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quality Monolithic inorganic SMD ferrite bead INPAQ MCB1005S300FBP providing EMI prevention and high reliability factory
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quality Monolithic inorganic SMD ferrite bead INPAQ MCB1005S300FBP providing EMI prevention and high reliability factory
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Specifications
Current Rating:
300mA
Number of Circuits:
1
DC Resistance(DCR):
250mΩ
Tolerance:
±25%
Impedance @ Frequency:
30Ω@100MHz
Mfr. Part #:
MCB1005S300FBP
Package:
0402
Key Attributes
Model Number: MCB1005S300FBP
Product Description

Product Overview

The MCB S Series Chip Ferrite Bead is a monolithic inorganic material construction designed for effective filtering capabilities over a wide range of frequencies. Featuring a closed magnetic circuit to avoid crosstalk, these SMD type components are suitable for reflow and wave soldering. They offer excellent solderability and heat resistance, ensuring high reliability. Applications include filtering between analog and digital circuitry, clock generation, I/O interconnects, isolation between noisy RF circuits and susceptible logic devices, power supply filtering, and high-frequency EMI prevention in consumer electronics and office equipment.

Product Attributes

  • Brand: INPAQ
  • Series: MCB S Series
  • Construction: Monolithic inorganic material
  • Magnetic Circuit: Closed
  • Type: SMD
  • Soldering Compatibility: Reflow and wave soldering
  • Certifications: RoHS
  • Grade: Industrial grade standard (not for vehicle gauge)

Technical Specifications

Product Name Size (EIAJ) L (mm) W (mm) T (mm) E (mm)
MCB 1005-4532 S Series 1005 (EIA 0402) 1.000.10 0.500.10 0.500.10 0.250.10
MCB 1005-4532 S Series 1608 (EIA 0603) 1.600.15 0.800.15 0.800.15 0.300.20
MCB 1005-4532 S Series 2012 (EIA 0805) 2.000.20 1.250.20 0.900.20 0.500.30
MCB 1005-4532 S Series 3216 (EIA 1206) 3.200.20 1.600.20 1.100.20 0.50030
MCB 1005-4532 S Series 3225 (EIA 1210) 3.200.20 2.500.20 1.300.20 0.500.30
MCB 1005-4532 S Series 4516 (EIA 1806) 4.500.25 1.600.20 1.600.20 0.600.40
MCB 1005-4532 S Series 4532 (EIA 1812) 4.500.25 3.200.25 1.500.25 0.600.40
Part No. Impedance () 25% Test Freq. (MHz) DCR () Max. Rated Current (mA)
MCB1005-S Series
MCB1005S100FBP 10 100 0.10 300
MCB1005S200FBP 20 100 0.20 300
MCB1005S300FBP 30 100 0.25 300
MCB1005S400FBP 40 100 0.30 300
MCB1005S600FBP 60 100 0.35 300
MCB1005S700FBP 70 100 0.35 300
MCB1005S121FBP 120 100 0.40 300
MCB1005S241EBP 240 100 0.70 200
MCB1005S301EBP 300 100 0.80 200
MCB1005S471EBP 470 100 1.00 200
MCB1005S601FBP 600 100 1.00 300
MCB1005S102EBP 1000 100 1.50 200
MCB1608-S Series
MCB1608S100IBP 10 100 0.05 600
MCB1608S300IBP 30 100 0.08 600
MCB1608S600IBP 60 100 0.10 600
MCB1608S800IBP 80 100 0.10 600
MCB1608S121IBP 120 100 0.15 600
MCB1608S181FBP 180 100 0.30 300
MCB1608S221FBP 220 100 0.30 300
MCB1608S301FBP 300 100 0.35 300
MCB1608S471FBP 470 100 0.40 300
MCB1608S601EBP 600 100 0.45 200
MCB1608S102CBP 1000 100 0.60 100
MCB1608S182CBP 1800 100 0.70 100
MCB1608S252CBP 2500 100 0.70 100
MCB2012-S Series
MCB2012S300KBP 30 100 0.05 800
MCB2012S400KBP 40 100 0.05 800
MCB2012S600KBP 60 100 0.15 800
MCB2012S800KBP 80 100 0.15 800
MCB2012S121KBP 120 100 0.15 800
MCB2012S221HBP 220 100 0.20 500
MCB2012S301HBP 300 100 0.20 500
MCB2012S601HBP 600 100 0.30 500
MCB2012S102FBP 1000 100 0.35 300
MCB2012S202EBP 2000 100 0.50 200
MCB3216-S Series
MCB3216S310KBE 31 100 0.05 800
MCB3216S500KBE 50 100 0.08 800
MCB3216S700KBE 70 100 0.10 800
MCB3216S121IBE 120 100 0.15 600
MCB3216S601HBE 600 100 0.30 500
MCB3216S102HBE 1000 100 0.40 500
MCB3216S122HBE 1200 100 0.40 500
MCB3216S152EBE 1500 50 0.50 200
MCB3216S202EBE 2000 30 0.50 200
MCB3225-S Series
MCB3225S600KBE 60 100 0.30 800
MCB3225S900KBE 90 100 0.30 800
MCB4516-S Series
MCB4516S800KBE 80 100 0.10 800
MCB4516S151KBE 150 100 0.30 800
MCB4532-S Series
MCB4532S700KBE 70 100 0.40 800
MCB4532S800KBE 80 100 0.40 800
MCB4532S121KBE 120 100 0.40 800
General Technical Data Value
Operating temperature range -55 ~ +125
Storage Condition Less than 40 and 70% RH
Storage Time 6 months (Size: 1005), 12 months (Size: 1608 and above)
Soldering method Reflow
Reliability Test Item Test Condition Criteria
Temperature Cycle a. Temp: -55 ~ +125, Cycle: 100, Dwell: 30min a. No mechanical damage b. Impedance within 20% of initial value
Operational Life a. Temp: 125 5, Time: 1000 hrs, Apply: full rated current a. No mechanical damage b. Impedance within 20% of initial value
Biased Humidity a. Temp: 40 2, Humidity: 90 ~ 95 % RH, Time: 1000 hrs, Apply: full rated current a. No mechanical damage b. Impedance within 20% of initial value
Resistance to Solder Heat a. Solder temp: 260 5, Flux: Rosin, DIP time: 10 1 sec a. >95% terminal electrode covered with new solder b. No mechanical damage c. Impedance within 20% of initial value
Adhesive Test a. Reflow temp: 245, Apply force (F): 5 N, Time: 10 sec a. No mechanical damage b. Soldering strength > 5 N
Steam Aging Test a. Temp: 93, Time: 4 hrs (MCB1005) / 8 hrs (Others), Solder temp: 235 5, Flux: Rosin, DIP time: 5 1 sec a. >95% terminal electrode covered with new solder
Rated Current Test Apply: full rated current / 5 min Temperature rise < 25
Solder Land Information (mm) A B C
1005 0.4 1.2 1.4 0.5
1608 0.7 1.8 2.0 0.7
2012 1.2 3.0 4.0 1.0
3216 2.0 4.2 5.2 1.2
3225 2.0 4.2 5.2 3.4
4516 3.0 5.5 6.5 1.2
4532 3.0 5.5 6.5 4.22

2410121532_INPAQ-MCB1005S300FBP_C964127.pdf

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