Product Overview
High-reliability Multilayer Ceramic Chip Capacitors (MLCCs) designed for electric equipment operating at voltages from 1KV to 8KV. These capacitors are compatible with Lead-Free wave and reflow soldering processes, maintaining their electrical characteristics and reliability. Compliant with RoHS standards.
Product Attributes
- Certifications: RoHS compliant
Technical Specifications
| Part Number Code | Product | Chip Size (mm) | Temperature Characteristics | Capacitance Unit | Capacitance Tolerance | Rated Voltage (Vdc) | Tapping Code |
| C 1206 X 102 K 202 T | Multilayer Ceramic Chip Capacitor | 3.201.60 (.126.063) | X7R | pF | K ( 10.0 %) | 2000 | T (Tape & Reel) |
| C 0603 N 101 J 101 T | Multilayer Ceramic Chip Capacitor | 1.600.80 (.063.031) | NPO | pF | J ( 5.00 %) | 100 | T (Tape & Reel) |
| C 0805 S 472 M 502 B | Multilayer Ceramic Chip Capacitor | 2.001.25 (.079.049) | X6S | pF | M ( 20.0 %) | 5000 | B (Bulk) |
| C 1210 B 103 K 102 T | Multilayer Ceramic Chip Capacitor | 3.202.50 (.126.098) | NPO | pF | K ( 10.0 %) | 1000 | T (Tape & Reel) |
| C 1812 Z 104 M 802 T | Multilayer Ceramic Chip Capacitor | 4.603.20 (.181.125) | Y5V | pF | M ( 20.0 %) | 8000 | T (Tape & Reel) |
Performance Specifications
| Item | Specification | Test Condition |
| Insulation Resistance | 10,000M or 500/C (Whichever Is Smaller) | V500V, Applied 500Vdc; V500V, Applied 500Vdc. Charge Time60sec. Applied less than 50mA current. |
| Capacitance | Class (NPO/SL): Within Specified Tolerance; Class : Within Specified Tolerance | N/A |
| Q Factor | Class (NPO/SL): More Than 30pF: Q 1000; 30pF & Below: Q40020C (C : Capacitance , pF) | N/A |
| Tan | Class (X7R): 2.5% Max.; (Z5U/Y5U): 4.0% Max. | N/A |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | 200%/150%/120%/100% Rated Voltage (Varies by product, contact sales for details) |
| Adhesive Strength of Termination | 0603: 5N ( 0.5 Kgf); 0603: 10N (1.0 Kgf) | Pull force applied for 10 1 second. |
| Resistance to Flexure of Substrate | Capacitance Change: NPO 5.0%; SL 5.0%; X7R 12.5%; Y5U/Z5U 30.0% | Bending to 1.0 mm with 1.0 mm/sec. |
| Solderability | More than 90% of terminal surface newly soldered, no metal part comes out or dissolves. | Solder Temp: 245 5; Dip Time: 5 0.5 sec.; Immersing Speed: 2510% mm/s; Solder: Lead Free; Flux: Rosin; Preheat: 80~120 for 10~30sec. |
| Resistance To Soldering Heat | Capacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); Class (X7R) Within 10%; (Z5U/Y5U) Within 20% | Preheat: 150 10 for 60~120sec.; Dip: Solder Temp. 260 5; Dip Time: 10 1sec.; Immersing Speed: 2510% mm/s; Flux: Rosin. Measure after cooling. |
| Temperature Cycle | Capacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); Class (X7R) Within 7.5%; (Z5U/Y5U) Within 20% | Five cycles of temperature variations. Measure after cooling. |
| Humidity | Capacitance Change: Class (NPO/SL) Within 5.0% or 0.5pF (whichever is larger); Class (X7R) Within 15%; (Z5U/Y5U) Within 30% | Temp: 40 2; RH: 90 ~ 95%RH; Test Time: 500 12/0Hr. Measure after cooling. |
| High Temperature Load | Capacitance Change: Class (NPO/SL) Within 3.0% or 0.3pF (whichever is larger); Class (X7R) Within 15%; (Z5U/Y5U) Within 30% | DC voltage applied for one hour at maximum operation temperature 3. Measure after cooling. |
2410121447_IHHEC-C1210X153K102T_C2991910.pdf
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