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Specifications
Current Rating:
200mA
DC Resistance(DCR):
1Ω
Tolerance:
±25%
Impedance @ Frequency:
470Ω@100MHz
Mfr. Part #:
MCB1005S471EBP
Package:
0402
Key Attributes
Model Number:
MCB1005S471EBP
Product Description
Product Overview
The INPAQ Global RF/Component Solutions MCB S Series Chip Ferrite Bead is a monolithic inorganic material construction designed for effective filtering across a wide frequency range. Its closed magnetic circuit design prevents crosstalk, and it is available in various SMD sizes suitable for reflow and wave soldering. These beads offer excellent solderability, heat resistance, and high reliability, making them ideal for filtering between analog and digital circuitry, clock generation, I/O interconnects, isolation between noisy RF circuits and sensitive logic devices, power supply filtering, and high-frequency EMI prevention in electronic devices.
Product Attributes
- Brand: INPAQ Global RF/Component Solutions
- Series: MCB S Series
- Construction: Monolithic inorganic material
- Circuit Design: Closed magnetic circuit
- Mounting Type: SMD Type
- Soldering Compatibility: Reflow and wave soldering
- Key Benefits: Excellent solderability, heat resistance, high reliability
Technical Specifications
| Product Name | Size (EIAJ) | L (mm) | W (mm) | T (mm) | E (mm) |
|---|---|---|---|---|---|
| Chip Ferrite Bead (MCB S Series) | 1005 (EIA 0402) | 1.000.10 | 0.500.10 | 0.500.10 | 0.250.10 |
| Chip Ferrite Bead (MCB S Series) | 1608 (EIA 0603) | 1.600.15 | 0.800.15 | 0.800.15 | 0.300.20 |
| Chip Ferrite Bead (MCB S Series) | 2012 (EIA 0805) | 2.000.20 | 1.250.20 | 0.900.20 | 0.500.30 |
| Chip Ferrite Bead (MCB S Series) | 3216 (EIA 1206) | 3.200.20 | 1.600.20 | 1.100.20 | 0.50030 |
| Chip Ferrite Bead (MCB S Series) | 3225 (EIA 1210) | 3.200.20 | 2.500.20 | 1.300.20 | 0.500.30 |
| Chip Ferrite Bead (MCB S Series) | 4516 (EIA 1806) | 4.500.25 | 1.600.20 | 1.600.20 | 0.600.40 |
| Chip Ferrite Bead (MCB S Series) | 4532 (EIA 1812) | 4.500.25 | 3.200.25 | 1.500.25 | 0.600.40 |
| Part Number Code Structure | Description |
|---|---|
| 1 | Series Name (MCB) |
| 2 | Size Code (e.g., 1005 for 1.0mm x 0.5mm) |
| 3 | Material Code |
| 4 | Impedance () 25% |
| 5 | Fixed Decimal Point |
| 6 | Rated Current Code (e.g., F=300mA, I=600mA, K=800mA) |
| 7 | Soldering (A: Lead-Free, B: Lead-Free for whole chip) |
| 8 | Packaging (P: Embossed paper tape, 7" reel; E: Embossed plastic tape, 7" reel) |
| Part No. | Impedance () 25% | Test Freq. (MHz) | DCR () (Max.) | Rated Current (mA) |
|---|---|---|---|---|
| MCB1005-S Series | ||||
| MCB1005S100FBP | 10 | 100 | 0.10 | 300 |
| MCB1005S200FBP | 20 | 100 | 0.20 | 300 |
| MCB1005S300FBP | 30 | 100 | 0.25 | 300 |
| MCB1005S400FBP | 40 | 100 | 0.30 | 300 |
| MCB1005S600FBP | 60 | 100 | 0.35 | 300 |
| MCB1005S700FBP | 70 | 100 | 0.35 | 300 |
| MCB1005S121FBP | 120 | 100 | 0.40 | 300 |
