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Specifications
Voltage Rating:
450V
Capacitance:
220nF
Temperature Coefficient:
-
Tolerance:
±10%
Mfr. Part #:
C1210P224K451TFF
Package:
1210
Key Attributes
Model Number:
C1210P224K451TFF
Product Description
Multilayer Ceramic Chip Capacitors (MLCC) HVC-016-1705
This specification applies to Multilayer Ceramic Chip Capacitors (MLCC) designed for high-voltage applications in electric equipment. The X7P product offering is ideally suited for LED driver, lighting, power, adapter, and USB charge applications where maintaining effective capacitance at working voltage is critical for circuit design. This product is compliant with RoHS & HF.
Product Attributes
- Certifications: RoHS & HF compliant
Technical Specifications
| Item | Specification | Test Condition |
| Scope | Multilayer Ceramic Chip Capacitor (MLCC) for high voltage applications | - |
| Class Characteristic | X7P | - |
| Tolerance | K ( 10.0 %) | - |
| Nominal Capacitance (E-series) | E-3: 1.0, 2.2, 4.7 pF E-6: 1.0, 1.5, 2.2, 3.3, 4.7, 6.8 pF E-12: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 pF E-24: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 pF | - |
| Operation Temperature Range | -55 ~ +125 | Reference Temp: 25 |
| Storage Condition | Temperature: 5 to 40 Relative Humidity: 20 to 70 % Storage Time: 12 months max. | - |
| Part Number Code Example: C1210P224K451T | (1) Product Code: C (MLCC) (2) Chip Size Code: 1210 (3.20 2.50 mm) (3) Temperature Characteristics Code: P (X7P, -55~+125, 10%) (4) Capacitance: 224 (220,000.0 pF) (5) Capacitance Tolerance Code: K ( 10.0 %) (6) Rated Voltage Code: 451 (450 Vdc) (7) Tapping Code: T (Tape & Reel) (8) Thickness Code: F (2.000.30 mm) (9) Special Code: F | - |
| Dimensions (Type 1210) | L: 3.20 0.30 mm W: 2.50 0.20 mm T: 2.00 0.30 mm B (min): 1.60 mm BW (min): 0.30 mm | - |
| Insulation Resistance | 500/C min. | V500V, Rated Voltage, Charge Time: 60sec. |
| Capacitance | Within the specified tolerance | Class |
| Tan (X7P) | 2.5% max. | Class Char. |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | V500V: 200% Rated Voltage for 1~5 sec. |
| Temperature Capacitance Coefficient (X7P) | 10% | Class , -55 ~ +125 |
| Adhesive Strength of Termination | >0603: 10N (1.0 Kgf) | Pull force applied for 10 1 sec. |
| Resistance to Flexure of Substrate | Capacitance Change: X7P 12.5% | Bending to 1.0 mm at 1.0 mm/sec. |
| Solderability | More than 90% of terminal surface soldered | Solder Temp: 245 5, Dip Time: 5 0.5 sec. |
| Resistance To Soldering Heat | Capacitance Change: X7P Within 10% Tan : Satisfy initial value Insulation Resistance: Satisfy initial value Withstand Voltage: Satisfy initial value | Preheat: 150 10 for 60~120sec. Dip: 260 5, Dip Time: 10 1sec. |
| Temperature Cycle | Capacitance Change: X7P Within 7.5% Tan : Satisfy initial value Insulation Resistance: Satisfy initial value | Five cycles of temperature variation. |
| Humidity | Capacitance Change: X7P Within 15% Tan : X7P 5.0% max. Insulation Resistance: 50/C min. | 40 2, 90 ~ 95%RH, 500 +12/-0Hr |
| High Temperature Load (Life Test) | Capacitance Change: X7P Within 15% Tan : X7P 5.0% max. Insulation Resistance: 50/C min. | 100% Rated Voltage, 1000 +12/-0Hr |
| Vibration | Capacitance Change: X7P Within 7.5% Tan : Satisfy initial value Insulation Resistance: Satisfy initial value | Amplitude 1.5mm P-P, 10Hz to 55Hz and back to 10Hz. |
2410121502_IHHEC-C1210P224K451TFF_C340320.pdf
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