Product Overview
The INPAQ Global MCB H Series Chip Ferrite Bead is designed for effective high-frequency noise filtering without attenuating desired signals. Constructed from monolithic inorganic material with a closed magnetic circuit, these beads prevent crosstalk and offer excellent solderability and heat resistance. They are suitable for reflow and wave soldering, making them ideal for a wide range of applications including filtering between analog and digital circuitry, clock generation, I/O interconnects, isolation between RF noisy circuits and logic devices, and power supply filtering. Their sharp impedance characteristics are particularly beneficial for EMI prevention in devices like LCD monitors, PDAs, computers, and wireless communication equipment.
Product Attributes
- Brand: INPAQ Global
- Series: MCB H Series
- Construction: Monolithic inorganic material
- Circuit Design: Closed magnetic circuit
- Mounting Type: SMD Type
- Soldering Compatibility: Reflow and Wave Soldering
- Material Characteristics: Excellent solderability and heat resistance, High reliability
- Soldering Options: Lead-Free (A), Lead-Free for whole chip (B)
- Packaging: Embossed paper tape, 7" reel (P)
Technical Specifications
| Product Name | Size (EIAJ) | Dimensions (L x W x T) mm | Impedance () 25% @ 100 MHz | DCR () Max. | Rated Current (mA) | Test Instruments |
|---|---|---|---|---|---|---|
| MCB 1005-2012 H Series | 1005 (0402) | 1.000.10 x 0.500.10 x 0.500.10 | N/A | N/A | N/A | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB 1608 H Series | 1608 (0603) | 1.600.15 x 0.800.15 x 0.800.15 | N/A | N/A | N/A | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB 2012 H Series | 2012 (0805) | 2.000.20 x 1.250.20 x 0.900.20 | N/A | N/A | N/A | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1005H750FBP | 1005 | 1.0 x 0.5 x 0.5 | 75 | 0.40 | 300 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H200HBP | 1608 | 1.6 x 0.8 x 0.8 | 20 | 0.25 | 500 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H750HBP | 1608 | 1.6 x 0.8 x 0.8 | 75 | 0.35 | 500 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H800HBP | 1608 | 1.6 x 0.8 x 0.8 | 80 | 0.35 | 500 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H121EBP | 1608 | 1.6 x 0.8 x 0.8 | 120 | 0.45 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H301EBP | 1608 | 1.6 x 0.8 x 0.8 | 300 | 0.45 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H601EBP | 1608 | 1.6 x 0.8 x 0.8 | 600 | 0.50 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB1608H102EBP | 1608 | 1.6 x 0.8 x 0.8 | 1000 | 0.60 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB2012H121EBP | 2012 | 2.0 x 1.25 x 0.9 | 120 | 0.25 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB2012H221EBP | 2012 | 2.0 x 1.25 x 0.9 | 220 | 0.25 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB2012H301EBP | 2012 | 2.0 x 1.25 x 0.9 | 300 | 0.25 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| MCB2012H601EBP | 2012 | 2.0 x 1.25 x 0.9 | 600 | 0.35 | 200 | HP4291B, HP4338A/B, Agilent 8720ES, HP6632B |
| General Technical Data: | ||||||
| Operating Temperature Range | - 55 ~ +125 | |||||
| Storage Condition | Less than 40 and 70% RH | |||||
| Storage Time | 6 months (Size:1005), 12 months (Size:1608 above) | |||||
| Soldering Method | Reflow or Wave Soldering | |||||
| Solder Land Information (Unit: mm): | ||||||
| Size | A | B | C | |||
| 1005 | 0.40 0.60 | 1.60 2.60 | 0.40 0.70 | |||
| 1608 | 0.50 0.70 | 2.10 3.10 | 0.65 0.95 | |||
| 2012 | 1.00 1.20 | 3.00 4.00 | 0.80 1.10 | |||
| Reliability and Test Conditions: | ||||||
| Test Item | Test Condition | Criteria | ||||
| Temperature Cycle | -40 ~ +85, 100 cycles, 30 min dwell | No mechanical damage, Impedance 20% of initial | ||||
| Operational Life | 125 5, 1000 hrs, full rated current | No mechanical damage, Impedance 20% of initial | ||||
| Biased Humidity | 40 2, 90 ~ 95% RH, 1000 hrs, full rated current | No mechanical damage, Impedance 20% of initial | ||||
| Resistance to Solder Heat | 260 5, 10 sec dip | >95% terminal coverage, No mechanical damage, Impedance 20% of initial | ||||
| Adhesive Test | Reflow 245, 5 N force for 10 sec | No mechanical damage, Pulling force > 5 N | ||||
| Rated Current Test | Full rated current / 5min | Temperature rise < 25 | ||||
| Steam Aging Test | 93, 4 hrs (MCB1005) / 8 hrs (Others), 235 5 dip | >95% terminal coverage | ||||
2410121631_INPAQ-MCB1005H750FBP_C964128.pdf
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