Product Overview
This specification applies to Multilayer Ceramic Chip Capacitors (MLCC) for use in electric equipment with voltages ranging from 100V to 1.5 KV. These MLCCs support Lead-Free wave and reflow soldering, offering the same electrical characteristics and reliability as previous versions. The product is compliant with RoHS & HF.
Product Attributes
- Brand: IHHEC (a trademark of Holy Stone Enterprise Co., Ltd)
- Product Type: Multilayer Ceramic Chip Capacitor (MLCC)
- Certifications: RoHS & HF compliant
Technical Specifications
| Item | Specification | Test Condition | |
| Nominal Capacitance and Tolerance | Class , X7R, Tolerance K ( 10.0 %) | E-3, E-6 series | |
| E series (Standard Number) | Application Capacitance | E-3: 1.0, 2.2, 4.7 E-6: 1.0, 1.5, 2.2, 3.3, 4.7, 6.8 E-12: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 E-24: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 E-24 (with decimal): 1.1, 1.3, 1.6, 2.0, 2.4, 3.0, 3.6, 4.3, 5.1, 6.2, 7.5, 9.1 | pF |
| Operation Temperature Range | Class , X7R: -55 ~ +125 | Reference Temp: 25 | |
| Storage Condition | Temperature: 5 to 40 Relative Humidity: 20 to 70 % Storage Time: 12 months max. | ||
| Part Number Code Breakdown | (1) Product Code: C (2) Chip Size Code: 0603 (1.60 0.80 mm) (3) Temperature Characteristics Code: X (X7R, -55~+125, 15%) (4) Capacitance unit: pF, Nominal Capacitance: 221 (220.0 pF) (5) Capacitance Tolerance Code: K ( 10.0 % for >10 pF) (6) Rated Voltage Code: 201 (200 Vdc) (7) Tapping Code: T (Tape & Reel) (8) Thickness Code: T (0.85 0.15 mm) (9) Special Code: F | ||
| Dimensions (Type 0603) | L: 1.60 0.10 mm W: 0.80 0.10 mm T: 0.85 0.15 mm B (min): 0.40 mm BW (min): 0.15 mm | ||
| Insulation Resistance | 10,000M min. | V500V, Rated Voltage, Charge Time: 60sec. Applied less than 50mA current. | |
| Capacitance | Within The Specified Tolerance | Class | |
| D.F. (Dissipation Factor) | X7R: 2.5% max. | Class Char. | |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | V500V: 200% Rated Voltage. Voltage ramp up rate500v/sec for 1~5 sec. Charge/discharge Current is less than 50mA. Over 1000Vdc requires immersion in isolation fluid. | |
| Temperature Capacitance Coefficient | X7R: 15% | Class , -55 ~+125 . (C2-C1)/C1 100% | |
| Adhesive Strength of Termination | 0603: 5N ( 0.5 Kgf) | Pull force applied for 10 1 second. | |
| Resistance to Flexure of Substrate | Capacitance Change: 12.5% | Bending applied to 1.0 mm with 1.0 mm/sec. Duration 5 1sec. | |
| Solderability | More than 90% of terminal surface soldered | Solder Temp: 245 5, Dip Time: 5 0.5 sec. Lead Free Solder, Rosin Flux. Preheat: 80~120 for 10~30sec. | |
| Resistance To Soldering Heat | Capacitance Change: Class X7R Within 10% | Solder Temp: 260 5, Dip Time: 10 1 sec. Preheat: 150 10 for 60~120sec. Measure after cooling for 48 4 Hours. | |
| Temperature Cycle | Capacitance Change: Class X7R Within 7.5% | Five cycles of temperature variation. Measure after cooling for 48 4 Hrs. | |
| Humidity | Capacitance Change: Class X7R Within 15% D.F.: X7R: 5.0% max. Insulation Resistance: 1,000M min. | Temp: 40 2, RH: 90 ~ 95%, Test Time: 500 +12/-0Hr. Measure after cooling for 48 4Hrs. | |
| High Temperature Load (Life Test) | Capacitance Change: Class X7R Within 15% D.F.: X7R: 5.0% max. Insulation Resistance: 1,000M min. | Applied Voltage: 150%Rated Voltage. Test Time: 1000 +12/-0Hr. Current Applied: 50 mA Max. Measure after cooling for 48 4 Hours. | |
| Vibration | Capacitance Change: Class X7R Within 7.5% | Amplitude 1.5mm P-P, 10Hz to 55Hz and back to 10Hz in 1 min. Repeat for 2 hours each in 3 perpendicular directions. | |
| Packing Quantity (pcs/Reel) | Paper Tape: 4,000 (for 0603/0805, T1.00mm) Plastic Tape: 3,000 (for 1206, 1.00mmT1.25mm) | ||
| Cover Tape Reel Off Force | 5 gf Peel-Off Force 70 gf |
2410121637_IHHEC-C0603X221K201TBF_C2991902.pdf
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