| MCB1005S241EBP | 240 | 100 | 0.70 | 200 |
| MCB1005S301EBP | 300 | 100 | 0.80 | 200 |
| MCB1005S471EBP | 470 | 100 | 1.00 | 200 |
| MCB1005S601FBP | 600 | 100 | 1.00 | 300 |
| MCB1005S102EBP | 1000 | 100 | 1.50 | 200 |
| MCB1608-S Series | ||||
| MCB1608S100IBP | 10 | 100 | 0.05 | 600 |
| MCB1608S300IBP | 30 | 100 | 0.08 | 600 |
| MCB1608S600IBP | 60 | 100 | 0.10 | 600 |
| MCB1608S800IBP | 80 | 100 | 0.10 | 600 |
| MCB1608S121IBP | 120 | 100 | 0.15 | 600 |
| MCB1608S181FBP | 180 | 100 | 0.30 | 300 |
| MCB1608S221FBP | 220 | 100 | 0.30 | 300 |
| MCB1608S301FBP | 300 | 100 | 0.35 | 300 |
| MCB1608S471FBP | 470 | 100 | 0.40 | 300 |
| MCB1608S601EBP | 600 | 100 | 0.45 | 200 |
| MCB1608S102CBP | 1000 | 100 | 0.60 | 100 |
| MCB2012-S Series | ||||
| MCB2012S300KBP | 30 | 100 | 0.05 | 800 |
| MCB2012S400KBP | 40 | 100 | 0.05 | 800 |
| MCB2012S600KBP | 60 | 100 | 0.15 | 800 |
| MCB2012S800KBP | 80 | 100 | 0.15 | 800 |
| MCB2012S121KBP | 120 | 100 | 0.15 | 800 |
| MCB2012S221HBP | 220 | 100 | 0.20 | 500 |
| MCB2012S301HBP | 300 | 100 | 0.20 | 500 |
| MCB2012S601HBP | 600 | 100 | 0.30 | 500 |
| MCB2012S102FBP | 1000 | 100 | 0.35 | 300 |
| MCB2012S202EBP | 2000 | 100 | 0.50 | 200 |
| MCB3216-S Series | ||||
| MCB3216S310KBE | 31 | 100 | 0.05 | 800 |
| MCB3216S500KBE | 50 | 100 | 0.08 | 800 |
| MCB3216S700KBE | 70 | 100 | 0.10 | 800 |
| MCB3216S121IBE | 120 | 100 | 0.15 | 600 |
| MCB3216S601HBE | 600 | 100 | 0.30 | 500 |
| MCB3216S102HBE | 1000 | 100 | 0.40 | 500 |
| MCB3216S122HBE | 1200 | 100 | 0.40 | 500 |
| MCB3216S152EBE | 1500 | 50 | 0.50 | 200 |
| MCB3216S202EBE | 2000 | 30 | 0.50 | 200 |
| MCB3225-S Series | ||||
| MCB3225S600KBE | 60 | 100 | 0.30 | 800 |
| MCB3225S900KBE | 90 | 100 | 0.30 | 800 |
| MCB4516-S Series | ||||
| MCB4516S800KBE | 80 | 100 | 0.10 | 800 |
| MCB4516S151KBE | 150 | 100 | 0.30 | 800 |
| MCB4532-S Series | ||||
| MCB4532S700KBE | 70 | 100 | 0.40 | 800 |
| MCB4532S800KBE | 80 | 100 | 0.40 | 800 |
| MCB4532S121KBE | 120 | 100 | 0.40 | 800 |
| Size | Plastic Carrier W (mm) | Plastic Carrier P (mm) | Plastic Carrier E (mm) | Plastic Carrier F (mm) | Plastic Carrier D (mm) | Plastic Carrier D1 (mm) | Plastic Carrier Po (mm) | Plastic Carrier Po10 (mm) | Plastic Carrier P2 (mm) | Plastic Carrier Ao (mm) | Plastic Carrier Bo (mm) | Plastic Carrier Ko(T) (mm) | Plastic Carrier t (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 4532 | 12.00.10 | 8.000.10 | 1.750.10 | 5.500.05 | 1.550.05 | 1.50~1.75 | 40.00.20 | 2.000.05 | 3.660.10 | 4.950.10 | 1.830.10 | 0.230.10 | |
| 4516 | 11.7~12.3 | 4.000.10 | 1.750.10 | 5.500.05 | 1.550.05 | 1.50~1.75 | 40.00.20 | 2.000.05 | 1.830.10 | 4.850.10 | 1.830.10 | 0.290.10 | |
| 3225 | 7.70~8.30 | 4.000.10 | 1.750.10 | 3.500.05 | 1.550.05 | 0.95~1.20 | 40.00.20 | 2.000.05 | 2.570.10 | 3.400.10 | 1.320.10 | 0.250.10 | |
| 3216 | 7.90~8.30 | 4.000.10 | 1.750.10 | 3.500.05 | 1.550.05 | 0.95~1.20 | 40.00.20 | 2.000.05 | 1.850.10 | 3.430.10 | 1.220.10 | 0.250.10 | |
