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quality Multilayer Ceramic Chip Capacitor IHHEC C1210X153K102T NPO Dielectric 3.20 by 2.50 Millimeters factory
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quality Multilayer Ceramic Chip Capacitor IHHEC C1210X153K102T NPO Dielectric 3.20 by 2.50 Millimeters factory
>
Specifications
Voltage Rating:
1kV
Capacitance:
15nF
Temperature Coefficient:
X7R
Mfr. Part #:
C1210X153K102T
Package:
1210
Key Attributes
Model Number: C1210X153K102T
Product Description

Product Overview

High-reliability Multilayer Ceramic Chip Capacitors (MLCCs) designed for electric equipment operating at voltages from 1KV to 8KV. These capacitors are compatible with Lead-Free wave and reflow soldering processes, maintaining their electrical characteristics and reliability. Compliant with RoHS standards.

Product Attributes

  • Certifications: RoHS compliant

Technical Specifications

Part Number CodeProductChip Size (mm)Temperature CharacteristicsCapacitance UnitCapacitance ToleranceRated Voltage (Vdc)Tapping Code
C 1206 X 102 K 202 TMultilayer Ceramic Chip Capacitor3.201.60 (.126.063)X7RpFK ( 10.0 %)2000T (Tape & Reel)
C 0603 N 101 J 101 TMultilayer Ceramic Chip Capacitor1.600.80 (.063.031)NPOpFJ ( 5.00 %)100T (Tape & Reel)
C 0805 S 472 M 502 BMultilayer Ceramic Chip Capacitor2.001.25 (.079.049)X6SpFM ( 20.0 %)5000B (Bulk)
C 1210 B 103 K 102 TMultilayer Ceramic Chip Capacitor3.202.50 (.126.098)NPOpFK ( 10.0 %)1000T (Tape & Reel)
C 1812 Z 104 M 802 TMultilayer Ceramic Chip Capacitor4.603.20 (.181.125)Y5VpFM ( 20.0 %)8000T (Tape & Reel)

Performance Specifications

ItemSpecificationTest Condition
Insulation Resistance10,000M or 500/C (Whichever Is Smaller)V500V, Applied 500Vdc; V500V, Applied 500Vdc. Charge Time60sec. Applied less than 50mA current.
CapacitanceClass (NPO/SL): Within Specified Tolerance; Class : Within Specified ToleranceN/A
Q FactorClass (NPO/SL): More Than 30pF: Q 1000; 30pF & Below: Q40020C (C : Capacitance , pF)N/A
TanClass (X7R): 2.5% Max.; (Z5U/Y5U): 4.0% Max.N/A
Withstanding VoltageNo dielectric breakdown or mechanical breakdown200%/150%/120%/100% Rated Voltage (Varies by product, contact sales for details)
Adhesive Strength of Termination0603: 5N ( 0.5 Kgf); 0603: 10N (1.0 Kgf)Pull force applied for 10 1 second.
Resistance to Flexure of SubstrateCapacitance Change: NPO 5.0%; SL 5.0%; X7R 12.5%; Y5U/Z5U 30.0%Bending to 1.0 mm with 1.0 mm/sec.
SolderabilityMore than 90% of terminal surface newly soldered, no metal part comes out or dissolves.Solder Temp: 245 5; Dip Time: 5 0.5 sec.; Immersing Speed: 2510% mm/s; Solder: Lead Free; Flux: Rosin; Preheat: 80~120 for 10~30sec.
Resistance To Soldering HeatCapacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); Class (X7R) Within 10%; (Z5U/Y5U) Within 20%Preheat: 150 10 for 60~120sec.; Dip: Solder Temp. 260 5; Dip Time: 10 1sec.; Immersing Speed: 2510% mm/s; Flux: Rosin. Measure after cooling.
Temperature CycleCapacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); Class (X7R) Within 7.5%; (Z5U/Y5U) Within 20%Five cycles of temperature variations. Measure after cooling.
HumidityCapacitance Change: Class (NPO/SL) Within 5.0% or 0.5pF (whichever is larger); Class (X7R) Within 15%; (Z5U/Y5U) Within 30%Temp: 40 2; RH: 90 ~ 95%RH; Test Time: 500 12/0Hr. Measure after cooling.
High Temperature LoadCapacitance Change: Class (NPO/SL) Within 3.0% or 0.3pF (whichever is larger); Class (X7R) Within 15%; (Z5U/Y5U) Within 30%DC voltage applied for one hour at maximum operation temperature 3. Measure after cooling.

2410121447_IHHEC-C1210X153K102T_C2991910.pdf

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