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Specifications
Voltage Rating:
2kV
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
C1210X103K202TEF
Package:
1210
Key Attributes
Model Number:
C1210X103K202TEF
Product Description
Product Overview
This specification applies to Multilayer Ceramic Chip Capacitors (MLCC) designed for electric equipment operating within a voltage range of 2KV to 5KV. These MLCCs are compatible with Lead-Free wave and reflow soldering, maintaining their electrical characteristics and reliability. The product is compliant with RoHS & HF standards.
Product Attributes
- Product Type: Multilayer Ceramic Chip Capacitor (MLCC)
- Series: HVC-017-1810
- Certifications: RoHS & HF compliant
Technical Specifications
| Item | Specification | Test Condition |
|---|---|---|
| Scope | MLCC for electric equipment, voltage 2KV to 5KV. Supports Lead-Free wave and reflow soldering. | |
| Class | ||
| Characteristic | X7R | |
| Nominal Capacitance Tolerance | K ( 10.0 %) | |
| Operation Temperature Range | -55 ~ +125 | Reference Temp. 25 |
| Storage Condition | Temperature: 5 to 40, Relative Humidity: 20 to 70 % | Storage Time: 12 months max. |
| Insulation Resistance | 10,000Mmin. | V500V, Applied 500Vdc, Charge Time60sec. |
| Capacitance | Within The Specified Tolerance | |
| Tan | X7R: 2.5% max. | |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | 1000V :120% Rated Voltage, Voltage ramp up rate500v/sec for 1~5 sec. charge/discharge Current is less than 50mA. Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arcing on the chip surface, at voltage over 1000Vdc. |
| Temperature Capacitance Coefficient | X7R: 15% | Class : , Temp. Range -55 ~+125 , C1:Capacitance at 25, C2: Capacitance at test temperature (T2) |
| Adhesive Strength of Termination | 0603----10N(1.0 Kgf) | Pull force shall be applied for 10 1 second. |
| Resistance to Flexure of Substrate | No mechanical damage shall be occur. | Bending shall be applied to the 1.0 mm with 1.0 mm/sec. The duration of the applied forces shall be 5 1sec |
| Solderability | More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve. | Solder Temperature : 245 5, Dip Time : 5 0.5 sec., Immersing Speed : 2510% mm/s, Solder : Lead Free Solder, Flux :Rosin, Preheat : At 80~120 for 10~30sec. |
| Resistance To Soldering Heat | Capacitance Change: X7R Within 10%, Tan : To satisfy the specified initial value, Insulation Resistance: To satisfy the specified initial value, Withstand Voltage: To satisfy the specified initial value | Preheat : At 150 10 For 60~120sec., Dip : Solder Temperature of 260 5, Dip Time : 10 1sec., Immersing Speed : 2510% mm/s, Flux :Rosin, Measure at room temperature after cooling for 48 4 Hours |
| Temperature Cycle | Capacitance Change: X7R Within 7.5%, Tan : To satisfy the specified initial value, Insulation Resistance: To satisfy the specified initial value | Five cycles of temperature cycle. Measure at room temperature after cooling for 48 4 Hrs. Solder the capacitor on P.C. board shown in Fig 2. before testing. |
| Humidity | Capacitance Change: X7R Within 15%, Tan : X7R: 5.0% max., Insulation Resistance: 1,000Mmin. | Temperature : 40 2, Relative Humidity : 90 ~ 95%RH, Test Time : 500 +12/-0Hr. Measure at room temperature after cooling for 48 4Hrs. Solder the capacitor on P.C. board shown in Fig 2. before testing. |
| High Temperature Load | Capacitance Change: X7R Within 15%, Tan : X7R: 5.0% max., Insulation Resistance: 1,000Mmin. | Voltage Conditioning : 100% Rated Voltage meet MIL-PRF-49467(Group A/B), Current Applied : 50 mA Max. Measure at room temperature after cooling for 48 4 Hours |
| Vibration | Capacitance Change: X7R Within 7.5%, Tan : To satisfy the specified initial value, Insulation Resistance: To satisfy the specified initial value | Vibrate the capacitor with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat this for 2 hours each in 3 perpendicular directions. Solder the capacitor on P.C. Board shown in Fig 2. before testing. |
| Dimensions (1210) | L: 3.200.30mm, W: 2.500.20mm, T: 1.600.20mm, B (min): 1.60mm, BW (min): 0.30mm | |
| Part Number Code Example | C1210X103K202T | C: Product Code, 1210: Chip Size, X: Temperature Characteristics Code, 103: Nominal Capacitance (10,000pF), K: Capacitance Tolerance (10.0%), 202: Rated Voltage (2000Vdc), T: Tapping Code (Tape & Reel) |
2410121504_IHHEC-C1210X103K202TEF_C915834.pdf
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