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Specifications
Current Rating:
150mA
Number of Circuits:
1
DC Resistance(DCR):
1.5Ω
Tolerance:
±25%
Impedance @ Frequency:
1.5kΩ@100MHz
Mfr. Part #:
MCB1005B152DBP
Package:
0402
Key Attributes
Model Number:
MCB1005B152DBP
Product Description
Product Overview
The INPAQ Global RF/Component Solutions MCB B Series is a Chip Ferrite Bead designed for RF and component applications. These components are manufactured to precise specifications, offering reliable performance in various electronic circuits. The MCB 1005 B Series is particularly suited for applications requiring effective EMI suppression and impedance matching, with a focus on lead-free soldering processes and standard packaging for automated assembly.
Product Attributes
- Brand: INPAQ Global RF/Component Solutions
- Series: MCB B Series
- Product Type: Chip Ferrite Bead
- Size Code: EIAJ 1005 (EIA 0402)
- Soldering: Lead-Free (A - Soldering Lead-Free, B - Lead-Free for whole chip)
- Packaging: Embossed paper tape, 7" reel
- Operating Temperature Range: -55 to +125
- Storage Condition: Less than 40 and 70% RH
- Storage Time: 6 months Max.
- Soldering Method: Reflow or Wave Soldering
Technical Specifications
| Part Number | Impedance () 25% | Test Frequency (MHz) | DCR () Max. | Rated Current (mA) | Size (mm) L x W x T | End Electrode (mm) E |
|---|---|---|---|---|---|---|
| MCB1005B601FB_ | 600 | 100 | 0.60 | 300 | 1.00 0.10 x 0.50 0.10 x 0.50 0.10 | 0.25 0.10 |
| MCB1005B102EB_ | 1000 | 100 | 1.00 | 200 | ||
| MCB1005B152DB_ | 1500 | 100 | 1.50 | 150 | ||
| Note: For special part numbers not listed, refer to appendix. | ||||||
Packaging & Reel Specifications
| Part Size (EIA Size) | Reel Diameter | Quantity per Reel (pcs) | Quantity per Inner Box |
|---|---|---|---|
| 1005 (0402) | 7 | 10,000 | 5 reels / inner box |
Taping Dimensions (Unit: mm)
| Size | W | P | E | F | D | Po | P2 | Ao | Bo | Ko(T) |
|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 8.000.10 | 2.000.05 | 1.750.05 | 3.500.05 | 1.550.05 | 4.000.10 | 2.000.05 | 0.620.03 | 1.120.03 | 0.600.03 |
Solder Land Information (Unit: mm)
| Size | A | B | C |
|---|---|---|---|
| 1005 | 0.4 0.6 | 1.6 2.6 | 0.4 0.7 |
Reliability and Test Conditions
| Test Item | Test Condition | Criteria |
|---|---|---|
| Temperature Cycle | a. Temp: -40 ~ +85 b. Cycle: 100 cycles c. Dwell: 30 min d. Measurement: 24 hrs ambient | a. No mechanical damage b. Impedance within 20% of initial value |
| Operational Life | a. Temp: 125 5 b. Time: 1000 hrs c. Current: Full rated current d. Measurement: 24 hrs ambient | a. No mechanical damage b. Impedance within 20% of initial value |
| Biased Humidity | a. Temp: 40 2 b. Humidity: 90 ~ 95 % RH c. Time: 1000 hrs d. Current: Full rated current e. Measurement: 24 hrs ambient | a. No mechanical damage b. Impedance within 20% of initial value |
| Resistance to Solder Heat | a. Solder Temp: 260 5 b. Flux: Rosin c. DIP time: 10 1 sec | a. >95% terminal electrode covered with new solder b. No mechanical damage c. Impedance within 20% of initial value |
| Adhesive Test | a. Reflow Temp: 245 b. Force: 5 N c. Time: 10 sec | a. No mechanical damage b. Soldering on PCB after pulling test force > 5 N |
| Steam Aging Test | a. Temp: 93 b. Time: 4 hrs c. Solder Temp: 235 5 d. Flux: Rosin e. DIP time: 5 1 sec | >95% terminal electrode covered with new solder |
| Rated Current Test | a. Apply current: Full rated current / 5min | Temperature rise < 25 |
Test Instruments
- HP4291B RF IMPEDANCE / MATERIAL ANALYZER
- HP4338A/B MILLIOHMMETER
- Agilent 8720ES S-PARAMETER NETWORK ANALYZER
- HP6632B SYSTEM DC POWER SUPPLY
2410121630_INPAQ-MCB1005B152DBP_C964132.pdf
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