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Specifications
Voltage Rating:
50V
Capacitance:
100nF
Temperature Coefficient:
U2J
Tolerance:
±5%
Mfr. Part #:
C1206U104J050T
Package:
1206
Key Attributes
Model Number:
C1206U104J050T
Product Description
Product Overview
This specification applies to Multilayer Ceramic Chip Capacitors (MLCCs) designed for electric equipment with voltage ratings from 4V to 50V. These capacitors are suitable for general electric circuits, telecommunications, personal computers and peripherals, power circuits, and mobile applications. The product is compliant with RoHS and HF standards.
Product Attributes
- Brand: NCC
- Certifications: RoHS, HF
Technical Specifications
| Item | Specification | Test Condition |
| Scope | MLCC for use in electric equipment, voltage ranging from 4V to 50V. Suitable for general electrics circuit, telecommunications, personal computers and peripheral, power circuit and mobile application. (RoHS & HF compliant.) | |
| Nominal Capacitance and Tolerance | U2J Characteristic: J ( 5.00 %) E-12, E-24 series | |
| Standard Capacitance Values (E-series) | E-3: 1.0, 2.2, 4.7 pF E-6: 1.0, 1.5, 2.2, 3.3, 4.7, 6.8 pF E-12: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 pF E-24: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2, 1.1, 1.3, 1.6, 2.0, 2.4, 3.0, 3.6, 4.3, 5.1, 6.2, 7.5, 9.1 pF | |
| Operation Temperature Range | U2J: -55 ~ +125 | Reference Temp: 25 |
| Storage Condition | Temperature: 5 to 40 Relative Humidity: 20 to 70 % Storage Time: 12 months max. | |
| Rated Voltage Code | 050: 50 Vdc | |
| Part Number Code Example | 050 T (1) (2) (3) (4) (5) (6) (7) | |
| Product Code | C: Multilayer Ceramic Chip Capacitor | |
| Chip Size Code | 1206: 3.20 1.60 mm (.126 .063 inch) | |
| Temperature Characteristics Code | U: U2J, -55~+125, -750+120/-347ppm/ or -750120 ppm/ | |
| Capacitance Unit | Code 104: 100,000.0 pF | (If there is a decimal point, it shall be expressed by an English capital letter R) |
| Capacitance Tolerance Code | J: 5.00 % (More Than 10 pF) | |
| Tapping Code | T: Tape & Reel | |
| Dimensions (Type 1206) | L: 3.200.30 mm W: 1.600.20 mm T: 1.600.20 mm B (min): 1.50 mm BW (min): 0.30 mm | |
| Insulation Resistance | 500 MpF min. | Applied Voltage: Rated Voltage, Charge Time: 605 sec. Charge-Discharge current shall be less than 50mA. |
| Q Factor (U2J) | 1000 (More than 30pF) | Frequency: 1KHz10%, Voltage: 1.00.2Vrms |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | 250% of the rated voltage for 1~5 sec. charge/discharge Current is less than 50mA. |
| Temperature Capacitance Coefficient (U2J) | -55 ~ +25: -750+120/-347ppm/ +25 ~ +125: -750120ppm/ | T1: Standard Temperature(25) T2: Test Temperature C1: Capacitance At Standard Temperature(25) C2: Capacitance At Test Temperature (T2) 0.2Vrms shall be applied. |
| Adhesive Strength Of Termination | No indication of peeling shall occur on the terminal electrode. | Pull force shall be applied for 101 second. 0603: 10N(1.0 Kgf) |
| Resistance to Flexure of Substrate (U2J) | Cap. Change 5.0% | The board shall be bend 1.0mm with a rate of 1.0 mm/sec. |
| Solderability | More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve. | Solder Temperature: 2455, Dip Time: 50.5sec, Immersing Speed: 2510% mm/s, Solder: Lead Free, Flux: Rosin, Preheat: 80~120 for 10~30sec. |
| Resistance To Soldering Heat (U2J) | Capacitance Change 2.5%, Q: To satisfy the specified initial value, Insulation Resistance: To satisfy the specified initial value | Preheat: 15010 for 60~120sec. Dip: 2605, Dip Time: 101sec. Immersing Speed: 2510% mm/s, Flux: Rosin. Measure after cooling for 242 Hours. |
| Temperature Cycle (U2J) | Capacitance Change 2.5%, Q: To satisfy the specified initial value, Insulation Resistance: To satisfy the specified initial value | Five cycles: Step 1: Min Rated Temp. +0/-3 (30 min), Step 2: 25 (3 min), Step 3: Max Rated Temp. +3/-0 (30 min), Step 4: 25 (3 min). Measure after cooling for 242 Hours. |
| Humidity (U2J) | Cap. Change 5.0%, Insulation Resistance 50 MpF min. | Temperature: 402, Relative Humidity: 90~95%RH, Test Time: 500 +12/-0Hr. Measure after cooling for 242 Hours. |
| Humidity Load (U2J) | Cap. Change: Within 7.5% or 0.75pF whichever is larger of initial value, Q: 350 (30pF & Over), Insulation Resistance 25 MpF min. | Applied Voltage: Rated Voltage, Temperature: 402, Relative Humidity: 90~95%RH, Test Time: 500 +12/-0Hr, Current Applied: 50 mA Max. Measure after cooling for 242 Hours. |
| High Temperature Load (Life Test) (U2J) | Cap. Change: Within 5.0% or 0.5pF whichever is larger of initial value, Q: 350 (30pF & Over), Insulation Resistance 50 MpF min. | Applied Voltage: Rated Voltage, Temperature: Max. operation temperature 3, Test Time: 1000 +48/-0 Hr, Current Applied: 50mA Max. Measure after cooling for 242 Hours. |
| Vibration (U2J) | Capacitance: Within the specified tolerance, Q: To satisfy the specified initial value, Insulation Resistance: To satisfy the specified initial value | Solder capacitor on P.C. board. Vibrate with amplitude of 1.5mm P-P from 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat for 2 hours each in 3 perpendicular directions. |
| Packing (Tape Packing) | Material: Paper or Plastic, Quantity varies by chip size and tape thickness. | See Page 7 for details. |
| Cover Tape Reel Off Force | Peel-Off Force: 5 gf to 70 gf | Measure Method: Empty Section 20mm min., Chip Section 40mm min., Drawing Direction 165 to 180. |
2410121500_IHHEC-C1206U104J050T_C158070.pdf
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