245, 5 N force for 10 sec. Criteria: No mechanical damage, Soldering on PCB after pulling test force > 5 N.
  • Steam Aging Test: 93, 4 hrs (MHC1005) / 8 hrs (Others), 235 5 DIP time. Criteria: >95% terminal electrode covered with new solder.
Recommended Soldering Land Patterns: (Dimensions provided in mm/inches for various sizes)
Tape and Reel Specifications: (Dimensions provided for Plastic and Paper Carriers)
Reel Dimensions: 7" Reel Quantity: 1005 (10,000 pcs), 1608 (4,000 pcs), 2012 (4,000 pcs), 3216 (3,000 pcs), 3225 (2,000 pcs), 4516 (2,000 pcs), 4532 (1,000 pcs).

2410121433_INPAQ-MHC2012S121UBP_C19633893.pdf

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