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quality MLCCs for Electric Equipment IHHEC C1812N122J302THN High Insulation Resistance and RoHS HF Compliance factory
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quality MLCCs for Electric Equipment IHHEC C1812N122J302THN High Insulation Resistance and RoHS HF Compliance factory
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Specifications
Mfr. Part #:
C1812N122J302THN
Package:
1812
Key Attributes
Model Number: C1812N122J302THN
Product Description

Product Overview

This specification applies to Multilayer Ceramic Chip Capacitors (MLCCs) designed for electric equipment operating at voltages ranging from 2KV to 5KV. These MLCCs support Lead-Free wave and reflow soldering, maintaining their electrical characteristics and reliability. The product is compliant with RoHS & HF standards.

Product Attributes

  • Product Code: HVC-018-1910
  • Certifications: RoHS, HF

Technical Specifications

ItemSpecificationTest Condition
ScopeMLCC for electric equipment, voltage 2KV to 5KV, Lead-Free compatible.
Nominal Capacitance and ToleranceClass NPO, More Than 10 pF, Tolerance J ( 5.00 %), E-12, E-24 series
Operation Temperature RangeClass NPO: -55 ~ +125 Reference Temp: 25
Storage ConditionTemperature: 5 to 40, Relative Humidity: 20 to 70 %, Storage Time: 12 months max.
Dimensions (1812)L: 4.60 0.30 mm, W: 3.20 0.30 mm, T: 2.80 0.20 mm, B (min): 2.50 mm, BW (min): 0.30 mm
Insulation Resistance10,000Mmin.V500V, Applied 500Vdc, Charge Time: 60sec.
CapacitanceClass NPO: Within The Specified Tolerance
Q FactorClass NPO More Than 30pF: Q 1000
Withstanding VoltageNo dielectric breakdown or mechanical breakdown1000V: 120% Rated Voltage, Voltage ramp up rate500v/sec for 1~5 sec.
Temperature Capacitance CoefficientClass NPO: -55~+125, 30 ppm/Class : [C2-C1/C1(T2-T1)] 100% T1: 25, C1:Capacitance at 25, C2: Capacitance at test temperature (T2)
Adhesive Strength of Termination0603: 10N (1.0 Kgf)Pull force applied for 10 1 second.
Resistance to Flexure of SubstrateCapacitance Change: NPO 5.0%Bending applied to 1.0 mm with 1.0 mm/sec. Duration: 5 1sec.
SolderabilityMore than 90% of the terminal surface is to be soldered newly.Solder Temp: 245 5, Dip Time: 5 0.5 sec. Lead Free Solder.
Resistance To Soldering HeatCapacitance Change: Class (NPO) Within 2.5% or 0.25pF (whichever is larger of initial value)Preheat: 150 10 for 60~120sec. Dip: Solder Temp 260 5, Dip Time: 10 1sec.
Temperature CycleCapacitance Change: Class (NPO) Within 2.5% or 0.25pF (whichever is larger of initial value)Five cycles of temperature changes. Measure after cooling for 24 2 Hrs.
HumidityCapacitance Change: Class (NPO) Within 5.0% or 0.5pF (whichever is larger of initial value)Temp: 40 2, Relative Humidity: 90 ~ 95%RH, Test Time: 500 +12/-0Hr. Measure after cooling for 24 2Hrs.
High Temperature LoadCapacitance Change: Class (NPO) Within 3.0% or 0.3pF (whichever is larger)Voltage Conditioning: 100% Rated Voltage at maximum operation temperature 3 for one hour. Measure after cooling for 24 2 Hours.
VibrationCapacitance Change: Class (NPO) Within 2.5% or 0.25pF (whichever is larger)Amplitude: 1.5mm P-P, Frequencies: 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat for 2 hours each in 3 perpendicular directions.
Packing (1812)Paper Tape: 1,000 pcs/Reel, Plastic Tape: 1,000 pcs/Reel (T2.20mm), 700 pcs/Reel (T2.20mm)
Cover Tape Reel Off ForcePeel-Off Force: 5 gf Force 70 gf

2410121501_IHHEC-C1812N122J302THN_C22439665.pdf

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