Multilayer Ceramic Chip Capacitors HVC-008-0807

This specification applies to Multilayer Ceramic Chip Capacitors (MLCC) designed for use in electric equipment with voltage ratings from 100V to 5KV. These MLCCs support Lead-Free wave and reflow soldering, maintaining their electrical characteristics and reliability. This product is compliant with RoHS.

Product Attributes

Brand: HVC
Certifications: RoHS compliant

Technical Specifications

Part Number Code	Product Code	Chip Size	Temperature Characteristics	Capacitance Unit	Nominal Capacitance	Capacitance Tolerance	Rated Voltage	Tapping Code
C0805X472K501T	C (MLCC)	0805 (2.001.25 mm)	X7R (15% @ -55~+125)	pF	472 (4,700.0 pF)	K (10.0%)	501 (500Vdc)	T (Tape & Reel)

Performance

No.	Item	Specification	Test Condition
1	Visual	No abnormal exterior appearance	Visual inspection
2	Dimension	See Page 3	Visual inspection
3	Insulation Resistance	10,000M or 500/C (Whichever is Smaller)	V500V, Rated Voltage; V500V, Applied 500Vdc; Charge Time60sec.
4	Capacitance	Within The Specified Tolerance	Class (NPO/SL); Class (X7R/X5R/X7E/Y5V/Z5U/Y5U)
5	Tan	Class (NPO/SL): More Than 30pF: Q1000; 30pF & Below: Q400 (+20C) Char. Maximum X7R: 2.5%; Class (Z5U/Y5U): 4.0%	C-Meter
6	Withstanding Voltage	No dielectric breakdown or mechanical breakdown	Char. Temp. Range Cap. Change(%) NPO: 30 ppm/; SL: +350~-1000ppm; X7R: 15%; Y5U: +22% ~-56%; Z5U: +22% ~-56%
7	Temperature Capacitance Coefficient	Class [C2-C1/C1(T2-T1)] 100%; Class (C2-C1)/C1 100%	T1: 25; T2: Test temperature; C1: Capacitance at 25; C2: Capacitance at T2
8	Adhesive Strength of Termination	No indication of peeling shall occur on the terminal electrode. A 5Nf (0.5Kgf) pull force shall be applied for 101 second. Appearance: No mechanical damage.
9	Resistance to Flexure of Substrate	Capacitance Change: NPO/SL: 5.0%; X7R: 12.5%; Y5U/Z5U: 30.0%	Bending shall be applied to the 1.0 mm with 1.0 mm/sec.
10	Solderability	More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve. Appearance: No mechanical damage.	Solder Temp: 2455; Dip Time: 50.5 sec; Immersing Speed: 2510% mm/s; Solder: H63A; Flux: Rosin; Preheat: 80~120 for 10~30sec.
11	Resistance To Soldering Heat	Capacitance Change: Class (NPO/SL): Within 2.5% or 0.25pF (whichever is larger); X7R: Within 10%; Class (Z5U/Y5U): Within 20%	Preheat: 15010 for 60~120sec; Dip: Solder Temp. 2605; Dip Time: 101sec; Immersing Speed: 2510% mm/s; Solder: H63A; Flux: Rosin. Measure after cooling.
12	Temperature Cycle	Capacitance Change: Class (NPO/SL): Within 5.0% or 0.5pF (whichever is larger); X7R: Within 15%; Class (Z5U/Y5U): Within 30%	Capacitor shall be subjected to five cycles of the temperature cycle as following: Step 1: Min Rated Temp. (+0/-3) 30 min; Step 2: 25 3 min; Step 3: Max Rated Temp. (+3/-0) 30 min; Step 4: 25 3 min. Solder the capacitor on P.C. board before testing.
13	Humidity	Capacitance Change: Class (NPO/SL): Within 3.0% or 0.3pF (whichever is larger); X7R: Within 15%; Class (Z5U/Y5U): Within 30%	Temperature: 402; Relative Humidity: 90~95%RH; Test Time: 500+12/-0Hr. Solder the capacitor on P.C. board before testing.
14	High Temperature Load (Life Test)	Capacitance Change: Class (NPO/SL): Within 2.5% or 0.25pF (whichever is larger); X7R: Within 7.5%; Class (Z5U/Y5U): Within 20%	Temperature: Max operation temperature; Test Time: 1000+12/-0Hr; Applied DC voltage (following table). Current Applied: 50 mA Max.
15	Vibration	Insulation Resistance: To satisfy the specified initial value.	Vibrate with amplitude of 1.5mm P-P changing frequencies from 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat for 2 hours each in 3 perpendicular directions. Solder the capacitor on P.C. Board before testing.

2410121447_IHHEC-C1206N220J050T_C2940742.pdf

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