| 2012 | 8.000.10 | 4.000.10 | 1.750.10 | 3.500.10 | 1.560.10 | NA | 40.00.20 | 2.000.10 | 1.500.05 | 2.300.05 | 0.950.05 | NA | |
| 1608 | 8.000.10 | 4.000.10 | 1.750.10 | 3.500.10 | 1.560.10 | NA | NA | 2.000.10 | 1.050.05 | 1.850.05 | 0.950.05 | NA | |
| 1005 | 8.000.10 | 2.000.05 | 1.750.05 | 3.500.05 | 1.550.05 | NA | NA | 2.000.05 | 0.620.03 | 1.120.03 | 0.600.03 | NA |
| Part Size (EIA SIZE) | 7" REEL Qty. (pcs) |
|---|---|
| 1005 (0402) | 10,000 |
| 1608 (0603) | 4,000 |
| 2012 (0805) | 4,000 |
| 3216 (1206) | 3,000 |
| 3225 (1210) | 2,000 |
| 4516 (1806) | 2,000 |
| 4532 (1812) | 1,000 |
| Size | A (mm) | B (mm) | C (mm) |
|---|---|---|---|
| 1005 | 0.4 0.6 | 1.6 2.6 | 0.4 0.7 |
| 1608 | 0.5 0.7 | 2.1 3.1 | 0.65 0.95 |
| 2012 | 1.0 1.2 | 3.0 4.0 | 0.8 1.1 |
| 3216 | 2.0 2.4 | 4.2 5.2 | 1.0 1.4 |
| 3225 | 2.1 2.3 | 4.2 5.2 | 2.2 2.5 |
| 4516 | 3.4 3.7 | 6.3 7.3 | 1.3 1.7 |
| 4532 | 3.4 3.7 | 6.3 7.3 | 2.9 3.2 |
| General Technical Data | Value |
|---|---|
| Operating temperature range | -55 ~ +125 |
| Storage Condition | Less than 40 and 70% RH |
| Storage Time | 6 months (Size: 1005), 12 months (Size: 1608 above) |
| Soldering method | Reflow or Wave Soldering |
| Test Item | Test Condition | Criteria |
|---|---|---|
| Temperature Cycle | a. Temperature: -40 ~ +85 | a. No mechanical damage b. Impedance value should be within 20 % of the initial value |
| b. Cycle: 100 cycles | ||
| c. Dwell time: 30 minutes | ||
| d. Measurement: at ambient temperature 24 hrs after test completion | ||
| Operational Life | a. Temperature: 125 5 | a. No mechanical damage b. Impedance value should be within 20 % of the initial value |
| b. Test time: 1000 hrs | ||
| c. Apply current: full rated current | ||
| d. Measurement: at ambient temperature 24 hrs after test completion | ||
| Biased Humidity | a. Temperature: 40 2 | a. No mechanical damage b. Impedance value should be within 20 % of the initial value |
| b. Humidity: 90 ~ 95 % RH | ||
| c. Test time: 1000 hrs | ||
| d. Apply current: full rated current | ||
| Resistance to Solder Heat | a. Solder temperature: 260 5 | a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Impedance value should be within 20 % of the initial value |
| b. Flux: Rosin | ||
| c. DIP time: 10 1 sec | ||
| Adhesive Test | a. Reflow temperature: 245 | a. No mechanical damage b. Soldering the products on PCB after the pulling test force > 5 N |
| b. Apply force(F): 5 N | ||
| c. Test time: 10 sec | ||
| Steam Aging Test | a. Temperature: 93 | More than 95 % of terminal electrode should be covered with new solder |
| b. Test time: 4 hrs (MCB1005) Others: 8 hrs | ||
| c. Solder temperature: 235 5 | ||
| d. Flux: Rosin, e. DIP time: 5 1 sec | ||
| Rated Current Test | a. Apply current: full rated current / 5min | Temperature rise should be less than 25 |
2410121433_INPAQ-MCB1005S471EBP_C19631651.pdf
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