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Specifications
Voltage Rating:
1kV
Capacitance:
2.2nF
Temperature Coefficient:
NP0
Tolerance:
±5%
Mfr. Part #:
C1206N222J102TDF
Package:
1206
Key Attributes
Model Number:
C1206N222J102TDF
Product Description
Product Overview
The HVC-023-2202 is a Multilayer Ceramic Chip Capacitor (MLCC) designed for electric equipment operating at voltages ranging from 100V to 1.5 KV. It supports Lead-Free wave and reflow soldering, maintaining electrical characteristics and reliability. This product is compliant with RoHS & HF standards.
Product Attributes
- Brand: IHHEC (a trademark of Holy Stone Enterprise Co., Ltd)
- Product Type: Multilayer Ceramic Chip Capacitor (MLCC)
- Certifications: RoHS & HF compliant
Technical Specifications
| Part Number Code Example | Product Code | Chip Size Code (L x W mm) | Thickness Code (T mm) | Temperature Characteristics Code | Nominal Capacitance (pF) | Capacitance Tolerance Code | Rated Voltage Code (Vdc) | Tapping Code |
|---|---|---|---|---|---|---|---|---|
| C 1206 N 222 J 102 T | C | 1206 (3.20 x 1.60) | 1.25 0.20 | N (NPO) | 2200.0 | J ( 5.00 %) | 102 (1000) | T (Tape & Reel) |
| Item | Specification | Test Condition |
|---|---|---|
| Visual | No abnormal exterior appearance | Visual inspection |
| Dimension | See Page 2 | Visual inspection |
| Insulation Resistance | 10,000Mmin. | V500V, Applied 500Vdc, Charge Time60sec. |
| Capacitance | Class NPO Within The Specified Tolerance | |
| Q Factor | More Than 30pF : Q 1000 | Class NPO |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | 1000V :120% Rated Voltage, Voltage ramp up rate500v/sec for 1~5 sec. |
| Temperature Capacitance Coefficient | 30 ppm/ | Class : NPO, -55~+125 |
| Adhesive Strength of Termination | 0603----5N( 0.5 Kgf), 0603----10N(1.0 Kgf) | Pull force shall be applied for 10 1 second. |
| Resistance to Flexure of Substrate | No mechanical damage shall occur. | Bending shall be applied to the 1.0 mm with 1.0 mm/sec. Duration: 5 1sec |
| Capacitance Change (Flexure) | NPO 5.0% | Class |
| Solderability | More than 90% of the terminal surface is to be soldered newly | Solder Temp: 2455, Dip Time: 50.5 sec. |
| Resistance To Soldering Heat | No mechanical damage shall occur. | Preheat: 15010 for 60~120sec. Dip: 2605 for 101 sec. |
| Capacitance Change (Soldering Heat) | Class (NPO) Within 2.5% or 0.25pF whichever is larger of initial value | |
| Temperature Cycle | No mechanical damage shall occur. | Subjected to five cycles. |
| Capacitance Change (Temp. Cycle) | Class (NPO) Within 2.5% or 0.25pF whichever is larger of initial value | |
| Humidity | No mechanical damage shall occur. | 402, 90~95%RH, 500+12/-0Hr |
| Capacitance Change (Humidity) | Class (NPO) Within 5.0% or 0.5pF whichever is larger of initial value | |
| Insulation Resistance (Humidity) | 1,000Mmin. | |
| High Temperature Load (Life Test) | No mechanical damage shall occur. | 100% Rated Voltage, 1000+12/-0Hr |
| Capacitance Change (Life Test) | Class (NPO) Within 3.0% or 0.3pF whichever is larger | |
| Insulation Resistance (Life Test) | 1,000Mmin. | |
| Vibration | No mechanical damage shall occur. | Amplitude 1.5mm P-P, 10Hz to 55Hz, 2 hours each in 3 perpendicular directions. |
| Capacitance Change (Vibration) | Class (NPO) Within 2.5% or 0.25pF whichever is larger | |
| Insulation Resistance (Vibration) | To satisfy the specified initial value |
2410121638_IHHEC-C1206N222J102TDF_C4355181.pdf
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