Product Overview
The HVC-019-2005 series Multilayer Ceramic Chip Capacitors (MLCC) are designed for electric equipment operating at voltages ranging from 1.5KV to 5KV. These MLCCs support Lead-Free wave and reflow soldering, maintaining their electrical characteristics and reliability. The product is compliant with RoHS & HF standards.
Product Attributes
- Brand: IHHEC (a trademark of Holy Stone Enterprise Co., Ltd)
- Certifications: RoHS & HF compliant
Technical Specifications
| Item | Specification | Test Condition |
| Visual | No abnormal exterior appearance | Visual inspection |
| Dimension | See Page 2 | Visual inspection |
| Insulation Resistance | 10,000Mmin. | V500V, Applied 500Vdc Charge Time60sec. Is applied less than 50mA current. |
| Capacitance | Within The Specified Tolerance | Class |
| D.F. | X7R: 2.5% max. | Class Char. Maximum |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | 1000V :120% Rated Voltage Voltage ramp up rate500v/sec for 1~5 sec. charge/discharge Current is less than 50mA. Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arcing on the chip surface, at voltage over 1000Vdc. |
| Temperature Capacitance Coefficient | 15% | Class : X7R -55 ~+125 C1:Capacitance at standard temperature(25 ) C2: Capacitance at test temperature (T2) (C2-C1)/C1 100% |
| Adhesive Strength of Termination | 0603----5N( 0.5 Kgf) 0603----10N(1.0 Kgf) | Pull force shall be applied for 10 1 second. |
| Resistance to Flexure of Substrate | No mechanical damage shall be occur. | Bending shall be applied to the 1.0 mm with 1.0 mm/sec. The duration of the applied forces shall be 5 1sec |
| Solderability | More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve . | Solder Temperature : 245 5 Dip Time : 5 0.5 sec. Immersing Speed : 2510% mm/s Solder : Lead Free Solder Flux :Rosin Preheat : At 80~120 for 10~30sec. |
| Resistance To Soldering Heat | Cap. Change Class X7R Within 10% D.F. Class To satisfy the specified initial value Insulation Resistance To satisfy the specified initial value Withstand Voltage To satisfy the specified initial value | Preheat : At 150 10 For 60~120sec. Dip : Solder Temperature of 260 5 Dip Time : 10 1sec. Immersing Speed : 2510% mm/s Flux :Rosin Measure at room temperature after cooling for Class: 48 4 Hours |
| Temperature Cycle | Cap. Change Class X7R Within 7.5% D.F. Class To satisfy the specified initial value Insulation Resistance To satisfy the specified initial value | Capacitor shall be subjected to five cycles of the temperature cycle as following: Measure at room temperature after cooling for Class :48 4 Hrs Solder the capacitor on P.C. board shown in Fig 2. before testing. |
| Humidity | Cap. Change Class X7R Within 15% D.F. Class Char. Maximum X7R: 5.0% max. Insulation Resistance 1,000Mmin. | Temperature : 40 2 Relative Humidity : 90 ~ 95%RH Test Time : 500 +12/-0Hr Measure at room temperature after cooling for Class : 48 4Hrs Solder the capacitor on P.C. board shown in Fig 2. before testing. |
| High Temperature Load | Cap. Change Class X7R Within 15% D.F. Class Char. maximum X7R: 5.0% max. Insulation Resistance 1,000Mmin. | Class capacitors applied DC voltage (following table) is applied for one hour at maximum operation temperature 3 then shall be set for 484 hours at room temperature and the initial measurement shall be conducted. Voltage Conditioning : 100% Rated Voltage meet MIL-PRF-49467(Group A/B) Current Applied : 50 mA Max. Measure at room temperature after cooling for Class: 48 4 Hours |
| Vibration | Cap. Change Class X7R Within 7.5% D.F. Class To satisfy the specified initial value Insulation Resistance To satisfy the specified initial value | Solder the capacitor on P.C. Board shown in Fig 2. before testing. Vibrate the capacitor with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat this for 2 hours each in 3perpendicular directions. |
Part Number Code Example
C 1812 X 103 K 202 T
| (1) | (2) | (3) | (4) | (5) | (6) | (7) |
| Product Code | Chip Size Code | Temperature Characteristics Code | Capacitance unit | Capacitance Tolerance Code | Rated Voltage Code | Tapping Code |
| C | 1812 (4.60 3.20 (.181 .125)) | X (X7R, -55~+125, 15%) | 103 (10,000.0 pF) | K ( 10.0 %) | 202 (2,000 Vdc) | T (Tape & Reel) |
Dimensions
| TYPE | L | W | T | B (min) | BW (min) |
| 1812 | 4.60 0.30 | 3.20 0.30 | 2.00 0.20 | 2.50 | 0.30 |
Packing
Refer to Page 7 for detailed packing information including bulk and tape packing quantities for various chip sizes and tape materials.
2410121653_IHHEC-C1812X103K202TFP_C2940748.pdf
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